High temperature reactive ion etching of iridium thin films with aluminum mask in CF4/O2/Ar plasma
Reactive ion etching (RIE) technology for iridium with CF4/O2/Ar gas mixtures and aluminum mask at high temperatures up to 350 °C was developed. The influence of various process parameters such as gas mixing ratio and substrate temperature on the etch ...
Chia-Pin Yeh +3 more
doaj +1 more source
Robust Spot Melting by 3D Spot Arrangements in Electron Beam Powder Bed Fusion
This work proposes an approach to replace separately melted contours for spot melting in electron beam powder fusion. Adapting the spot arrangements close to the contour combined with stacking yields a comparable surface quality without the inherent challenges of separate contours, as demonstrated, by electron optical images and roughness measurements.
Tobias Kupfer +4 more
wiley +1 more source
Numerical simulation of plasma etching process with AAO mask based on PIC/MCC model
This paper presents a Particle-in-Cell Monte Carlo Collision (PIC/MCC) numerical simulation to investigate plasma etching processes utilizing an anodic aluminum oxide (AAO) mask.
Zeping Li +4 more
doaj +1 more source
Superconducting properties of ultrathin Bi2Sr2CaCu2O8+x single crystals
We use Ar-ion milling to thin Bi2212 single crystals down to a few nanometers or one-to-two (CuO2)2 layers. With decreasing the thickness, superconducting transition temperature gradually decreases to zero and the in-plane resistivity increases to large ...
A. Yurgens +8 more
core +1 more source
Microstructure Evolution of a VMnFeCoNi High‐Entropy Alloy After Synthesis, Swaging, and Annealing
The synthesis and processing (rotary swaging and annealing) of the novel VMnFeCoNi alloy is investigated, alongside the estimation of the grain size effect on hardness. Analysis of a wide grain size range of recrystallized microstructures (12–210 µm) reveals a low annealing twin density.
Aditya Srinivasan Tirunilai +6 more
wiley +1 more source
Tailoring Functional Properties of Ti–Ni–Cu Shape Memory Alloy Thin Films for MEMS Actuators
A comprehensive study of critical parameters required to develop well‐performing Ti–Ni–Cu thin film shape memory alloy microactuators is provided. Materials science and device integration aspects are integrated by addressing structural and physical relationships using complementary characterization techniques as well as a practical fabrication solution
Elaheh Akbarnejad +6 more
wiley +1 more source
Investigation of the physical properties of nanoscale porous silicon films
The structure and physical properties of porous silicon obtained by electrochemical etching of monocrystalline silicon with n-type conductivity in a mixture of hydrofluoric acid and ethyl alcohol were investigated.
S.M. Manakov, Ye. Sagidolda
doaj
Objectives This study aimed to prepare high-quality sandblasted large-grit acid-etched surfaces of pure titanium and to evaluate their physicochemical and biological properties.
Qiqi Liu +6 more
doaj +1 more source
Production parameters for the formation of metallic nanotubules in etched tracks
The formation of conducting nanotubules in etched tracks is reported in literature since about a decade. However, up to now precise production recipes are scarce. For this sake we present here a systematic study on some important factors that influence the formation of metallic nanotubules.
Fink, Dietmar +8 more
openaire +2 more sources
Parameter-Variable Experiments for Conductivity of Acid Etched Fractures
AbstractConductivity of acid etched fractures is the decisive factor of results of acidizing treatment. At present, tests for etched fracture conductivity are in all cases executed using fresh acid under fixed experimental conditions, which determines that the test results can only capture fracture conductivity of the near-wellbore zone.
He Chun Ming +4 more
openaire +1 more source

