Results 91 to 100 of about 3,124 (304)

Improvement of the pad wear shape in fixed abrasive chemical-mechanical polishing for manufacturing optical components

open access: yes, 2015
Fixed abrasive chemical mechanical polishing has some advantages in generating planarity surfaces of optical components. The surface after polishing has better uniformity, and the material removal rate is much more than the traditional chemical ...
Z. W. Zhong   +5 more
core   +1 more source

In Vivo Electrochemical Monitoring of Safinamide Pharmacokinetics in the Brain Explores Its Correlation With Vision‐Related Neuronal Activity

open access: yesAdvanced Science, EarlyView.
An electrochemical platform based on differential pulse amperometry enables real‐time, selective tracking of safinamide pharmacokinetics in the living brain with high spatiotemporal resolution. When integrated with electrophysiology, this approach reveals that drug‐induced suppression of vision‐related neuronal activity provides mechanistic insight ...
Xiaoke Nan   +9 more
wiley   +1 more source

Polishing of ILD and STI by the LHA pad

open access: yesJournal of the Japan Society for Precision Engineering, Contributed Papers, 2006
This paper examines whether a polishing pad with abrasive grain can be adapted for oxide CMP (ILD CMP and STI CMP), which is currently performed by free abrasive polishing. Using the Loosely Held Abrasive (LHA) pad that is effective in the polishing of silicon wafers, silicon oxide and silicon nitride films are polished, and the polishing selectivity ...
SATO, Makoto   +2 more
openaire   +2 more sources

Enhancing Biogenic Formic Acid Production in the Modified OxFA Process by Acetonitrile Addition

open access: yesAdvanced Science, EarlyView.
In this study, the beneficial effect of using acetonitrile as a co‐solvent in the modified OxFA process is shown, outperforming methanol, demonstrating improved reaction kinetics combined with high selectivity for the HPA‐2 (H5PV2Mo10O40) catalyzed oxidation of xylose to FA.
Jan‐Dominik H. Krueger   +7 more
wiley   +1 more source

A theory of pad conditioning for chemical-mechanical polishing

open access: yes, 2004
Statistical models are presented to describe the evolution of the surface roughness of polishing pads during the pad-conditioning process in chemical-mechanical polishing.
Borucki, Leonard J.   +9 more
core   +1 more source

A Plug‐and‐Play Platform for Customizing Multivalent Degraders and Degrader‐Drug Conjugates

open access: yesAdvanced Science, EarlyView.
Membrane proteins remain challenging targets for conventional TPD approaches. Here, the authors develop UPTAB, a modular platform leveraging ultrahigh‐affinity orthogonal Im/CL protein pairs for lysosomal degradation of membrane proteins. Mono‐targeted (Type‐I), dual‐targeted (Type‐II), and tri‐targeted (Type‐III) UPTABs enable simultaneous degradation
Mengqing Zhao   +7 more
wiley   +1 more source

Pad Conditioning Density Distribution in CMP Process With Diamond Dresser

open access: yes, 2016
In the chemical-mechanical polishing (CMP) process, the pad conditioning density distribution plays a crucial role in the pad wear. A precise model and detailed analysis of a conditioning density function are required.
Feng, Tyan
core   +1 more source

Measurement of Polishing Rate as a Function of Pad Independent Abrasive Friction for Chemical Mechanical Polishing

open access: yes, 2020
Optimization of Chemical Mechanical Planarization (CMP) on integrated circuits requires an accurate model of material removal. The current model of polishing is two-body abrasion of particles trapped at the pad asperity-substrate junction, however, this
Christopher McGowan, Joseph A Levert
core   +1 more source

Making Sweat Measurable: Induction, Sampling, and Refreshment in Wearable Biofluid Sensing

open access: yesAdvanced Science, EarlyView.
Wearable sweat sensing relies not only on chemical detection but also on controlled biofluid management. This Review integrates sweat physiology, induction strategies, and microfluidic sampling architectures, demonstrating how flux, transport, and refreshment shape measurement reliability.
Soyoung Shin, Wei Gao
wiley   +1 more source

Polishing characteristics of micron particles aggregated by nanosilica

open access: yesJournal of Advanced Mechanical Design, Systems, and Manufacturing, 2015
Colloidal silica slurry has been widely used in mirror finishing of various microelectronic materials, including Si wafer. However, in the last decade, there has been a tendency to replace the polishing slurry with fixed-abrasive pads because of ...
Qi GAO, Yasuhiro TANI, Gang DONG
doaj   +1 more source

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