Results 21 to 30 of about 2,424 (264)

The surface structure of polishing pads for polishing using composite abrasives

open access: yesNihon Kikai Gakkai ronbunshu, 2016
Cerium oxide (CeO2) abrasives are generally used in the glass polishing because high removal rate and smooth glass surface can be obtained. However, CeO2 abrasives have problems with dispersion of slurry and cleaning from glass surface.
Naoaki ICHINOHO   +3 more
doaj   +1 more source

Mid-Spatial Frequency Error (PSD-2) of optics induced during CCOS and full-aperture polishing [PDF]

open access: yesJournal of the European Optical Society-Rapid Publications, 2013
Mid-Spatial Frequency (MSF) Wavefront Error of optics divided into the PSD-1 and PSD-2 ranges plays an important role in the performance of high power laser systems. The present work focuses on the PSD-2 range in terms of short ripples which haven’t been
Liao D.   +4 more
doaj   +1 more source

Analysis of sapphire- chemical mechanical polishing using digital image processing

open access: yesMechanical Engineering Journal, 2016
This study investigated the contact interface behavior between a wafer and a polishing pad in sapphire- chemical mechanical polishing (CMP) for considering the improvement of the removal rate.
Michio UNEDA   +4 more
doaj   +1 more source

Study on Polishing Characteristics of Pyramidal Structured Polishing Pad

open access: yesInternational Journal of Automation Technology, 2019
We conducted a polishing test to clarify the change in polishing characteristics resulting from the wear of a pyramidal-structured polishing tool, and discuss the polishing mechanism unique to the pyramidal-structured polishing pad. When the pyramidal-structured polishing pad is used for polishing, there exists an initial polishing stage in which the ...
Ryunosuke Sato, Yoshio Ichida
openaire   +1 more source

In Situ Metrology for Pad Surface Monitoring in CMP Using a Common-Path Phase-Shifting Interferometry: A Feasibility Study

open access: yesApplied Sciences, 2021
In the fabrication of semiconductors, chemical mechanical polishing (CMP) is an essential wafer-planarization process. For optimal CMP, it is crucial to monitor the texture of the polishing pad; this leads to homogenous planarization of wafers. Hence, we
Eun-Soo Kim, Woo-June Choi
doaj   +1 more source

The characteristics of optics polished with a polyurethane pad

open access: yesOptics Express, 2008
The effect of polishing an optical workpiece with a polyurethane pad was studied in this paper, including material removal rate, surface roughness and subsurface damage. Usually, optical polishing pitch is applied to polish optical workpieces, but the material removal rate (MRR) of pitch is quite low, and polyurethane foam is thus substituted for ...
Li, Yaguo   +5 more
openaire   +3 more sources

Additive manufactured cerium oxide foils, used as pads for polishing processes of brittle-hard materials [PDF]

open access: yesEPJ Web of Conferences
A new concept for polishing pads for flat and spherical surfaces is introduced which comprises additive manufactured polishing pads made of cerium oxide.
Schulze Christian   +6 more
doaj   +1 more source

Developing a best practice for sample preparation of additive manufactured AlSi10Mg for electron backscatter diffraction analysis

open access: yesAdditive Manufacturing Letters, 2023
Microstructural characterization has a key role in analyzing the properties of additive manufactured materials. Electron backscatter diffraction (EBSD) can offer a unique set of information on the microstructural state of these materials.
Erfan Maleki   +5 more
doaj   +1 more source

Chemically-induced active micro-nano bubbles assisting chemical mechanical polishing: Modeling and experiments

open access: yesFriction, 2023
The material loss caused by bubble collapse during the micro-nano bubbles auxiliary chemical mechanical polishing (CMP) process cannot be ignored. In this study, the material removal mechanism of cavitation in the polishing process was investigated in ...
Lei Xu   +7 more
doaj   +1 more source

A Workflow to Accelerate Microstructure‐Sensitive Fatigue Life Predictions

open access: yesAdvanced Engineering Materials, EarlyView.
This study introduces a workflow to accelerate predictions of microstructure‐sensitive fatigue life. Results from frameworks with varying levels of simplification are benchmarked against published reference results. The analysis reveals a trade‐off between accuracy and model complexity, offering researchers a practical guide for selecting the optimal ...
Luca Loiodice   +2 more
wiley   +1 more source

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