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Comparison of the Forward Voltage Drop of Si and SiC High Voltage Diodes
ECS Meeting Abstracts, 2014To obtain a high coefficient of efficiency of a converter, the components used to build it should be well chosen. Significant part of the losses is due to the power semiconductor switches. For the same break down voltage, SiC bipolar device have significantly thinner lightly doped drift region (n- base) and therefore low switching losses and also low ...
Tanya Gachovska, Jerry L Hudgins
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Methods for reducing the forward voltage drop in pseudospark switches
Conference Record of the Twenty-Fifth International Power Modulator Symposium, 2002 and 2002 High-Voltage Workshop., 2003The paper describes the methods, which can be used in the pseudospark switches to decrease the forward voltage drop in initial glow stages of the discharge burning. The main direction of reducing the discharge burning voltage is a use of a special design of the electrode system and a special design of the cathode cavity.
V.D. Bochkov +8 more
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A design concept for the low forward voltage drop 4500 V trench IGBT
Proceedings of the 10th International Symposium on Power Semiconductor Devices and ICs. ISPSD'98 (IEEE Cat. No.98CH36212), 2002A design concept for a new trench IGBT structure for low forward voltage drop is described. The low forward voltage drop can be achieved by minimizing the p-base region to increase the hole density of the n-base near the emitter side, and by simultaneously keeping MOS channel resistance low.
T. Nitta +8 more
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High-level behavior of power rectifiers: A quantitative analysis of the forward voltage drop
IEEE Transactions on Electron Devices, 1978In forward biased power rectifiers, quasi-neutrality holds in all regions of the device. As a consequence, numerical analysis of the behavior of the devices can be carried out without involving the treatment of Poisson's equation. This allows fast and accurate computation of the forward J(V) characteristic.
A. Munoz-Yague, P. Leturcq
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Fast‐switching‐speed, low‐forward‐voltage‐drop static induction (SI) thyristor
Electrical Engineering in Japan, 1996AbstractA static induction (SI) thyristor using a normally‐off planar‐gate structure in a low power class has been developed to be used as a power switching device in a three‐phase inverter circuit. A 600 V‐15 A class SI thyristor with very fast switching time (tgt, tgq) and low forward voltage drop (VTM) was designed and created.
Mitsuhide Maeda +3 more
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Factors determining forward voltage drop and forward blocking in the field terminated diode (FTD)
1977 International Electron Devices Meeting, 1977Using exact numercial solutions of the full set of semiconductor device equations the field terminated diode (FTD) structure is investigated. It is shown that the grid structure reduces current flow by causing the electron current to funnel around the grid and at the same time diverting hole current through the grid.
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Dual-channel SOI LIGBT with improved latch-up and forward voltage drop characteristics
Device Research Conference. Conference Digest (Cat. No.01TH8561), 2002To improve latch-up and forward voltage drop properties of the silicon-on-insulator (SOI) lateral insulated gate bipolar transistor (LIGBT), a new dual-channel structure is proposed and fabricated in this paper. The dual-channel structure is employed to enable more electrons to flow into the n-drift layer and improve the latch-up characteristic.
null Woo-Beom Choi +3 more
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Factors determining forward voltage drop in the field-terminated diode (FTD)
IEEE Transactions on Electron Devices, 1978Recently, there has been a revival of interest in a device first introduced in the early sixties and called the "gridistor" and currently referred to as the "FTD." The FTD offers the promise of low forward drop of the SCR together with the higher switching speeds and freedom from dV/dt and di/dt problems of the transistor.
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EXPERIMENTAL DEMONSTRATION OF 1200V SiC-SBDs WITH LOWER FORWARD VOLTAGE DROP AT HIGH TEMPERATURE
SAE Technical Paper Series, 2011<div class="section abstract"><div class="htmlview paragraph">The 1200V class silicon carbide Schottky barrier diodes were designed and fabricated. The drift layer resistance was reduced in order to realize low forward voltage drops. Since the low drift layer resistance led to the low breakdown voltage, the avalanche withstanding capability
Takashi Tsuji +4 more
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Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 1998
Abstract The electron linear accelerator ALIN-10 has been used to irradiate at room temperature and high temperature silicon diodes type BA159, BAX157 and 6DRR1 (manufacturer – Baneasa S.A.-factory 2300, Romania). The influence of 10 MeV electron irradiation upon the main electrical characteristics (reverse recovery time, forward voltage, reverse ...
Elena Iliescu +4 more
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Abstract The electron linear accelerator ALIN-10 has been used to irradiate at room temperature and high temperature silicon diodes type BA159, BAX157 and 6DRR1 (manufacturer – Baneasa S.A.-factory 2300, Romania). The influence of 10 MeV electron irradiation upon the main electrical characteristics (reverse recovery time, forward voltage, reverse ...
Elena Iliescu +4 more
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