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Research on the Application of Diamond Film in Chemical Mechanical Polishing [PDF]
NanomaterialsPolishing pad conditioners are of critical importance in chemical mechanical polishing (CMP), acting as a key determinant of CMP efficiency and an indispensable consumable in the polishing process.
Yibao Wang +10 more
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Multi grade polishing pad for sapphire chemical mechanical polishing
Journal of Materials Research and TechnologyThe synergy between polishing pad and abrasive is the key to material removal in chemical mechanical polishing (CMP). In order to achieve uniform material removal, a new multi gradient polishing pad for sapphire CMP was developed.
Zhaohui Deng +5 more
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Finite Element Analysis on Dynamic Viscoelasticity of CMP Polishing Pad [PDF]
한국정밀공학회지, 2019 Finite element analysis of CMP process was studied to understand uneven pressure distribution between polishing pad and wafer. Since WIWNU (Within wafer non-uniformity) is mainly influenced by dynamic viscoelastic properties of CMP polishing pad, the ...
Byeongjun Pak +4 more
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CMP Pad Conditioning Using the High-Pressure Micro-Jet Method
Micromachines, 2023 In this study, in order to improve and restore the performance of the polishing pads and reduce the cost of chemical mechanical polishing, three types of material polishing pads, namely, polyurethane, damping cloth, and non-woven fabric, were selected ...
Xin Li +10 more
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Contact-Area-Changeable CMP Conditioning for Enhancing Pad Lifetime
Applied Sciences, 2021 Chemical–mechanical polishing (CMP) is a process that planarizes semiconductor surfaces and is essential for the manufacture of highly integrated devices.
Jungyu Son, Hyunseop Lee
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Applied Sciences, 2021 The uniformity of the wafer in a chemical mechanical polishing (CMP) process is vital to the ultra-fine and high integration of semiconductor structures.
Hanchul Cho +3 more
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Deterministic measurement and correction of the pad shape in full-aperture polishing processes [PDF]
Journal of the European Optical Society-Rapid Publications, 2015 Full-aperture polishing is a significant process in fabricating large optical flats because it restrains Mid-Spatial Frequency errors and removes material quickly on the whole optic surface.
Liao D. +5 more
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Identification of the Break-In Mechanism by Asperity Deformation of CMP Pad [PDF]
한국정밀공학회지, 2021 Chemical Mechanical Planarization (CMP) is an essential process for flattening the surface of the wafer to produce a fine structure. The CMP process is performed after a break-in step prior to optimizing the polishing pad.
Kyeongwoo Jeong +4 more
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Applied Sciences, 2021 Chemical mechanical planarization (CMP) is a technology widely employed in device integration and planarization processes used in semiconductor fabrication. In CMP, the polishing pad plays a key role both mechanically and chemically.
Seonho Jeong +3 more
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Prediction of Pad Wear Profile and Simulation of Its Influence on Wafer Polishing
Micromachines, 2023 As feature sizes decrease, an investigation of pad unevenness caused by pad conditioning and its influence on chemical mechanical polishing is necessary. We set up a kinematic model to predict the pad wear profile caused by only diamond disk conditioning
Pengjie Zheng, Dewen Zhao, Xinchun Lu
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