Results 111 to 120 of about 3,124 (304)
Towards Advanced Intelligent and Perceptive Soft Grippers
Implementing soft yet strong and intelligent soft grippers request innovative and creative solutions in designing soft bodies and seamlessly integrating actuated systems with hierarchical sensing. This review systematically analyses soft grippers with a deep understanding of core components, from fundamental design principles to actuation and sensing ...
Haneul Kim +4 more
wiley +1 more source
Soft Active Electromyography Interface for Machine Learning‐Enabled Silent Speech Recognition
A soft, hand‐worn electromyography interface enables intent‐driven silent speech recognition without continuous facial attachment. The device integrates liquid‐metal interconnects, a transparent flexible circuit, and elastomer encapsulation with a fingertip electrode that contacts perioral muscles only on demand.
Yuta Kurotaki +8 more
wiley +1 more source
The influence of sub-surface damage microstructure on ultra-thin die flexural strength
In the semiconductor industry, where miniaturization is a key driver, mechanical properties of ultra-thin dies are increasingly important research topics.
Liu Shu +5 more
doaj +1 more source
The Role of Pad Topography in Chemical-Mechanical Polishing
In this paper, the role of pad topography on material removal rate (MRR) in chemical-mechanical polishing (CMP) is investigated. First, based on the mechanics of pad/particle and particle/wafer sliding contacts at an asperity of the polishing pad a new ...
Kim, Sanha +2 more
core +1 more source
Abstract Domesticated European rabbits (Oryctolagus cuniculus) have long been chosen as laboratory model organisms. Despite this, there has been no definitive study of the vertebral musculature of wild rabbits. Relevant descriptions of well‐studied veterinary model mammals (such as dogs) are generally applicable, but not appropriate for a species ...
Nuttakorn Taewcharoen +3 more
wiley +1 more source
Layered materials, such as bismuth, offer exceptional properties for future integrated circuits (ICs). Research is underway to adapt these materials to conventional IC manufacturing processes, such as chemical mechanical polishing (CMP). However, the CMP
Yushan Chen +8 more
doaj +1 more source
Chemical mechanical polishing (CMP) is widely used to planarize semiconductor wafers and smooth the wafer surface. In CMP, diamond disc conditioning is traditionally employed to restore pad planarity and surface asperity.
Xiaohong Zhang +3 more
core +1 more source
Early Pliocene Varanus (Squamata, Varanidae) remains from Megalo Emvolon, Thessaloniki, Greece
The article describes new cranial and postcranial varanid material from Megalo Emvolon Lower Pliocene vertebrate fossil site near Thessaloniki. The fossils, likely representing a single individual, are referred to Varanus cf. marathonensis. Abstract This study describes new fossil varanid material from a recently discovered fossil spot (MVL site) at ...
Chara Drakopoulou +3 more
wiley +1 more source
Chemical mechanical polishing (CMP) is a key process for global planarization of silicon wafers for semiconductors and AlTiC wafers for magnetic heads. Removal rate of wafer material is directly dependent on the surface roughness of a CMP pad, thus the ...
Lee, Byeong Ha +9 more
core +1 more source
Abstract Prozostrodon brasiliensis, a probainognathian cynodont of the clade Prozostrodontia, is recognized as a key taxon for understanding the origin of Mammaliaformes and mammals. Despite detailed investigations of its cranial anatomy, the postcranial skeleton has received comparatively less attention.
Iasmim M. Michelotti +4 more
wiley +1 more source

