Results 11 to 20 of about 2,424 (264)
Effect of pad and slurry on fixed abrasive polishing of gallium oxide crystal
Jin'gangshi yu moliao moju gongcheng, 2022 Gallium oxide crystal is one of the most representative fourth generation semiconductor materials with the advantages of high band gap, high voltage resistance and short absorption cutoff edge. It has broad application prospects.
WU Cheng +4 more
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A brief application of material parameters to predict polishing rates for optical glasses [PDF]
EPJ Web of Conferences, 2022 This paper investigates the effects of material parameters of optical glasses on the polishing rate of these glasses. For this purpose, the material removal of various glasses was determined in laboratory tests under identical polishing conditions with ...
Benisch Michael F. +3 more
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Dynamic Pad Surface Metrology Monitoring by Swing-Arm Chromatic Confocal System
Applied Sciences, 2020 This study aims to develop a dynamic pad monitoring system (DPMS) for measuring the surface topography of polishing pad. Chemical mechanical planarization/polishing (CMP) is a vital process in semiconductor manufacturing. The process is applied to assure
Chao-Chang A. Chen +4 more
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Machines, 2022 Chemical mechanical polishing (CMP) technology is one of the key technologies to realize the global planarization of semiconductor wafer surfaces. With the increasing popularity and universality of its application, more and higher requirements are put ...
Jianguo Yao +4 more
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Development of epoxy resin polishing pads with the addition of polymer particles
Nihon Kikai Gakkai ronbunshu, 2018 Polishing processes are critical to high material removal rate and excellent surface roughness. To realize the highly-efficient polishing of glassware, which are used as materials for flat-panel displays, glass lens, substrates of magnetic disks, a new ...
Yu ZHANG, Yasuhiro TANI, Nobuyuki NOMURA
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Steel mould surface improvement by robot fluid jet polishing and robot pad polishing for polymer optic production [PDF]
EPJ Web of Conferences, 2019 In order to improve the quality of injection-moulded polymer optic parts, it is necessary to improve the quality of the respective steel moulds. For this reason, it is not only necessary to improve the surface roughness of the mould, but also its ...
Almeida Rui +3 more
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Applied Sciences, 2022 Slurry flow on the pad surface and its effects on oxide chemical mechanical polishing (CMP) performance were investigated in simulations and experiments. A concentric groove pad and the same pad with radial grooves were used to quantitatively compare the
Yeongkwang Cho +7 more
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Applied Sciences, 2016 This study focuses on the development of a novel polishing pad for SiC wafers. Fe and Al2O3 particles were impregnated in a polyurethane matrix, thus forming a fixed abrasive polishing pad.
Jihng-Kuo Ho +3 more
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Nihon Kikai Gakkai ronbunshu, 2015 In this study, we propose innovative polishing method for hard-to-process semiconductor substrate such as SiC. Our innovative polishing method mainly consists of 2 technologies.
Toshiro K. DOI +12 more
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Effect of Pad Elastic Modulus on The Polishing Induced Plastic Subsurface Damages Distribution of Fused Silica Optics [PDF]
EPJ Web of Conferences, 2019 The plastic subsurface damages distribution of fused silica optics polished with different pads are investigated. The elastic interaction model, plastic indentation model and wear relationships are combined together to theoretically characterize the ...
He Xiang, Cai Chao, Ma Ping
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