Results 221 to 230 of about 2,759 (235)

Copper Chemical Mechanical Polishing Using Fixed-abrasive Polishing Pad

1999
Nguyen Hoang, V., Hof, A., van Kranenburg, H., Woerlee, P.H., Weimar, F.   +4 more
openaire   +1 more source

Development of fixed abrasive chemical mechanical polishing process for glass disk substrates

International Journal of Advanced Manufacturing Technology, 2013
Zhao-Wei Zhong, Y B Tian
exaly  

Effect of slurry and fixed abrasive pad on chemical mechanical polishing of SiC wafer

Materials Science in Semiconductor Processing
Liantong Yang, Hongyan Zhao
exaly  

Prediction of Material Removal in Polishing Free-Form Surfaces with Fixed Abrasives

Key Engineering Materials, 2004
openaire   +1 more source

Preparation and properties of conductive fixed abrasive polishing discs for electrochemical mechanical polishing of SiC substrates

Materials Science in Semiconductor Processing
Qiufa Luo, Yikun Hu, Yiyang Zhu, Jing Lu, Congming Ke, Hui Huang   +5 more
openaire   +1 more source

Tribological glazing evolution of fixed abrasive pad under different polishing solution conditions

Industrial Lubrication and Tribology
Wang Zhankui
exaly  

Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad

2001
CHOPRA DINESH, MEIKLE SCOTT G
openaire   +1 more source

Polishing mechanism of single-crystal silicon in fixed-abrasive chemical mechanical polishing with different solutions

Applied Surface Science
Xiaozhe Yang, Shenglong Zhang, Fangming Lian, Xu Yang, Kazuya Yamamura, Zhuangde Jiang   +5 more
openaire   +1 more source

Polishing characteristics of fixed-abrasive pad by using nano-aggregate silica

Optics and Precision Engineering, 2016
openaire   +1 more source

Chemical mechanical polishing with fixed abrasives using different subpads to optimize wafer uniformity

Microelectronic Engineering, 2000
exaly