Results 101 to 110 of about 304,759 (264)

Aerosol Jet Printing of Superhydrophobic Surfaces

open access: yesAdvanced Materials Technologies, EarlyView.
A novel method for creating spatially programmable superhydrophobic surfaces using an aerosol jet printer is presented. This technique allows precise deposition of micrometer‐sized polymer solution droplets onto a substrate, with control over surface morphology, microstructure, and wettability through solvent evaporation modulation.
Ke Zhong   +5 more
wiley   +1 more source

Development of the Culture of Streptomyces rimosus in Submerged Fermentation

open access: bronze, 1958
J. Doskočil   +4 more
openalex   +1 more source

Electroless Plating of Copper on Laser‐Induced Graphene for Flexible Hybrid Electronic Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Copper‐plated Laser‐Induced Graphene (Cu‐LIG) provides a facile and economical approach to patterning FHEs. This patterning process is enabled by incorporating catalytically active palladium nanoparticles into the LIG structure, which serve as surface reaction sites for reducing copper ions in solution plating.
Attila Rektor   +7 more
wiley   +1 more source

Compound probiotics microcapsules improve milk yield and milk quality of dairy cows by regulating intestinal flora

open access: yesFood Bioengineering
To address the issues of probiotic activity loss during storage and feeding, as well as the limited efficacy of single probiotics, a solution was devised by embedding a mixture of Bacillus coagulans SN‐8 (SN‐8) and Saccharomyces boulardii SN‐6 (SN‐6) in ...
Rina Wu   +9 more
doaj   +1 more source

Magnetic Force‐Induced Self‐Assembly and Flip‐Chip Alignment on Electroplated Multilayer Solder with Tailored Melting Points

open access: yesAdvanced Materials Technologies, EarlyView.
This work demonstrates fluidic self‐assembly and self‐alignment of flip‐chips using a magnetic field for agitation and orientation. Pb‐free solder bumps with tailored transformation imprinted melting points enable selective capturing on low‐melting solder in water. After capturing, final alignment is achieved through magnetic forces.
Mahsa Kaltwasser   +3 more
wiley   +1 more source

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