Designer Entropy Enables High Thermoelectric Power and Efficiency
Interdisciplinary Materials, EarlyView.Designer Entropy enables targeted control of defect and transport behavior in SnTe‐based alloys, allowing efficiency and power to be independently optimized. Radius‐matched Sb doping preserves carrier mobility and delivers superior power output, while Bi‐induced disorder suppresses mobility despite comparable efficiency.
Yihua Zhang +15 more
wiley +1 more source
The durability of solder joints under thermo-mechanical loading; application to Sn-37Pb and Sn-3.8Ag-0.7Cu lead-free replacement alloy [PDF]
, 2015 Solder joints in electronic packages provide mechanical, electrical and thermal connections. Hence, their reliability is also a major concern to the electronic packaging industry. Ball Grid Arrays (BGAs) are a very common type of surface mount technology
Ghaleeh, Mohammad
core
Thermomechanical modelling of microstructure evolution in solder alloys [PDF]
, 2005 The reliability of soldered connections is a very important issue in electronics industry. This project aims to better understand the various factors influencing the lifetimeof solder joints through numerical modelling.
Ubachs, R.L.J.M.
core +2 more sources
Recent Developments in Sustainable Composites for Printed Circuit Boards (PCBs): A Review
Macromolecular Materials and Engineering, EarlyView.This review presents the potential of using natural plant fibers and biodegradable polymers as sustainable printed circuit boards (PCBs). This review provides future directions in innovation and sustainable PCBs development. Bio‐composites PCBs are both environmentally friendly and sustainable due to the natural fibres they contain.
Erdem Selver +7 more
wiley +1 more source
Harsh-Environment Packaging for Downhole Gas and Oil Exploration [PDF]
, 2007 This research into new packaging materials and methods for elevated temperatures and harsh environment electronics focused on gaining a basic understanding of current state-of-the-art in electronics packaging used in industry today, formulating the ...
Bansal, Shubhra +7 more
core +1 more source
3D Polymeric Nanonetworks: From Self‐Assembly to Advanced Fabrication
Macromolecular Materials and Engineering, EarlyView.This review provides the first systematic cross‐method comparison of fabrication techniques for 3D polymeric nanonetworks. It evaluates five key strategies—block copolymer self‐assembly, hyper‐crosslinking, template‐assisted methods, 3D printing, and nanolithography—across critical metrics including resolution, throughput, scalability, and material ...
Carlos G. Cobos +2 more
wiley +1 more source
Progress in Photovoltaics: Research and Applications, EarlyView.This study investigates high‐mobility, low carrier concentration (CC) transparent conducting oxides (TCOs) as back contacts in bifacial Cu (In, Ga)Se2 (CIGS) solar cells. These TCOs enhance rear‐side light absorption in CIGS and external quantum efficiency, improving overall performance by offering high transparency, low reflectance, and maintaining ...
Nisika Nisika +6 more
wiley +1 more source
An investigation into nano-particulates reinforced SAC305-based composite solders under electro- and thermo-migration conditions [PDF]
, 2017 With the rapid development in electronic packaging due to product miniaturisation, the size of solder joints is decreasing considerably, thus the failure of solder interconnects induced by electro-migration (EM) and thermo-migration (TM) became a ...
Guang Chen (25155)
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Quantitative analysis of facet growth during directional solidification of salol
Acta Crystallographica Section B, EarlyView.This study offers a comprehensive analysis of facet growth during directional solidification of salol, focusing on the dynamic evolution of the solid–liquid interface. A novel strategy was developed to identify the crystallographic nature of the observed facets, whose growth is mainly governed by two‐dimensional nucleation, with deviations attributed ...
Anassya Raad +3 more
wiley +1 more source
Electrodeposition and characterisation of nickel-niobium-based diffusion barrier metallisations for high temperature electronics interconnections [PDF]
, 2016 The control of interfacial microstructural stability is of utmost importance to the reliability of liquid solder interconnects in high temperature electronic assemblies.
Jing Wang (6206297)
core