Results 1 to 10 of about 2,582 (264)

Mid-Spatial Frequency Error (PSD-2) of optics induced during CCOS and full-aperture polishing [PDF]

Journal of the European Optical Society-Rapid Publications, 2013
Mid-Spatial Frequency (MSF) Wavefront Error of optics divided into the PSD-1 and PSD-2 ranges plays an important role in the performance of high power laser systems. The present work focuses on the PSD-2 range in terms of short ripples which haven’t been
Liao D., Yuan Z., Tang C., Xie R., Chen X.   +4 more
doaj   +1 more source

Analysis of sapphire- chemical mechanical polishing using digital image processing

Mechanical Engineering Journal, 2016
This study investigated the contact interface behavior between a wafer and a polishing pad in sapphire- chemical mechanical polishing (CMP) for considering the improvement of the removal rate.
Michio UNEDA, Keiichi TAKANO, Koji KOYAMA, Hideo AIDA, Ken-ichi ISHIKAWA   +4 more
doaj   +1 more source

Study on Polishing Characteristics of Pyramidal Structured Polishing Pad

International Journal of Automation Technology, 2019
We conducted a polishing test to clarify the change in polishing characteristics resulting from the wear of a pyramidal-structured polishing tool, and discuss the polishing mechanism unique to the pyramidal-structured polishing pad. When the pyramidal-structured polishing pad is used for polishing, there exists an initial polishing stage in which the ...
Ryunosuke Sato, Yoshio Ichida
openaire   +1 more source

In Situ Metrology for Pad Surface Monitoring in CMP Using a Common-Path Phase-Shifting Interferometry: A Feasibility Study

Applied Sciences, 2021
In the fabrication of semiconductors, chemical mechanical polishing (CMP) is an essential wafer-planarization process. For optimal CMP, it is crucial to monitor the texture of the polishing pad; this leads to homogenous planarization of wafers. Hence, we
Eun-Soo Kim, Woo-June Choi
doaj   +1 more source

The characteristics of optics polished with a polyurethane pad

Optics Express, 2008
The effect of polishing an optical workpiece with a polyurethane pad was studied in this paper, including material removal rate, surface roughness and subsurface damage. Usually, optical polishing pitch is applied to polish optical workpieces, but the material removal rate (MRR) of pitch is quite low, and polyurethane foam is thus substituted for ...
Li, Yaguo, Hou, Jing, Xu, Qiao, Wang, Jian, Yang, Wei, Guo, Yinbiao   +5 more
openaire   +3 more sources

Multi grade polishing pad for sapphire chemical mechanical polishing

Journal of Materials Research and Technology
The synergy between polishing pad and abrasive is the key to material removal in chemical mechanical polishing (CMP). In order to achieve uniform material removal, a new multi gradient polishing pad for sapphire CMP was developed.
Zhaohui Deng, Rongjin Zhuo, Zhongyang Li, Wei Cao, Shangci Huang, Jimin Ge   +5 more
doaj   +1 more source

Additive manufactured cerium oxide foils, used as pads for polishing processes of brittle-hard materials [PDF]

EPJ Web of Conferences
A new concept for polishing pads for flat and spherical surfaces is introduced which comprises additive manufactured polishing pads made of cerium oxide.
Schulze Christian, Henkel Sebastian, Schultheiß Denise, Pipiorka Dominique, Bliedtner Jens, Kerber Albert, Rädlein Edda   +6 more
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Developing a best practice for sample preparation of additive manufactured AlSi10Mg for electron backscatter diffraction analysis

Additive Manufacturing Letters, 2023
Microstructural characterization has a key role in analyzing the properties of additive manufactured materials. Electron backscatter diffraction (EBSD) can offer a unique set of information on the microstructural state of these materials.
Erfan Maleki, Sara Bagherifard, Ludovica Rovatti, Rasheed Michael Ishola, Manoj Revuru, Mario Guagliano   +5 more
doaj   +1 more source

Chemically-induced active micro-nano bubbles assisting chemical mechanical polishing: Modeling and experiments

Friction, 2023
The material loss caused by bubble collapse during the micro-nano bubbles auxiliary chemical mechanical polishing (CMP) process cannot be ignored. In this study, the material removal mechanism of cavitation in the polishing process was investigated in ...
Lei Xu, Kihong Park, Hong Lei, Pengzhan Liu, Eungchul Kim, Yeongkwang Cho, Taesung Kim, Chuandong Chen   +7 more
doaj   +1 more source

Effect of Conditioner Type and Downforce, and Pad Surface Micro-Texture on SiO₂ Chemical Mechanical Planarization Performance

Micromachines, 2019
Based on a previous work where we investigated the effect of conditioner type and downforce on the evolution of pad surface micro-texture during break-in, we have chosen certain break-in conditions to carry out subsequent blanket SiO2 wafer polishing ...
Jeffrey McAllister, Calliandra Stuffle, Yasa Sampurno, Dale Hetherington, Jon Sierra Suarez, Leonard Borucki, Ara Philipossian   +6 more
doaj   +1 more source