Results 201 to 210 of about 2,578 (231)
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Wear of Polishing Pad and Pattern Optimization of Fixed Abrasive Pad
Advanced Materials Research, 2010The polishing pad plays a significant role in the Chemical Mechanical Polishing (CMP) process and its wear influences the surface accuracy of the polished wafer. A new polishing pad wear model is introduced and the law of pad wear along the pad radius is discussed, thus a new FAP with optimized pattern is designed and prepared in order. The flatness of
Mao Li +4 more
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Investigation of Eco-Friendly Fixed-Abrasive Polishing with Compact Robot
Advanced Materials Research, 2010Rising demand for sustainable development motivated our eco-friendly polishing method. In this study, fixed-abrasive polishing using a compact robot was proposed based on a new approach that includes the idea of secondary tools. The effectiveness of using a compact robot was investigated by life cycle assessment for eco-friendly polishing processing ...
Sachiko Ogawa +4 more
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Computational Materials Science, 2021
Abstract Molecular dynamics (MD) as a powerful simulation tool revealed the mechanistic removal behaviors of SiC substrates using a fixed abrasive polishing (FAP) with randomly distributed multi-abrasive particles in a single cycle scratching at nano-scales.
Piao Zhou +5 more
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Abstract Molecular dynamics (MD) as a powerful simulation tool revealed the mechanistic removal behaviors of SiC substrates using a fixed abrasive polishing (FAP) with randomly distributed multi-abrasive particles in a single cycle scratching at nano-scales.
Piao Zhou +5 more
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Integration of CMP Fixed Abrasive Polishing into the Manufacturing of Thick Film SOI Substrates
MRS Proceedings, 2005AbstractThe specification for the total thickness variation (TTV) of the device layers on thick-film silicon on insulator (SOI) wafers tighten for future applications. Therefore, the bulk removal polishing process of current technology after grinding cannot meet the demands in terms of flatness.
Kulawski, Martin +5 more
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A novel polishing method using soluble fixed soft abrasive film
International Journal of Nanomanufacturing, 2015A novel polishing method using soluble fixed soft abrasive film is proposed. During polishing process, the binder material in surface layer of the polishing film can be dissolved by polishing liquid, the worn abrasives are detached and the fresh abrasives are exposed. This polishing film uses alcohol-soluble polyacrylate as binder material.
Julong Yuan
exaly +2 more sources
Advanced Materials Research, 2012
To help reduce the environmental impact of abrasive polishing, we have investigated the use of a compact robot and fixed-abrasive polishing. We used a five-joint closed-link compact robot with a fine diamond stone on its main axis to polish the glass plate and measured the polishing pressure(=pressing force/stone constant area), the polishing force ...
Masaki Niwa +4 more
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To help reduce the environmental impact of abrasive polishing, we have investigated the use of a compact robot and fixed-abrasive polishing. We used a five-joint closed-link compact robot with a fine diamond stone on its main axis to polish the glass plate and measured the polishing pressure(=pressing force/stone constant area), the polishing force ...
Masaki Niwa +4 more
openaire +1 more source
High-efficiency fixed abrasive polishing method for quartz crystal blanks
International Journal of Machine Tools and Manufacture, 2004Abstract Bi-convex quartz crystal resonators have been fabricated by rotary barrel finishing. By rotating a pipe, which is generally used as a barrel, with abrasives and quartz crystal blanks (loose abrasive method), inner curve of the pipe is transferred to the quartz crystal blanks.
Hee-Won Jeong +2 more
exaly +2 more sources
Research on Performance of Fixed Abrasive Tools of Polishing 6H-SiC Wafers
Advanced Materials Research, 20146H-SiC single crystal substrates are considered to be suitable for thin film growth of semi-conductive GaN with wide energy bandgaps, because the lattice mismatch between 6H-SiC and GaN is quite small compared with sapphire substrates. However, the process of SiC wafer prior to epitaxial growth is quite difficult due to its high hardness and chemical ...
Jing Lu +4 more
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Tribology International, 2016
Abstract The semi-fixed and fixed polishing film with diamond and alumina abrasive are used for a contrastive experiment involving polishing SiC and sapphire substrates in this study. The material removal rate (MRR) and surface topography of substrate, the protrusion height of abrasive together with the wear debris, are investigated to reveal the ...
Qiufa Luo, Jing Lu, Xipeng Xu
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Abstract The semi-fixed and fixed polishing film with diamond and alumina abrasive are used for a contrastive experiment involving polishing SiC and sapphire substrates in this study. The material removal rate (MRR) and surface topography of substrate, the protrusion height of abrasive together with the wear debris, are investigated to reveal the ...
Qiufa Luo, Jing Lu, Xipeng Xu
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MRS Proceedings, 2004
AbstractThe new approach using Fixed Abrasive (FA) pads for polishing thick film Silicon-on- Insulator (SOI) wafers after bonding and grinding process [1] has been further developed. The aim is a practicable industrial manufacturing process, where the major specifications especially in long term stability and removal rate should be achieved.
Kulawski, Martin +5 more
openaire +2 more sources
AbstractThe new approach using Fixed Abrasive (FA) pads for polishing thick film Silicon-on- Insulator (SOI) wafers after bonding and grinding process [1] has been further developed. The aim is a practicable industrial manufacturing process, where the major specifications especially in long term stability and removal rate should be achieved.
Kulawski, Martin +5 more
openaire +2 more sources