Results 101 to 110 of about 3,124 (304)
In this study, the surface topographies of chemical mechanical polishing (CMP) pad samples for varying levels of diamond microwear of a conditioner have been measured using a confocal microscope and an X-ray computer tomography (CT) scanner.
Masanori Kawakubo +2 more
core +1 more source
Stem cell differentiation follows a conserved surface condensate trajectory: H3K27ac super enhancers nucleate large RNA polymerase II clusters that grow and unfold before transcriptional activity disperses them. This work reveals how biophysical forces at enhancer surfaces dynamically build and dismantle stem cell transcription hubs, reshaping cell ...
Tim Klingberg +18 more
wiley +1 more source
Method for monitoring polishing pad used in chemical-mechanical planarization process
[[abstract]]A method for monitoring a condition of a polishing pad used in a chemical-mechanical planarization (CMP) process to polish a semiconductor wafer is disclosed.
Ho, Cheng-Hong;Liu, Kuo-Hsing
core
Modeling and mitigation of pad scratching in chemical-mechanical polishing
In the chemical-mechanical polishing (CMP) of semiconductor structures, such defects as micro- and nano-scale scratches are frequently produced on the surfaces being polished.
Chun, J. -H. +3 more
core +1 more source
An integrative single‐cell atlas across multiple metabolic diseases reveals coordinated metabolic modules and disease‐shared versus disease‐specific pathway activities. By systematically comparing scoring strategies, a robust RankAve framework is established. Coupled with network analysis and drug‐target prediction, this resource uncovers cross‐disease
Kuan Yang +10 more
wiley +1 more source
Gel‐Amin for Improving Extracellular Recordings of Cardiomyocytes in a 3D Microphysiological System
This work combines a conductive collagen‐based hydrogel with a laser‐cut and assembly technique to fabricate microphysiological systems that improve extracellular recordings of cardiomyocytes in 3D on microelectrode arrays. The inclusion of choline acrylate into GelMA imparts a higher electrical conductivity and improves the signal‐to‐noise ratio of on‐
Dominic Pizzarella +4 more
wiley +1 more source
Chemical Mechanical Polishing (CMP) is a major manufacturing step extensively used to planarize semiconductor wafers. In CMP, the polishing pad surface is glazed by residues.
Emmanuel A. Baisie +2 more
core +1 more source
Four decades of retinal vessel segmentation research (1982–2025) are synthesized, spanning classical image processing, machine learning, and deep learning paradigms. A meta‐analysis of 428 studies establishes a unified taxonomy and highlights performance trends, generalization capabilities, and clinical relevance.
Avinash Bansal +6 more
wiley +1 more source
CMP is one of the most essential processes in ULSI manufacture. However, the polishing characteristics during CMP remain unidentified because pad surface roughness such as asperity or texture is complicated and random.
Baba, A.; Faculty of Computer Science and Systems Engineering, Kyushu Institute of Technology, Fukuoka +4 more
core
Fixed abrasive chemical–mechanical polishing (CMP) is an efficient surface finishing method. The non-uniformity of substrates after polishing is one of the most interesting things in current trends in research.
Zhong, Zhao Wei +2 more
core +1 more source

