Results 61 to 70 of about 3,124 (304)

Development of hot melt adhesive pad and its application to polishing of monocrystalline silicon

, 2011
This study has developed a new polishing pad and an accompanying group of parameters for polishing monocrystalline silicon. A hot melt adhesive polishing pad coated with SiC abrasive uses these parameters more effectively and provides better polishing ...
S-L Tsai, F-Y Huang, J-H Ke, H-Z Ke, B-H Yan   +4 more
core   +1 more source

Designable van der Waals Crystal for Artificial Neuronal Cell Mimicking

Advanced Materials, EarlyView.
Designable van der Waals crystal has been demonstrated for device‐scale neuronal cell mimicking. The structural similarity between ion‐channel in biological membranes and layered vdW lattices is realized with nano‐crystallization via Ar + H2S plasma sulfurization.
Jinhyoung Lee, Gunhyoung Kim, Dongho Lee, Seowoo Son, Hyunho Seok, Sihoon Son, Hyunbin Choi, Geonwook Kim, Geumji Back, Hyunkyu Kim, Chaerin Park, Junmin Ahn, Seongyun Je, Chaeyoung Im, Junil Cho, Magdalena Grzeszczyk, Seongho Kim, Eunseo Go, Hyunwoo Shim, Donghwan Choi, Muyoung Kim, Hyoeng‐U. Kim, Won‐Jun Jang, Taesung Kim   +23 more
wiley   +1 more source

Effect of Polishing Pad Material Properties on Chemical Mechanical Polishing (Cmp) Processes

, 1994
Chemical mechanical polishing (CMP) technology has successfully met the stringent requirements of ultraplanarized surfaces in semiconductor manufacture. Commonly, polyurethane based pads have been used to achieve this level of planarization.
Rahul Jairath, Robert Tolles, Rajeev Bajaj, Matthew Stell, Mukesh Desai   +4 more
core   +1 more source

Ultra‐High‐Throughput Discovery of Multifunctional Polyphenolic Coatings on Droplet Microarrays

Advanced Materials, EarlyView.
An ultra‐high‐throughput (UHT) combinatorial strategy enables the miniaturized synthesis and screening of ≈30 000 polyamine‐polyphenolic (PaPp) coatings using droplet microarrays (DMA). This approach reveals hundreds of previously unknown fluorescent, redox‐active, and antibacterial materials, including multifunctional, cell‐compatible surfaces ...
Vania Tanda Widyaya, Joaquín E. Urrutia Gómez, Paul Reuß, Alexander Welle, Rolf A. Gattung, Jana Mayer, Peter Krolla, Markus Reischl, Pascal Friederich, Anna A. Popova, Thomas Schwartz, Pavel A. Levkin   +11 more
wiley   +1 more source

BioEISense: A Microfluidic Platform for Real‐Time Monitoring of Staphylococcus aureus Biofilm Formation and the Efficacy of Antibiofilm Agents

Advanced Materials Interfaces, EarlyView.
BioEISense is a microfluidic device with integrated impedance sensors, for real‐time, label‐free monitoring of S. aureus biofilms. In this study, the biofilm culture conditions were optimized to support sensitive and reproducible detection of biofilm formation and eradication under dynamic flow‐through conditions. The system was also validated for both
Jéssica Amorim, Laura Vesalainen, Loïc Dreano, Markus Haapala, Cristina D. Cruz, Päivi Tammela, Tiina M. Sikanen   +6 more
wiley   +1 more source

Slurry Injection Schemes on the Extent of Slurry Mixing and Availability during Chemical Mechanical Planarization

Micromachines, 2017
In this study, slurry availability and the extent of the slurry mixing (i.e., among fresh slurry, spent slurry, and residual rinse-water) were varied via three different injection schemes.
Matthew Bahr, Yasa Sampurno, Ruochen Han, Ara Philipossian   +3 more
doaj   +1 more source

Review on modeling and application of chemical mechanical polishing

Nanotechnology Reviews, 2020
With the development of integrated circuit technology, especially after entering the sub-micron process, the reduction of critical dimensions and the realization of high-density devices, the flatness between integrated circuit material layers is becoming
Zhao Gaoyang, Wei Zhen, Wang Weilei, Feng Daohuan, Xu Aoxue, Liu Weili, Song Zhitang   +6 more
doaj   +1 more source

Analysis on the Contact Pressure Distribution of Chemical Mechanical Polishing by the Bionic Polishing Pad with Phyllotactic Pattern

, 2011
In order to make the contact pressure distribution of polishing wafer surface more uniform during chemical mechanical polishing (CMP), a kind of the bionic polishing pad with sunflower seed pattern has been designed based on phyllotaxis theory, and the ...
Xue Ling Xing, Nan Li, Jun Wang, Tian Zhang, Y.S. Lv, Min Duan   +5 more
core   +1 more source

Spin‐On SiOx‐Assisted Inkjet Printing for Interdigitated n+ and p+ Poly‐Si/SiOx Contacts in Silicon Solar Cells With Suppressed Unintended Doping

Advanced Materials Technologies, EarlyView.
This work presents an innovative spin‐on SiOx‐assisted inkjet‐printed approach to form localized n+ and p+ poly‐Si/SiOx passivating contacts for high‐efficiency silicon solar cells within a single‐annealing step. The developed process results in a well‐defined interdigitated doping pattern, with unintended doping and cross‐doping concentrations ...
Jiali Wang, Jinlei Ren, Laura Creon, Paula Peres, Rene Chemnitzer, Pierre‐Yves Corre, Sieu Pheng Phang, Daniel Macdonald, AnYao Liu   +8 more
wiley   +1 more source

Effect of Shape and Size of Polishing Pad on Material Removal Characteristic

, 2011
The objective of this paper is to investigate the effect of shape and size of polishing pad on the material removal characteristics in the NC polishing. The material removal model was established based on Preston equation.
Yong Jie Shi, Yong Jiang Yu, Feng Lu, Di Zheng, Yuan Wang, Xian Hua Zhang, Xiao Jun Zhao   +6 more
core   +1 more source