Results 121 to 130 of about 3,124 (304)
As features on integrated circuits continue to grow smaller, they become more susceptible to damage from sequential planarization steps during fabrication. As planarization (known as chemical mechanical planarization, or simply CMP) is preformed multiple
McGowan, Christopher
core
7000 Years of Aboriginal Mining at Sugarloaf Hill in the Riverland Region of South Australia
ABSTRACT Silcrete and chert are commonly represented in Aboriginal archaeological lithic assemblages across large parts of the southwestern Murray‐Darling Basin (MDB). In South Australia (SA), these materials were sourced from a series of quarries located along the incised course of the Murray River through the upper Riverland region.
Craig Westell +8 more
wiley +1 more source
ABSTRACT Background Replacing a portion of polished rice with intermediate wheatgrass (IWG) could diversify raw materials for sake, but its effects on composition and fermentation outcomes are not well characterized. The objective of this study was to quantify how adjunct form (whole vs.
Takehiro Murai +2 more
wiley +1 more source
Effect of CMP Pad and Slurry to STI and ILD Polishing
STI (Shallow-Trench-Isolation) and ILD (Inter-layer-Dielectric polishing steps are important polish stages in FEOL (Front-End- of-Line) due to the early stage of transistor device formation. In recent years, ceria based slurries have been used in STI and
David Huang +3 more
core +1 more source
Keggin‐type Al‐POM‐coated silica achieves selective surface oxidation of amorphous carbon through electrostatic attraction and proton‐coupled oxidation, tailoring interfacial properties for lithium‐ion batteries and semiconductor processes. ABSTRACT Amorphous carbon is widely used in energy storage and semiconductor technologies, where surface ...
Ganggyu Lee +13 more
wiley +1 more source
Polishing performance of magnetorheological elastomer pad for single-crystal silicon
Single-crystal silicon optical components are extensively utilized in sophisticated high-end equipment, such as X-ray space telescopes and high-energy laser systems.
Changsheng Li +6 more
doaj +1 more source
Dual‐Field Synergistic Orientation of Carbon Fibers for High‐Efficiency Thermal Management
The sample fabricated by synergistically combining reversed electric and low magnetic fields, with photocurable PEG/PPG gel serving as the matrix, exhibits excellent machinability and flexibility. Meanwhile, the thermal conductivity enhancement efficiency of this work is 1351%, significantly superior to similar carbon fiber composite materials ...
Zujian Zhao +15 more
wiley +1 more source
Chemical-mechanical wear mechanism in polyurethane polishing pad materials
In the highly competitive and lucrative industry of semiconductors, the effectiveness of the Chemical Mechanical Polishing (CMP) process is crucial for developing smaller device technologies. In this study, the structure of the two-layered stacked IClOOO/
Li, Irene
core
Mechanism of wettability alteration, interfacial tension reduction, and oil recovery by novel nanocomposite. Abstract The development of stable nanofluids (NFs) for enhanced oil recovery (EOR) relies on optimizing interactions between reservoir rocks and fluids.
Ehsan Jafarbeigi +2 more
wiley +1 more source
Investigation of a Polishing Pad and a Carrier Film for Decreasing Edge Roll Off of Workpiece
Demand for diminishing edge roll off of workpiece has rapidly increased, especially in polishing silicon wafers and glass disks. However, the conventional polishing technologies cannot meet the demand.
Wen Xiao Wang +3 more
core +1 more source

