Results 61 to 70 of about 2,424 (264)

Review on modeling and application of chemical mechanical polishing

Nanotechnology Reviews, 2020
With the development of integrated circuit technology, especially after entering the sub-micron process, the reduction of critical dimensions and the realization of high-density devices, the flatness between integrated circuit material layers is becoming
Zhao Gaoyang, Wei Zhen, Wang Weilei, Feng Daohuan, Xu Aoxue, Liu Weili, Song Zhitang   +6 more
doaj   +1 more source

Probing Electrocatalyst Design for Product Selectivity in CO2 Reduction

Advanced Science, EarlyView.
Selective CO2 electroreduction is controlled by catalyst structure, dynamic surface reconstruction, adsorbate interactions, and reaction microenvironment. This review summarizes Cu‐ and non‐Cu‐based catalysts, single‐atom and molecular systems, degradation pathways, and operando/computational strategies for steering CO2RR toward hydrocarbons ...
Suvodeep Sen, Bapan Biswas, Apinya Ngoipala, Julia Wiktor, Ujjwal Pal, Shalini Singh   +5 more
wiley   +1 more source

Differential Tissue‐Coupled Powering for Battery‐Free Injectable Electroceuticals

Advanced Science, EarlyView.
A thread‐like injectable neural stimulator is powered through differential tissue‐coupled powering (DTCP), which harvests RF‐frequency tissue potentials with an elongated receiver while preserving a injectable cross‐section. The system integrates an ASIC, stimulation electrodes, and a portable transmitter, enabling wireless peripheral nerve stimulation,
Han Wu, Sultan Mahmud, Mali Halac, Asif Iftekhar Omi, Domenica Sofia Baez Rodas, Jeremiasz Dados, Chaojun Cheng, Anyu Jiang, Cameron Wallace, Anvi Singh, Erin Patrick, Baibhab Chatterjee, Shriya Srinivasan, Adam Khalifa   +13 more
wiley   +1 more source

Mechanically polish gadolinium gallium garnet crystal with polyurethane polishing pad

Jin'gangshi yu moliao moju gongcheng, 2017
GGG(gadolinium gallium garnet)wafer is an excellent kind of laser material.However,its surface is easily scratched and the efficiency low during the polishing process.In order to avoid the scarification and improve polishing effect,polyurethane polishing
ZHANG Haoran, JIN Zhuji, WANG Ziguang, HAN Xiaolong   +3 more
doaj  

Multi‐Vth IGZO FETs Enabled by Continuous‐wave Laser Scanning Annealing for Low Thermal Budget 3D Integration

Advanced Electronic Materials, EarlyView.
A novel strategy is used to fabricate multi‐threshold‐voltage (multi‐Vth) IGZO FETs via continuous‐wave laser scanning annealing (CW‐LSA). By tuning the laser power and scan speed, low, standard, and high Vth values of 0.22, 0.42, and 0.62 V, respectively, were achieved on a single wafer with excellent uniformity (coefficient of variation: 2.17%–6.61%).
Jun‐Hyeok Choi, Kiyung Kim, Hyeon‐Seok Shin, Uigwan Shin, Byeong Gwan Kim, Jae Hyeon Jun, Joon Kim, Yoonyoung Chung, Byoung Hun Lee   +8 more
wiley   +1 more source

Simulation of temperature field when polishing germanium wafer using ice-bonded-abrasive polishing pad

Jin'gangshi yu moliao moju gongcheng, 2016
The finite element model is established using ABAQUS to simulate the value of temperature fields for ice-bonded-abrasive pad polishing germanium wafer.Temperature contour map and melting thickness value of the pad are obtained and the results of FEM are ...
WANG Yong, SUN Yuli, TANG Suyang, LIU Zhigang, ZUO Dunwen   +4 more
doaj  

Improvement of Material Removal Rate and Within Wafer Non-Uniformity in Chemical Mechanical Polishing Using Computational Fluid Dynamic Modeling

Journal of Manufacturing and Materials Processing
Chemical mechanical polishing (CMP) is a widely used technique in semiconductor manufacturing to achieve a flat and smooth surface on silicon wafers.
Hafiz M. Irfan, Cheng-Yu Lee, Debayan Mazumdar, Yashar Aryanfar, Wei Wu   +4 more
doaj   +1 more source

Combinatorial Survey of Structural Phase Distribution and Magnetism in Fe‐Ge‐Te Composition‐Spread Thin Film Libraries

Advanced Electronic Materials, EarlyView.
ABSTRACT Magnetic 2‐dimensional (2D) van der Waals (vdW) materials have garnered tremendous attention. The vdW ferromagnet Fe5Ge1Te2 has a Curie temperature Tc of ≈ 270 K, which is tailorable by tuning the stoichiometry and the Fe deficiency to reach room temperature.
Chih‐Yu Lee, Takahiro Yamazaki, Peng Yan, Ryan Kim, Masato Kotsugi, Efrain E. Rodriguez, Joseph W. Bennett, Ichiro Takeuchi   +7 more
wiley   +1 more source

Numerical study of slurry replacement and distribution in chemical mechanical polishing using multi-zone analysis

Mathematical and Computer Modelling of Dynamical Systems
Chemical mechanical polishing (CMP) is a critical process in semiconductor fabrication, where controlling slurry behavior at the pad-wafer interface is essential for achieving uniform material removal.
Jaesung Lee, Chulsoo Im, Kangmin Choi, Bonchan Koo, Jiho You   +4 more
doaj   +1 more source

Soft Active Electromyography Interface for Machine Learning‐Enabled Silent Speech Recognition

Advanced Intelligent Systems, EarlyView.
A soft, hand‐worn electromyography interface enables intent‐driven silent speech recognition without continuous facial attachment. The device integrates liquid‐metal interconnects, a transparent flexible circuit, and elastomer encapsulation with a fingertip electrode that contacts perioral muscles only on demand.
Yuta Kurotaki, Shusuke Yamakoshi, Reitaro Yoshida, Yutaka Isoda, Tamami Takano, Yuji Isano, Yusuke Miyake, Kentaro Kuribayashi, Hiroki Ota   +8 more
wiley   +1 more source