Results 1 to 10 of about 27,655 (161)

A Study on the O2 Plasma Etching Method of Spray-Formed SWCNT Films and Their Utilization as Electrodes for Electrochemical Sensors [PDF]

open access: yesSensors, 2023
In this study, we analyzed the morphological changes and molecular structure changes on the surface of single-walled carbon nanotube (SWCNT) films during oxygen plasma (O2) etching of SWCNT surfaces formed by the spray method and analyzed their potential
Jinkyeong Kim   +2 more
doaj   +2 more sources

A Facile, Low-Cost Plasma Etching Method for Achieving Size Controlled Non-Close-Packed Monolayer Arrays of Polystyrene Nano-Spheres [PDF]

open access: yesNanomaterials, 2019
Monolayer nano-sphere arrays attract great research interest as they can be used as templates to fabricate various nano-structures. Plasma etching, and in particular high-frequency plasma etching, is the most commonly used method to obtain non-close ...
Yun Chen   +6 more
doaj   +2 more sources

Understanding the improvement mechanism of plasma etching treatment on oxygen reduction reaction catalysts

open access: yesExploration
Plasma etching treatment is an effective strategy to improve the electrocatalytic activity, but the improvement mechanism is still unclear. In this work, a nitrogen‐doped carbon nanotube‐encased iron nanoparticles (Fe@NCNT) catalyst is synthesized as the
Peng Rao   +11 more
doaj   +2 more sources

SF6 Optimized O2 Plasma Etching of Parylene C [PDF]

open access: yesMicromachines, 2018
Parylene C is a widely used polymer material in microfabrication because of its excellent properties such as chemical inertness, biocompatibility and flexibility.
Lingqian Zhang   +3 more
doaj   +2 more sources

Enhancing uniformity in HARC etching via edge bias voltage and structural impedance variations in a rectangular voltage waveform [PDF]

open access: yesScientific Reports
In the semiconductor industry, plasma etching has become a key process for fabricating precise and reliable patterns with high aspect ratios capacitors (HARC), allowing for complex device architectures.
Chanho Park   +3 more
doaj   +2 more sources

Factor Design for the Oxide Etching Process to Reduce Edge Particle Contamination in Capacitively Coupled Plasma Etching Equipment

open access: yesApplied Sciences, 2022
During the oxide layer etching process, particles in capacitively coupled plasma etching equipment adhere to the wafer edge and cause defects that reduce the yield from semiconductor wafers.
Ching-Ming Ku, Stone Cheng
doaj   +1 more source

Wet Chemical and Plasma Etching of Photosensitive Glass

open access: yesSolids, 2023
Photosensitive glasses for radiation-induced 3D microstructuring, due to their optical transparency and thermal, mechanical, and chemical resistance, enable the use of new strategies for numerous microscale applications, ranging from optics to biomedical
Ulrike Brokmann   +4 more
doaj   +1 more source

Effect of Plasma Etching Depth on Subsurface Defects in Quartz Crystal Elements

open access: yesCrystals, 2023
After the plasma etching of quartz crystal, the crystal lattice underwent changes in response to the length of plasma etching time. The lattice arrangement of quartz crystal was the most orderly after plasma etching for 1000 nm, and with the increase in ...
Qingzhi Li   +4 more
doaj   +1 more source

Investigation into SiO2 Etching Characteristics Using Fluorocarbon Capacitively Coupled Plasmas: Etching with Radical/Ion Flux-Controlled

open access: yesNanomaterials, 2022
SiO2 etching characteristics were investigated in detail. Patterned SiO2 was etched using radio-frequency capacitively coupled plasma with pulse modulation in a mixture of argon and fluorocarbon gases.
Won-nyoung Jeong   +4 more
doaj   +1 more source

Dry etching of monocrystalline silicon using a laser-induced reactive micro plasma

open access: yesApplied Surface Science Advances, 2021
Dry etching is a prevalent technique for pattern transfer and material removal in microelectronics, optics and photonics due to its high precision material removal with low surface and subsurface damage.
Robert Heinke   +3 more
doaj   +1 more source

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