Advanced Materials Interfaces, Volume 13, Issue 5, 4 March 2026.ABSTRACT Electronic correlations and chemical disorder play a pivotal role in the emerging class of perovskite transparent conducting oxides (TCOs). These materials exhibit charge carrier densities typical of metals, yet achieve optical transparency through the enhanced effective mass, which shifts the plasma frequency beyond the visible range. In this
Martando Rath +14 more
wiley +1 more source
Extreme Environment Reliability of Components for Computing with SAC305 and Alternative High Reliability Solders [PDF]
, 2016 The semiconductor and packaging industries have been moving away from the use of Lead (Pb) due to the increasing awareness of the health and safety concerns surrounding its use.
Sanders, Thomas
core
Advanced Optical Materials, Volume 14, Issue 10, 13 March 2026.A solar spectral‐splitting photovoltaic–thermal collector integrating a hybrid liquid‐solid optical filter is experimentally demonstrated. Selective optical filtering enables thermal–electrical decoupling, achieving elevated fluid temperatures while maintaining reduced PV operating temperatures.
Botho Lehmann +2 more
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National Educators' Workshop: Update 1991. Standard Experiments in Engineering Materials Science and Technology [PDF]
Given here is a collection of experiments presented and demonstrated at the National Educators' Workshop: Update 91, held at the Oak Ridge National Laboratory on November 12-14, 1991.
Gardner, James E. +2 more
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A Constitutive Model for Lead Free Solder Including Aging Effects and Its Application to Microelectronic Packaging [PDF]
, 2013 The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments.
Motalab, Mohammad A.
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Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics
Advanced Science, Volume 13, Issue 17, 23 March 2026.This review surveys emerging materials for thermal management in advanced electronic packaging, with emphasis on ceramic substrates and thermal interface materials. Multiscale simulations and mechanistic analyses are highlighted, alongside the emerging role of artificial intelligence in predicting thermal properties and guiding design, offering ...
Yongjun Huo +11 more
wiley +1 more source
A Micromechanical Analysis to the Viscoplastic Behavior of Sintered Silver Joints under Shear Loading. [PDF]
Materials (Basel), 2023 Ma K +6 more
europepmc +1 more source
Effects of Aging on the Cyclic Stress Strain and Fatigue Behaviors of Lead-free Solders [PDF]
, 2014 The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments.
Mustafa, Muhannad
core
Solder‐free room‐temperature multichannel integration for soft hybrid electronics
InfoMat, Volume 8, Issue 3, March 2026.A room‐temperature direct interconnection (RTDI) technique enables solder‐free, stretchable bonding of multichannel soft–rigid interfaces via hydrogen bonding and molecular entanglement. It achieves 24.7× stronger mechanical bonding than conventional methods and maintains resistance variation within one order of magnitude at 110% strain.
Junchang Wang +13 more
wiley +1 more source
Application of ZnO Nanoparticles in Sn99Ag0.3Cu0.7-Based Composite Solder Alloys. [PDF]
Nanomaterials (Basel), 2021 Skwarek A +8 more
europepmc +1 more source