Results 41 to 50 of about 3,124 (304)
, 2010 This paper presents a new polishing pad with polishing silicon surface composed of a layer of Ethylene-vinyl acetate (EVA) adhesive pad coated with SiC grits.
Biing Hwa Yan +3 more
core +1 more source
Validation of a Sensor System Solution for Process Monitoring in Robot Assisted Polishing [PDF]
, 2013 It was validated the possible correlation between hidden process variables (AE, force, power consumption) and the vital quality characteristic (roughness) for robot assisted flat polishing with diamond paste.\nIt was also validated the possibility of in ...
Dazzi, Mattia
core
A Workflow to Accelerate Microstructure‐Sensitive Fatigue Life Predictions
Advanced Engineering Materials, EarlyView.This study introduces a workflow to accelerate predictions of microstructure‐sensitive fatigue life. Results from frameworks with varying levels of simplification are benchmarked against published reference results. The analysis reveals a trade‐off between accuracy and model complexity, offering researchers a practical guide for selecting the optimal ...
Luca Loiodice +2 more
wiley +1 more source
Development of Epoxy Resin Polishing Pads for Glass Polishing
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series C, 2011 This paper describes newly developed polishing pads for glass finishing that employs an epoxy resin instead of a conventional polyurethane resin. The porosity of the polishing pad was controlled by changing the amount of a chemical foaming agents mixed with a prepolymer epoxy resin.
MURATA, Junji +5 more
openaire +2 more sources
, 2022 S.51-54In various publications the material removal mechanisms during polishing of optical glass materials are discussed. However, they pay only slight attention on the role of the polishing pad in the tribological system consisting of pad, suspension ...
Klocke, Fritz +2 more
core
Towards Defect Phase Diagrams: From Research Data Management to Automated Workflows
Advanced Engineering Materials, EarlyView.A research data management infrastructure is presented for the systematic integration of heterogeneous experimental and simulation data required for defect phase diagrams. The approach combines openBIS with a companion application for large‐object storage, automated metadata extraction, provenance tracking and federated data access, thereby supporting ...
Khalil Rejiba +5 more
wiley +1 more source
Applied Sciences, 2022 A new and patented polishing tool (ZL2020102387137) called a Self-rotating Wheel Polishing Tool (SWPT) was built, and its tool influence function (TIF) was investigated in this study.
Yongsheng Yao +5 more
doaj +1 more source
, 2004 There is a widespread interest in development and characterization of CMP consumables due to an existing and potential market, as the CMP process becomes widely accepted in the field of microelectronics fabrication. A non-destructive Ultra Sound Testing (
S. Ostapenko +5 more
core +1 more source
Multimodal Data‐Driven Microstructure Characterization
Advanced Engineering Materials, EarlyView.A self‐consistent autonomous workflow for EBSP‐based microstructure segmentation by integrating PCA, GMM clustering, and cNMF with information‐theoretic parameter selection, requiring no user input. An optimal ROI size related to characteristic grain size is identified.
Qi Zhang +4 more
wiley +1 more source
Slurry Design for Chemical Mechanical Polishing
KONA Powder and Particle Journal, 2014 Chemical Mechanical Polishing (CMP) process is widely used in the microelectronics industry for planarization of metal and dielectric layers to achieve multi-layer metallization.
G. Bahar Basim, Brij M. Moudgil
doaj +1 more source