Results 81 to 90 of about 3,124 (304)

Improvement of Material Removal Rate and Within Wafer Non-Uniformity in Chemical Mechanical Polishing Using Computational Fluid Dynamic Modeling

Journal of Manufacturing and Materials Processing
Chemical mechanical polishing (CMP) is a widely used technique in semiconductor manufacturing to achieve a flat and smooth surface on silicon wafers.
Hafiz M. Irfan, Cheng-Yu Lee, Debayan Mazumdar, Yashar Aryanfar, Wei Wu   +4 more
doaj   +1 more source

Relationship between polishing performance and viscoelasticity of epoxy resin polishing pads

Nihon Kikai Gakkai ronbunshu, 2014
Polishing performances of glass using epoxy resin polishing pads from the aspect of their mechanical properties are described. Material removal rates are independent to the hardness of the epoxy resin pads.
Junji MURATA, Motomu INAZAWA, Yasuhiro TANI, Yu ZHANG   +3 more
doaj   +1 more source

The Trial of Polishing of the Single-Crystal Silicon Carbide (SiC) by an Abrasive Grain Intension Polishing Pad [PDF]

, 2008
In recent years, the single-crystal silicon carbide (SiC) attracts attention as a substrate of a power device or LED. The single-crystalSiC becomes a substrate through various processing processes.
佐藤, 誠, 山口, 幸男
core  

Engineering Oncolytic Virus‐Armed Macrophages for Enhanced Cancer Immunotherapy

Advanced Science, EarlyView.
ZIFOA‐M is engineered by conjugating oncolytic adenovirus‐loaded ZIF‐8 nanoparticles onto macrophage surfaces via bioorthogonal chemistry. Upon tumor infiltration, the platform releases OA to downregulate CD47/CD24 on tumor cells, restoring macrophage phagocytosis.
Jilong Wang, Ning Lu, Zhuo Yan, Luyi Ye, Luyao Bai, Shanshan Yuan, Yuting Zhu, Yiru Xiong, Yongheng Bai, Yaping Chen, Junjie Deng   +10 more
wiley   +1 more source

Numerical study of slurry replacement and distribution in chemical mechanical polishing using multi-zone analysis

Mathematical and Computer Modelling of Dynamical Systems
Chemical mechanical polishing (CMP) is a critical process in semiconductor fabrication, where controlling slurry behavior at the pad-wafer interface is essential for achieving uniform material removal.
Jaesung Lee, Chulsoo Im, Kangmin Choi, Bonchan Koo, Jiho You   +4 more
doaj   +1 more source

The Effect of Anterior Capsule Polishing on Capsular Contraction and Lens Stability in Cataract Patients with High Myopia

Journal of Ophthalmology, 2018
Purpose. To evaluate the effect of anterior capsule polishing in patients with high myopia after cataract surgery. Setting. The Eye Hospital of Wenzhou Medical University, Zhejiang, China. Design. Prospective study. Methods.
Dandan Wang, Xiaoyu Yu, Zhangliang Li, Xixia Ding, Hengli Lian, Jianyang Mao, Yinying Zhao, Yun-E. Zhao   +7 more
doaj   +1 more source

Study on Compound Machining of Polyurethane Polishing Pad and Cluster Abrasive Brush Based on MR Effect

, 2011
Method of compound machining is used to process single crystal silicon and SrTiO3 ceramic substrates, and the factors on effects of compound machining are studied such as magnetic field intensity, processing time, rotating speed of lapping plate and ...
Min Li, Jing Fu Chai, Qiu Sheng Yan, Jia Bin Lu   +3 more
core   +1 more source

Silicon‐Embedded Multifunctional Heterogeneous Integration for Miniaturized Photoplethysmography Detection Devices

Advanced Science, EarlyView.
ABSTRACT The multifunctional integration of chips with high flexibility and scalable manufacturing is crucial for enhancing chip performance, reducing chip size, and simplifying chip design. However, balancing volume, cost, flexibility, and functionality using traditional heterogeneous integration methods is challenging.
Lang Chen, Shizun Hu, Zhou Yang, Shitao Shen, Pan Zhang, Han Xu, Chi Zhang, Wei Wang   +7 more
wiley   +1 more source

Physics‐Informed Machine Learning for Sustainable Alloy Design: Toward a Recyclable Unified Q&P Steel

Advanced Science, EarlyView.
A physics‐informed property‐bridging framework links high‐throughput hardness screening to tensile performance in quenching and partitioning steels. By transferring metallurgically guided representations across properties, a single alloy composition is designed to achieve multiple strength grades through heat‐treatment tuning alone, offering a ...
Xiaolu Wei, Yong Li, Chenchong Wang, Lingyu Wang, Xiang Song, Keming Mao, Yu Zhang, Wei Xu   +7 more
wiley   +1 more source

A Model for Design Optimization of Electrochemical Mechanical Polishing Polish Pad [PDF]

International Journal of Mechanical Engineering and Applications, 2017
The polishing pad plays a vital role in achieving the desired removal rate and level of surface planarity during the electrochemical mechanical planarization (ECMP) process. Material removal rate (MRR) and within wafer non-uniformity (WIWNU) are two important factors in determining the polishing performance.
openaire   +1 more source