Results 181 to 190 of about 2,578 (231)

Silica-assisted fixed agglomerated diamond abrasive polishing

Journal of Manufacturing Processes, 2020
Abstract The fixed agglomerated diamond abrasive pad had been used to planarize ultra-hard and brittle materials such as sapphire and SiC. However, the processing stability and surface integrity of sapphire remain to be improved. A silica-assisted fixed agglomerated diamond abrasive polishing (SA-FADAP) process was developed to solve the above ...
Cong Ding, Jiapeng Chen, Yanan Peng
exaly   +2 more sources

Status and Trends of Fixed Abrasive Polishing on Semiconductor

Key Engineering Materials, 2012
The necessity of fixed abrasive CMP in polishing semiconductor materials processing was analyzed. Compared the shortcomings of traditional free abrasive polishing with the advantages of fixed abrasive polishing, the applications of fixed abrasive polishing technology in semiconductor processing were described.
Yu Li Sun, Sun Yu Li
exaly   +2 more sources

Characteristics of textured polishing wheels (TPW) for dry fixed abrasive polishing fused silica

Applied Optics, 2023
Dry fixed abrasive process integrates chemical reaction and ductile removal into one process and shows advantages against the conventional loose abrasive polishing in efficiency, geometric controllability, and waste disposal. However, it is worth noting that the wear and cutting temperatures encountered during the dry fixed abrasive process are areas ...
Chaoxu, Chen, Wei, Yang, Fanwei, Zhu
openaire   +2 more sources

Vibration-assisted dry polishing of fused silica using a fixed-abrasive polisher

International Journal of Machine Tools and Manufacture, 2014
Abstract Glass is a ubiquitous but essential material in everyday life and industry. The most common method for polishing glass involves the use of free abrasives. However, this method is basically non-deterministic and lacks efficiency. Therefore, vibration has been employed to aid fixed-abrasive polishing in our research.
Libo Zhou, Yongbo Wu, Yaguo Li
exaly   +2 more sources

A study on polishing of molds using hydrophilic fixed abrasive pad

International Journal of Machine Tools and Manufacture, 2004
Abstract The finishing process for die and mold manufacturing is very important because it influences the final quality of the products. injection molds especially need higher quality surface than general purpose dies and molds. Conventional polishing cannot reduce mold surface down to nanometer roughness efficiently because of loading and glazing ...
Haedo Jeong
exaly   +2 more sources

Using Taguchi Method to Optimize Polishing Parameters in Ice Fixed Abrasive Polishing

Materials and Manufacturing Processes, 2013
Ice fixed abrasive polishing (IFAP) was used to polish single crystal silicon wafer. Polishing parameters were polishing pressure, table velocity, eccentricity, and polishing time. Using Taguchi method, the influences of the polishing parameters on material removal rate (MRR) and surface roughness (Sa) were invested.
Dunwen Zuo, Yuli Sun, Yongwei Zhu
exaly   +2 more sources

An investigation of material removal in polishing with fixed abrasives

Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 2002
This paper investigates the removal of material from a surface during polishing with fixed abrasives. The material removal profile prescribes the amount of material removed from the surface along a direction orthogonal to the tool path as a polishing tool is moved along the surface.
L Zhang, H Y Tam, C-M Yuan, Y-P Chen, Z-D Zhou   +4 more
openaire   +1 more source

Characteristic of fixed abrasive polishing for fused silica in anhydrous environment

Optik, 2020
Abstract In order to overcome the randomness of free abrasive polishing (CMP), abrasive waste and the resulting hydration layer, this paper presents a fixed abrasive polishing technique in the anhydrous environment. We have achieved a stable polishing wheel sintering process. The pellet we made have applied to fused silica polishing.
Huiyang Tang, Xinyu Luo
exaly   +3 more sources

Pattern density effects in fixed abrasive polishing

MRS Proceedings, 2002
AbstractWe investigated pattern density effects during chemical mechanical planarization (CMP) for shallow trench isolation (STI) applications using fixed abrasive pads to better control the fixed abrasive polishing process. We observed that the polishing characteristics of higher pattern density features are strongly dependent on the presence of lower
Rajasekhar Venigalla, Laertis Economikos, S.V. Babu   +2 more
openaire   +1 more source

On the removal of material along a polishing path by fixed abrasives

Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 2002
Material is removed when a surface is polished. This paper presents a model of the removal of material along a polishing path when a surface is polished by fixed abrasives. The proposed model assumes that the pressure distribution is Hertzian at the contact between the tool and the surface and the abrading rate follows the Archard wear law.
L Zhang, H Y Tam, C-M Yuan, Y-P Chen, Z-D Zhou, L Zheng   +5 more
openaire   +1 more source