Results 31 to 40 of about 3,124 (304)
Development of epoxy resin polishing pads with the addition of polymer particles
Nihon Kikai Gakkai ronbunshu, 2018 Polishing processes are critical to high material removal rate and excellent surface roughness. To realize the highly-efficient polishing of glassware, which are used as materials for flat-panel displays, glass lens, substrates of magnetic disks, a new ...
Yu ZHANG, Yasuhiro TANI, Nobuyuki NOMURA
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Performance analysis of Pareto optimal bearings subject to surface error variations [PDF]
, 2010 A Pareto optimization study was carried out on a flat pad aerostatic bearing design. Some of the Pareto optimal configurations were then subjected to surface profiling errors including tilt, concavity, convexity and waviness and key performance ...
Barrans, Simon +7 more
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Applied Sciences, 2016 This study focuses on the development of a novel polishing pad for SiC wafers. Fe and Al2O3 particles were impregnated in a polyurethane matrix, thus forming a fixed abrasive polishing pad.
Jihng-Kuo Ho +3 more
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Effect of nanotopogranphy in direct wafer bonding: modeling and measurements [PDF]
, 2005 Nanotopography, which refers to surface height variations of tens to hundreds of nanometers that extend across millimeter-scale wavelengths, is a wafer geometry feature that may cause failure in direct wafer bonding processes.
W.A. Baylies +12 more
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Friction, 2023 The material loss caused by bubble collapse during the micro-nano bubbles auxiliary chemical mechanical polishing (CMP) process cannot be ignored. In this study, the material removal mechanism of cavitation in the polishing process was investigated in ...
Lei Xu +7 more
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Additive manufactured cerium oxide foils, used as pads for polishing processes of brittle-hard materials [PDF]
EPJ Web of ConferencesA new concept for polishing pads for flat and spherical surfaces is introduced which comprises additive manufactured polishing pads made of cerium oxide.
Schulze Christian +6 more
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Investigation of Planarization Using Real Contact Area Measurement in CMP Process [PDF]
한국정밀공학회지, 2022 Chemical Mechanical Planarization (CMP) is an essential process for device integration and planarization in a semiconductor manufacturing process. The most critical function in the CMP process, is to predict and cover the geometrical characteristics of ...
Minji Kim +4 more
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, 2011 In the current study, a high precision polishing process test bench with in-situ measurement technology was developed. The test bench also adopted to investigate the effects of operating parameters on polishing interfacial phenomena during the polishing
Pay Yau Huang +4 more
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Machine learning robot polishing cell [PDF]
EPJ Web of Conferences, 2019 The quality of optical components such as lenses or mirrors can be described by shape errors and surface roughness. With increasing optic sizes, the stability of the polishing process becomes more and more important. Parameters such as chemical stability
Schneckenburger Max +2 more
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Micromachines, 2019 Based on a previous work where we investigated the effect of conditioner type and downforce on the evolution of pad surface micro-texture during break-in, we have chosen certain break-in conditions to carry out subsequent blanket SiO2 wafer polishing ...
Jeffrey McAllister +6 more
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