Results 11 to 20 of about 3,124 (304)

Deterministic measurement and correction of the pad shape in full-aperture polishing processes [PDF]

Journal of the European Optical Society-Rapid Publications, 2015
Full-aperture polishing is a significant process in fabricating large optical flats because it restrains Mid-Spatial Frequency errors and removes material quickly on the whole optic surface.
Liao D., Zhang Q., Xie R., Chen X., Zhao S., Wang J.   +5 more
doaj   +4 more sources

Steel mould surface improvement by robot fluid jet polishing and robot pad polishing for polymer optic production [PDF]

EPJ Web of Conferences, 2019
In order to improve the quality of injection-moulded polymer optic parts, it is necessary to improve the quality of the respective steel moulds. For this reason, it is not only necessary to improve the surface roughness of the mould, but also its ...
Almeida Rui, Ebert Timon, Börret Rainer, Pohl Mario   +3 more
doaj   +3 more sources

Prediction of Pad Wear Profile and Simulation of Its Influence on Wafer Polishing

Micromachines, 2023
As feature sizes decrease, an investigation of pad unevenness caused by pad conditioning and its influence on chemical mechanical polishing is necessary. We set up a kinematic model to predict the pad wear profile caused by only diamond disk conditioning
Pengjie Zheng, Dewen Zhao, Xinchun Lu
doaj   +2 more sources

Research on the Application of Diamond Film in Chemical Mechanical Polishing [PDF]

Nanomaterials
Polishing pad conditioners are of critical importance in chemical mechanical polishing (CMP), acting as a key determinant of CMP efficiency and an indispensable consumable in the polishing process.
Yibao Wang, Xueyu Zhang, Fengxiang Guo, Mei Zhang, Xiaoling Sun, Lili Zhang, Guangsen Xia, Xu Chai, Shaoyan Wang, Xuesong Zhou, Zhigang Gai   +10 more
doaj   +2 more sources

Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad

Applied Sciences, 2021
The uniformity of the wafer in a chemical mechanical polishing (CMP) process is vital to the ultra-fine and high integration of semiconductor structures.
Hanchul Cho, Taekyung Lee, Doyeon Kim, Hyoungjae Kim   +3 more
doaj   +2 more sources

Study on the Preparation and Performance of Self-Regressive Fixed Abrasive Chemical Mechanical Polishing Pad

Machines, 2022
Chemical mechanical polishing (CMP) technology is one of the key technologies to realize the global planarization of semiconductor wafer surfaces. With the increasing popularity and universality of its application, more and higher requirements are put ...
Jianguo Yao, Haixu Liu, Zhankui Wang, Yongwei Zhu, Jianxiu Su   +4 more
doaj   +2 more sources

Multi grade polishing pad for sapphire chemical mechanical polishing

Journal of Materials Research and Technology
The synergy between polishing pad and abrasive is the key to material removal in chemical mechanical polishing (CMP). In order to achieve uniform material removal, a new multi gradient polishing pad for sapphire CMP was developed.
Zhaohui Deng, Rongjin Zhuo, Zhongyang Li, Wei Cao, Shangci Huang, Jimin Ge   +5 more
doaj   +2 more sources

Effect of pad and slurry on fixed abrasive polishing of gallium oxide crystal

Jin'gangshi yu moliao moju gongcheng, 2022
Gallium oxide crystal is one of the most representative fourth generation semiconductor materials with the advantages of high band gap, high voltage resistance and short absorption cutoff edge. It has broad application prospects.
Cheng WU, Jun LI, Tianyi HOU, Ningbin YU, Xiujuan GAO   +4 more
doaj   +2 more sources

Study on the Electro-Fenton Chemomechanical Removal Behavior in Single-Crystal GaN Pin–Disk Friction Wear Experiments [PDF]

Micromachines
Electro-Fenton chemical mechanical polishing primarily regulates the generation of hydroxyl radicals (·OH) via the Fenton reaction through an applied electric field, which subsequently influences the formation and removal of the oxide layer on the ...
Yangting Ou, Zhuoshan Shen, Juze Xie, Jisheng Pan   +3 more
doaj   +2 more sources

CMP Pad Conditioning Using the High-Pressure Micro-Jet Method

Micromachines, 2023
In this study, in order to improve and restore the performance of the polishing pads and reduce the cost of chemical mechanical polishing, three types of material polishing pads, namely, polyurethane, damping cloth, and non-woven fabric, were selected ...
Xin Li, Yinggang Wang, Hongyu Chen, Wenhong Zhao, Qianfa Deng, Tengfei Yin, Suet To, Zhe Sun, Xi Shen, Wei Hang, Julong Yuan   +10 more
doaj   +1 more source