Results 11 to 20 of about 91,789 (247)

Non-destructive testing of interfacial stiffness based on spring model for diffusion bonding interface of titanium alloy components with complex surface [PDF]

Scientific Reports, 2023
Ultrasonic testing is an important non-destructive testing method, which is sensitive to the defects in the diffusion bonding interface. Ultrasonic testing of diffusion bonding interfaces in complex-surface components is a challenge due to the geometry ...
Gongpeng Yang, Zhenggan Zhou, Tengfei Ma, Lichen Teng, Jun Wang, Yuxuan Zhou, Yang Li, Wenbin Zhou   +7 more
doaj   +2 more sources

A Method for Prediction of Ultrasonic Detectability of Interface Gap Defects on TC4 Diffusion-Bonded Joints

Nanomaterials, 2022
An analysis method for the detectability of defects on the TC4 (Ti-6Al-4V) diffusion bonding interface was proposed in this study. First, a semi-analytical model of the liquid–solid coupling acoustic field with attenuation characteristics was constructed.
Lichen Teng, Zhenggan Zhou
doaj   +1 more source

A kinetic model of copper-to-copper direct bonding under thermal compression

Journal of Materials Research and Technology, 2021
A surface creep model is presented for analyzing Cu-to-Cu direct bonding under thermal compression. The driving force is a pressure gradient, which squeezes layers of atoms to fill voids at the bonding interface.
Kai-Cheng Shie, A.M. Gusak, K.N. Tu, Chih Chen   +3 more
doaj   +1 more source

Influence of High Magnetic Field-Thermal Coupling Processing on Diffusion Bonding Properties and Element Diffusion of 1420 Al-Li Alloy

Crystals, 2022
The high uniform magnetic field combined with pre-deformation and vacuum heat treatment processing is designed for improving the diffusion bonding properties of the 1420 Al-Li alloy.
Huang Zhang, Tao Niu, Yaoming Li, Meini Yuan   +3 more
doaj   +1 more source

Impulse Pressure-Assisted Diffusion Bonding (IPADB): Review and Outlook

Metals, 2021
Diffusion bonding is a solid-state welding technique used to join similar and dissimilar materials. Relatively long processing times, usually in the order of several hours as well as fine polished surfaces make it challenging to integrate diffusion ...
Abdulaziz AlHazaa, Nils Haneklaus, Zeyad Almutairi   +2 more
doaj   +1 more source

Microstructure and failure mechanism of FGH96 solid-state diffusion bonding interface

Fenmo yejin jishu, 2021
The microstructure on the solid-state diffusion bonding interfaces of the initially as-forged, as-solution, and sub-aging FGH96 was characterized, the tensile properties of the bonding interfaces were tested, and the failure behavior was studied.
YANG Jie, LIU Guang-xu, ZHANG Jing, WANG Wen-ying, WANG Xiao-feng, ZOU Jin-wen   +5 more
doaj   +1 more source

Evaluation of electrically-assisted vacuum diffusion bonding of a TiBw/TA15 composite by microstructural analysis and mechanical testing

Journal of Materials Research and Technology, 2023
Electrically-assisted diffusion bonding (EADB) of a TiBw/TA15 composite with a novel network architecture was studied under a vacuum degree of 3 × 10−3 Pa in this work.
Xunhu Xu, Qingxin Kang, Guofeng Wang, Yongkang Liu, Zhenlun Li, Tongxu Zhou   +5 more
doaj   +1 more source

Prediction of Tensile Strength and Deformation of Diffusion Bonding Joint for Inconel 718 Using Deep Neural Network

Metals, 2020
Due to the acceptable high-temperature deformation resistance of Inconel 718, its welding parameters such as bonding temperature and pressure are inevitably higher than those of general metals. As a result of the existing punitive processing environment,
Han Mei, Lihui Lang, Xiaoxing Li, Hasnain Ali Mirza, Xiaoguang Yang   +4 more
doaj   +1 more source

Impact of crystalline orientation on Cu–Cu solid-state bonding behavior by molecular dynamics simulations

Scientific Reports, 2023
High-density electronics are hindered by the constraints of Sn-based solder joints, necessitating the exploration of Cu–Cu solid-state bonding. However, current bonding methods are expensive and time-consuming; therefore, understanding the Cu–Cu bonding ...
Hiroaki Tatsumi, C. R. Kao, Hiroshi Nishikawa   +2 more
doaj   +1 more source

Ultrasonic-assisted liquid phase diffusion bonding of Al alloys under low temperature and pressure for high-temperature resistance applications

Materials & Design, 2023
A joint obtained at relatively low temperatures and serving under high temperatures has been a longstanding goal for aluminum alloy heat sinks used in extreme environments.
Pu Zhao, Zhengwei Li, Yuanhang Xia, Zhiwu Xu, Xuesong Leng, Jiuchun Yan   +5 more
doaj   +1 more source