Results 21 to 30 of about 3,124 (304)
Finite Element Analysis on Dynamic Viscoelasticity of CMP Polishing Pad [PDF]
한국정밀공학회지, 2019 Finite element analysis of CMP process was studied to understand uneven pressure distribution between polishing pad and wafer. Since WIWNU (Within wafer non-uniformity) is mainly influenced by dynamic viscoelastic properties of CMP polishing pad, the ...
Byeongjun Pak +4 more
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Contact-Area-Changeable CMP Conditioning for Enhancing Pad Lifetime
Applied Sciences, 2021 Chemical–mechanical polishing (CMP) is a process that planarizes semiconductor surfaces and is essential for the manufacture of highly integrated devices.
Jungyu Son, Hyunseop Lee
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Identification of the Break-In Mechanism by Asperity Deformation of CMP Pad [PDF]
한국정밀공학회지, 2021 Chemical Mechanical Planarization (CMP) is an essential process for flattening the surface of the wafer to produce a fine structure. The CMP process is performed after a break-in step prior to optimizing the polishing pad.
Kyeongwoo Jeong +4 more
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Applied Sciences, 2021 Chemical mechanical planarization (CMP) is a technology widely employed in device integration and planarization processes used in semiconductor fabrication. In CMP, the polishing pad plays a key role both mechanically and chemically.
Seonho Jeong +3 more
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A brief application of material parameters to predict polishing rates for optical glasses [PDF]
EPJ Web of Conferences, 2022 This paper investigates the effects of material parameters of optical glasses on the polishing rate of these glasses. For this purpose, the material removal of various glasses was determined in laboratory tests under identical polishing conditions with ...
Benisch Michael F. +3 more
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Material removal efficiency improvement by orientation control of CMP pad surface asperities [PDF]
, 2020 This paper presents a novel method of improving material removal efficiency in the chemical mechanical polishing (CMP) process by optimizing the surface asperity orientation with respect to polishing motion.
Shamoto, Eiji +5 more
core +1 more source
Dynamic Pad Surface Metrology Monitoring by Swing-Arm Chromatic Confocal System
Applied Sciences, 2020 This study aims to develop a dynamic pad monitoring system (DPMS) for measuring the surface topography of polishing pad. Chemical mechanical planarization/polishing (CMP) is a vital process in semiconductor manufacturing. The process is applied to assure
Chao-Chang A. Chen +4 more
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Applied Sciences, 2022 Slurry flow on the pad surface and its effects on oxide chemical mechanical polishing (CMP) performance were investigated in simulations and experiments. A concentric groove pad and the same pad with radial grooves were used to quantitatively compare the
Yeongkwang Cho +7 more
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Effect of Secondary Foaming on the Structural Properties of Polyurethane Polishing Pad. [PDF]
Materials (Basel)Polyurethane polishing pads are important in chemical mechanical polishing (CMP). Thus, understanding how to decrease the density but increase the porosity is a crucial aspect of improving the efficiency of a polyurethane polishing pad.
Chen M +5 more
europepmc +2 more sources
Effect of Pad Elastic Modulus on The Polishing Induced Plastic Subsurface Damages Distribution of Fused Silica Optics [PDF]
EPJ Web of Conferences, 2019 The plastic subsurface damages distribution of fused silica optics polished with different pads are investigated. The elastic interaction model, plastic indentation model and wear relationships are combined together to theoretically characterize the ...
He Xiang, Cai Chao, Ma Ping
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