Results 1 to 10 of about 3,124 (304)
Nihon Kikai Gakkai ronbunshu, 2015 In this study, we propose innovative polishing method for hard-to-process semiconductor substrate such as SiC. Our innovative polishing method mainly consists of 2 technologies.
Toshiro K. DOI +12 more
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Prediction of CMP Material Removal Rate based on Pad Surface Roughness Using Deep Neural Network [PDF]
한국정밀공학회지, 2023 As the digitization of the manufacturing process is accelerating, various data-driven approaches using machine learning are being developed in chemical mechanical polishing (CMP).
Jong Min Jeong +4 more
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Mid-Spatial Frequency Error (PSD-2) of optics induced during CCOS and full-aperture polishing [PDF]
Journal of the European Optical Society-Rapid Publications, 2013 Mid-Spatial Frequency (MSF) Wavefront Error of optics divided into the PSD-1 and PSD-2 ranges plays an important role in the performance of high power laser systems. The present work focuses on the PSD-2 range in terms of short ripples which haven’t been
Liao D. +4 more
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Study on Polishing Characteristics of Pyramidal Structured Polishing Pad
International Journal of Automation Technology, 2019 We conducted a polishing test to clarify the change in polishing characteristics resulting from the wear of a pyramidal-structured polishing tool, and discuss the polishing mechanism unique to the pyramidal-structured polishing pad. When the pyramidal-structured polishing pad is used for polishing, there exists an initial polishing stage in which the ...
Ryunosuke Sato, Yoshio Ichida
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The characteristics of optics polished with a polyurethane pad
Optics Express, 2008 The effect of polishing an optical workpiece with a polyurethane pad was studied in this paper, including material removal rate, surface roughness and subsurface damage. Usually, optical polishing pitch is applied to polish optical workpieces, but the material removal rate (MRR) of pitch is quite low, and polyurethane foam is thus substituted for ...
Li, Yaguo +5 more
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Applied Sciences, 2021 In the fabrication of semiconductors, chemical mechanical polishing (CMP) is an essential wafer-planarization process. For optimal CMP, it is crucial to monitor the texture of the polishing pad; this leads to homogenous planarization of wafers. Hence, we
Eun-Soo Kim, Woo-June Choi
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The surface structure of polishing pads for polishing using composite abrasives
Nihon Kikai Gakkai ronbunshu, 2016 Cerium oxide (CeO2) abrasives are generally used in the glass polishing because high removal rate and smooth glass surface can be obtained. However, CeO2 abrasives have problems with dispersion of slurry and cleaning from glass surface.
Naoaki ICHINOHO +3 more
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Additive Manufacturing Letters, 2023 Microstructural characterization has a key role in analyzing the properties of additive manufactured materials. Electron backscatter diffraction (EBSD) can offer a unique set of information on the microstructural state of these materials.
Erfan Maleki +5 more
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Journal of the Japan Society for Precision Engineering, 1991 We have developed some new easy-to-use equipment for measuring quantitatively the rheological deformation characteristics of the polishing pads. The main results, using the measuring equipment, are as follows : (1) With the processing time, the value of th elastic deformation of the pads becomes higher at the peripheral region of the polishing table ...
SAMITSU, Yamato +4 more
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Analysis of sapphire- chemical mechanical polishing using digital image processing
Mechanical Engineering Journal, 2016 This study investigated the contact interface behavior between a wafer and a polishing pad in sapphire- chemical mechanical polishing (CMP) for considering the improvement of the removal rate.
Michio UNEDA +4 more
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