Results 61 to 70 of about 2,582 (264)
Awake longitudinal multimodal ultrasound imaging integrates functional ultrasound (fUS), ultrasound localization microscopy (ULM), and functional ULM (fULM) to characterize cerebrovascular function, microvascular architecture, and flow dynamics within the same animals over time.
Zhe Huang +9 more
wiley +1 more source
CD112 Lactylation Drives Dual Immune Evasion From CD8+ T Cells and NK Cells
AARS2 functions as an intracellular lactate sensor and lactyltransferase, catalyzing CD112 K412 lactylation to block ubiquitination‐dependent degradation and stabilize CD112. This pathway suppresses CD8+ T‐cell and NK‐cell cytotoxicity, enabling dual immune evasion.
Zhuoshuo Xu +6 more
wiley +1 more source
Mechanically polish gadolinium gallium garnet crystal with polyurethane polishing pad
GGG(gadolinium gallium garnet)wafer is an excellent kind of laser material.However,its surface is easily scratched and the efficiency low during the polishing process.In order to avoid the scarification and improve polishing effect,polyurethane polishing
ZHANG Haoran +3 more
doaj
Review on modeling and application of chemical mechanical polishing
With the development of integrated circuit technology, especially after entering the sub-micron process, the reduction of critical dimensions and the realization of high-density devices, the flatness between integrated circuit material layers is becoming
Zhao Gaoyang +6 more
doaj +1 more source
ABSTRACT Magnetic 2‐dimensional (2D) van der Waals (vdW) materials have garnered tremendous attention. The vdW ferromagnet Fe5Ge1Te2 has a Curie temperature Tc of ≈ 270 K, which is tailorable by tuning the stoichiometry and the Fe deficiency to reach room temperature.
Chih‐Yu Lee +7 more
wiley +1 more source
The finite element model is established using ABAQUS to simulate the value of temperature fields for ice-bonded-abrasive pad polishing germanium wafer.Temperature contour map and melting thickness value of the pad are obtained and the results of FEM are ...
WANG Yong +4 more
doaj
Chemical mechanical polishing (CMP) is a widely used technique in semiconductor manufacturing to achieve a flat and smooth surface on silicon wafers.
Hafiz M. Irfan +4 more
doaj +1 more source
In this study, we developed a cost‐efficient neural probe by replacing traditional gold with an aluminum‐based Ti/Al/Ni multilayer stack. Optimizing this metal architecture suppressed oxidation and ensured robust electrical stability, achieving signal quality comparable to standard gold probes. It enables a highly accessible and economical solution for
Sehwan Park +6 more
wiley +1 more source
Chemical mechanical polishing (CMP) is a critical process in semiconductor fabrication, where controlling slurry behavior at the pad-wafer interface is essential for achieving uniform material removal.
Jaesung Lee +4 more
doaj +1 more source
A GeTe‐Sb2Te3 composition spread is fabricated using RF magnetron co‐sputtering. Increasing Sb content stabilized the high‐performance cubic GeTe phase. The composition 5Sb3₇Te5₈ exhibited the highest thermoelectric performance, achieving a power factor of ∼1 mW m−1 K−2 and a maximum zT of 0.81 at 300°C.
Nur Qalishah Adanan +9 more
wiley +1 more source

