Results 191 to 200 of about 2,906 (237)

Tailoring the Mechanical Properties of Al_0.4CrFe₂Ni₂ Medium-Entropy Alloy via Thermomechanical Processing. [PDF]

Materials (Basel)
Kočiško R, Petroušek P, Milkovič O, Diko P, Girman V, Sütőová A, Duchek M, Zemko M.   +7 more
europepmc   +1 more source

Cryo-SEM Investigation of Chlorella Using Filter Paper as Substrate. [PDF]

Bio Protoc
Wan P, Tao M, Zhou Y, Han W, Wang J, Wang J.   +5 more
europepmc   +1 more source

Solvation chemistry tailored via dielectric constant engineering for stable low-temperature aqueous zinc batteries. [PDF]

Nat Commun
Zhu X, Wang Z, Zhang T, Zhang J, Ge A, Cao Y, Gao R, Yu Z, Wang Y, Xu S, Law HM, Wang F, Ciucci F, Xu G, Zhu M.   +14 more
europepmc   +1 more source

Surface Microstructure Enhanced Cryogenic Infrared Light Emitting Diodes for Semiconductor Broadband Upconversion. [PDF]

Nanomaterials (Basel)
Bai P, Wang H, Lv R, Wang Y, Li Y, Han S, Cai J, Yang N, Chu W, Xie Y, Chen M, Wang Y, Zhao Z.   +12 more
europepmc   +1 more source

Enhanced Sensing Enabled by Multi-Resonant QBIC-EIT and SP-BIC in Pyramidal LiNbO₃ Metasurfaces. [PDF]

Sensors (Basel)
Zhong C, Zou W, Lei J, Shen Y, Chen J, Hong L, Guo T.   +6 more
europepmc   +1 more source

Beyond Titanium Carbide: The Promise of Vanadium-Based MXenes for Aqueous Supercapacitors. [PDF]

Molecules
Tan J, Tang Y, Bi Z, Dong G, Liu M, Yang C.   +5 more
europepmc   +1 more source

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Cryogenic etching of deep narrow trenches in silicon

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, 2000
Deep and narrow anisotropic etching of silicon structures has been investigated in a low-pressure high density plasma reactor working with a cryogenic chuck. We have previously demonstrated the feasibility of this technique on such structures. Improvement of etch rate and profiles has been studied and new results show 2 μm wide trenches etched to a ...
P Ranson, Ranson P
exaly   +2 more sources

Numerical study of aperture shape effects in deep cryogenic etching of silicon

International Conference on Micro- and Nano-Electronics 2021, 2022
Cryogenic etching of silicon in SF6/O2 plasma is the process of choice for fabrication of deep high aspect ratio structures with strict requirements for the sidewall angle, surface roughness and contamination, including MEMS, X-ray optics, and supercapacitors.
A V Miakonkikh, V F Lukichev, M Rudenko
exaly   +2 more sources

Cryogenic etching of silicon compounds using a CHF3 based plasma

Journal of Applied Physics, 2023
Cryogenic etching of a-Si, SiO2, and Si3N4 materials by CHF3/Ar inductively coupled plasma is investigated in a range of temperature from −140 to +20 °C. Samples of the three different materials are placed together on the same silicon carrier wafer. Depending on the experimental conditions, etching or deposition regimes were obtained on the samples ...
R. Dussart, R. Ettouri, J. Nos, G. Antoun, T. Tillocher, P. Lefaucheux   +5 more
openaire   +2 more sources

HARDWARE DESIGN FOR CRYOGENIC ETCHING EQUIPMENT

Heat Transfer Research, 2021
Dong-Hyeok Im, Sang Jeen Hong
exaly   +2 more sources