Results 201 to 210 of about 2,759 (235)
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Computer Simulation on the Motion Tracks of Ice Fixed Abrasives Polishing
Key Engineering Materials, 2010Ice fixed abrasives (IFA) polishing is a novel ultra-precision machining method. The motion tracks of abrasives during IFA polishing have an important effect on the quality of the machined silicon wafer. Firstly, the motion tracks of IFA polishing are theoretically analyzed in this paper.
Yu Li Sun +4 more
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Mirror-Like Surface Finishing of PCD by Fixed Abrasive Polishing
Materials Science Forum, 2016Polycrystalline diamond (PCD) has excellent properties such as high hardness, high chemical inertness, high wear resistance and a low friction coefficient. Thus, it has been expected to be applied to used in various mechanical parts such as sliding parts.
Keishi Yamaguchi +5 more
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Simulation on the Melting Rate of the Iced Fixed-Abrasive Polishing Plate
Key Engineering Materials, 2010The exchange of the heat of the IFA polishing system was analyzed at first in this paper. Then the three-dimensional temperature finite element model was set up. By changing the material of the elements, the ice-melting process was simulated. It was found that the obtained simulating results showed a good agreement with the experimental results.
Jing Kang +4 more
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Wear of Polishing Pad and Pattern Optimization of Fixed Abrasive Pad
Advanced Materials Research, 2010The polishing pad plays a significant role in the Chemical Mechanical Polishing (CMP) process and its wear influences the surface accuracy of the polished wafer. A new polishing pad wear model is introduced and the law of pad wear along the pad radius is discussed, thus a new FAP with optimized pattern is designed and prepared in order. The flatness of
Mao Li +4 more
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FEM Simulation on the Temperature Distribution of Ice Fixed Abrasives Polishing
Key Engineering Materials, 2010The key question in the ice fixed abrasives (IFA) polishing is how to keep suitable ambient temperature in production process in order to avoid premature failure of the IFA. Based on above, the three dimensions finite element analysis (FEA) model of IFA polishing temperature field is built up at first.
Yu Li Sun +5 more
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Computational Materials Science, 2021
Abstract Molecular dynamics (MD) as a powerful simulation tool revealed the mechanistic removal behaviors of SiC substrates using a fixed abrasive polishing (FAP) with randomly distributed multi-abrasive particles in a single cycle scratching at nano-scales.
Piao Zhou +5 more
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Abstract Molecular dynamics (MD) as a powerful simulation tool revealed the mechanistic removal behaviors of SiC substrates using a fixed abrasive polishing (FAP) with randomly distributed multi-abrasive particles in a single cycle scratching at nano-scales.
Piao Zhou +5 more
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Integration of CMP Fixed Abrasive Polishing into the Manufacturing of Thick Film SOI Substrates
MRS Proceedings, 2005AbstractThe specification for the total thickness variation (TTV) of the device layers on thick-film silicon on insulator (SOI) wafers tighten for future applications. Therefore, the bulk removal polishing process of current technology after grinding cannot meet the demands in terms of flatness.
Kulawski, Martin +5 more
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Advanced Materials Research, 2012
To help reduce the environmental impact of abrasive polishing, we have investigated the use of a compact robot and fixed-abrasive polishing. We used a five-joint closed-link compact robot with a fine diamond stone on its main axis to polish the glass plate and measured the polishing pressure(=pressing force/stone constant area), the polishing force ...
Masaki Niwa +4 more
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To help reduce the environmental impact of abrasive polishing, we have investigated the use of a compact robot and fixed-abrasive polishing. We used a five-joint closed-link compact robot with a fine diamond stone on its main axis to polish the glass plate and measured the polishing pressure(=pressing force/stone constant area), the polishing force ...
Masaki Niwa +4 more
openaire +1 more source
Research on Performance of Fixed Abrasive Tools of Polishing 6H-SiC Wafers
Advanced Materials Research, 20146H-SiC single crystal substrates are considered to be suitable for thin film growth of semi-conductive GaN with wide energy bandgaps, because the lattice mismatch between 6H-SiC and GaN is quite small compared with sapphire substrates. However, the process of SiC wafer prior to epitaxial growth is quite difficult due to its high hardness and chemical ...
Jing Lu +4 more
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A novel polishing method using soluble fixed soft abrasive film
International Journal of Nanomanufacturing, 2015A novel polishing method using soluble fixed soft abrasive film is proposed. During polishing process, the binder material in surface layer of the polishing film can be dissolved by polishing liquid, the worn abrasives are detached and the fresh abrasives are exposed. This polishing film uses alcohol-soluble polyacrylate as binder material.
Zhaozhong Zhou +2 more
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