Results 231 to 235 of about 2,759 (235)

Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad

2000
openaire   +3 more sources

Investigation on the Removal Mechanism of Fixed Abrasive Polishing SiCp/Al Composites

Guquan Gu, Cheng Zhang, Shujing Wu, Kun Lu, Dazhong Wang   +4 more
openaire   +1 more source

Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods

2002
CHOPRA DINESH, SINHA NISHANT
openaire   +3 more sources

Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods

2006
openaire   +2 more sources

METHOD FOR CHEMICAL-MECHANICAL PLANARIZATION OF A SUBSTRATE ON A FIXED-ABRASIVE POLISHING PAD

1998
openaire   +2 more sources