3D stacked IGZO 2T0C DRAM array with multibit capability for computing in memory applications. [PDF]
Li Q, Hu Q, Zhu S, Zeng M, Zhao W, Wu Y.
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Binary-Weighted Neural Networks Using FeRAM Array for Low-Power AI Computing. [PDF]
Cho SM +5 more
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Assessing Design Space for the Device-Circuit Codesign of Nonvolatile Memory-Based Compute-in-Memory Accelerators. [PDF]
Lele AS, Zhang B, Khwa WS, Chang MF.
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Near-field terahertz time-domain spectroscopy for in-line electrical metrology of semiconductor integration processes for memory. [PDF]
Jun S +15 more
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Si-doped CsSrI<sub>3</sub> perovskites as potential dielectrics in MIM capacitors: recent advances, limitations and prospects. [PDF]
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Electronic Chip Package and Co-Packaged Optics (CPO) Technology for Modern AI Era: A Review. [PDF]
Chen G, Wang G, Wang Z, Wang L.
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Advances in waveguide to waveguide couplers for 3D integrated photonic packaging. [PDF]
Weninger D +4 more
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A computationally efficient pulse compression method of Barker-coded excitation using a mismatched filter in medical ultrasound imaging. [PDF]
Han M, Choi HJ, Yoon C.
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A Cross-Process Signal Integrity Analysis (CPSIA) Method and Design Optimization for Wafer-on-Wafer Stacked DRAM. [PDF]
Jiang X +8 more
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Ultra-Precise Dispensing for Rapid and Flexible Through-Silicon Via Filling. [PDF]
Szczotka N +5 more
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