Results 1 to 10 of about 440,860 (186)
Electronic cooling via interlayer Coulomb coupling in multilayer epitaxial graphene. [PDF]
Nat Commun, 2015 In van der Waals bonded or rotationally disordered multilayer stacks of two-dimensional (2D) materials, the electronic states remain tightly confined within individual 2D layers. As a result, electron-phonon interactions occur primarily within layers and
Mihnev MT +10 more
europepmc +4 more sources
Novel Cooling Strategy for Electronic Packages: Directly Injected Cooling [PDF]
CIRP Journal of Manufacturing Science and Technology, 2008 This publication discusses domain integration of various engineering disciplines as an effective methodology to design new and innovative products.
Brok, G.J.H.M. +3 more
core +4 more sources
Analysis of Thermal and Flow Characteristics in a Combined Cross-Flow and Jet-Flow Configuration with Flow-Guiding Fins [PDF]
Journal of Applied Fluid Mechanics, 2022 This study investigated the enhanced cooling of electronic components at high temperatures with cross-flow and jet-flow combinations. The cooling performance of four different model geometries (Models 1, 2, 3, and 4) of an electronic component was ...
M. S. Ozturk, T. Demircan
doaj +1 more source
A review of the state-of-the-art in electronic cooling
e-Prime: Advances in Electrical Engineering, Electronics and Energy, 2021 The cooling or thermal management issues are facing critical challenges with the continuous miniaturization and rapid increase of heat flux of electronic devices.
Zhihao Zhang, Xuehui Wang, Yuying Yan
doaj +1 more source
Engineering, 2023 The electronics packaging community strongly believes that Moore’s law will continue for another few years due to recent technological efforts to build heterogeneously integrated packages. Heterogeneous integration (HI) can be at the chip level (a single
Srikanth Rangarajan +2 more
doaj +1 more source
Parametric Study of Electronic Cooling by Means of a Combination of Crossflow and an Impinging Jet
IEEE Access, 2022 This paper reports a parametric study’s experimental results based on the experiments’ design. No works in the literature have investigated parametrically experimental effects on electronic component cooling by combining an impinging jet ...
Yunesky Masip Macia +3 more
doaj +1 more source
Coherent Electron Cooling [PDF]
Physical Review Letters, 2009 Cooling intense high-energy hadron beams poses a major challenge for modern accelerator physics. The synchrotron radiation emitted from such beams is feeble; even in the Large Hadron Collider (LHC) operating with 7 TeV protons, the longitudinal damping time is about 13 hours.
Vladimir N, Litvinenko +1 more
openaire +2 more sources
Energies, 2023 This paper presents a detailed literature review on the thermal management issue faced by electronic devices, particularly concerning uneven heating and overheating problems.
Yijun Li +4 more
doaj +1 more source
Electronic Cooling in Graphene [PDF]
Physical Review Letters, 2009 corrected typos and added ...
Bistritzer, R., MacDonald, A. H.
openaire +3 more sources
Heat Transfer in Electronic Systems Printed Circuit Board: A Review [PDF]
Engineering and Technology Journal, 2022 Thermal regulation has now become a staple in the design of electronic devices. As a result of technological advances in the electronic industry, component miniaturization and thermal system management are becoming more and more important.
Mustafa Kadum +2 more
doaj +1 more source