Results 11 to 20 of about 1,014,878 (298)

Dry etching and sputtering [PDF]

Philosophical Transactions of the Royal Society of London. Series A: Mathematical, Physical and Engineering Sciences, 2003
Dry etching is an important process for micro- and nanofabrication. Sputtering effects can arise in two contexts within a dry-etch process. Incoming ions cause removal of volatile products that arise from the interaction between the dry-etch plasma and the surface to be etched.
Wilkinson, C.D.W., Rahman, M.
core   +6 more sources

Dry Etching [PDF]

, 2012
Production of large-area flat panel displays (FPDs) involves several pattern transfer and device fabrication steps that can be performed with dry etching technologies.
Eugen Stamate, Geun Young Yeom
core   +3 more sources

Gate recess engineering of pseudomorphic In0.30GaAs/GaAs HEMTs [PDF]

, 1996
The authors report how the performance of 0.12 μm GaAs pHEMTs is improved by controlling both the gate recess width, using selective dry etching, and the gate position in the source drain gap, using electron beam lithography.
Taylor, M.R.S., Holland, M.C., Beaumont, S.P., Asenov, A., Cameron, N.I., Murad, S., McLelland, H.   +6 more
core   +9 more sources

Combining thermal scanning probe lithography and dry etching for grayscale nanopattern amplification [PDF]

, 2023
Grayscale structured surfaces with nanometer-scale features are used in a growing number of applications in optics and fluidics. Thermal scanning probe lithography achieves a lateral resolution below 10 nm and a vertical resolution below 1 nm, but its ...
Giovanni, Boero, Berke, Erbas, Joffrey, Pernollet, Andras, Kis, Xia, Liu, Zenyu, Wang, Georg, Fantner, Arnaud, Bertsch, Marcos, Penedo, Mitali, Banerjee, Juergen, Brugger, Ana, Conde-Rubio   +11 more
core   +2 more sources

Separating a wafer into chips using dry etching and backside grinding

, 2021
This short article describes a method to separate a wafer into photonic chips or dice, using dry etching and backside grinding.
Junqiu Liu
core   +1 more source

ICP Etching of Silicon for Micro and Nanoscale Devices [PDF]

, 2010
The physical structuring of silicon is one of the cornerstones of modern microelectronics and integrated circuits. Typical structuring of silicon requires generating a plasma to chemically or physically etch silicon.
Henry, Michael David
core   +1 more source

Research Review of InAs/GaSb Superlattice Mesa Etching Process [PDF]

Hangkong bingqi
This paper reviews the research on InAs/GaSb superlattice mesa etching technology. The physicochemi-cal mechanism and parameter control of wet and dry etching are analyzed to elucidate the influence of process conditions on mesa morphology, so as to ...
Zhang Xiangyu, Jiang Dongwei, He Wen, Wang Jinzhong
doaj   +1 more source

Progress towards photonic crystal quantum cascade laser [PDF]

, 2004
The work describes recent progress in the design, simulation, implementation and characterisation of photonic crystal (PhC) GaAs-based quantum cascade lasers (QCLs).
Stanley, C.R., Walker, C.L., Ironside, C.N., Farmer, C.D.   +3 more
core   +1 more source

Dry etching of single-point cutting tool made of nano-polycrystalline diamond using oxygen plasma (Shapeable cutting edge radius)

Nihon Kikai Gakkai ronbunshu, 2022
Dry etching using oxygen plasma was conducted on a single-point cutting tool made of nano-polycrystalline diamond to clarify the shapeable cutting edge radius (CER). The CER of the tool was measured by atomic force microscopy (AFM).
Takuya SEMBA, Yoshifumi AMAMOTO, Hitoshi SUMIYA   +2 more
doaj   +1 more source

Angstrom-scale flatness using selective nanoscale etching

Beilstein Journal of Nanotechnology, 2017
The realization of flat surfaces on the angstrom scale is required in advanced devices to avoid loss due to carrier (electron and/or photon) scattering.
Takashi Yatsui, Hiroshi Saito, Katsuyuki Nobusada   +2 more
doaj   +1 more source