Results 281 to 290 of about 85,934 (320)
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An area efficient gate-all-around ring MOSFET
2016 IEEE Silicon Nanoelectronics Workshop (SNW), 2016This paper proposes an area efficient gate-all-around ring (GAAR) MOSFET structure for vertical integration, which in essence is an arc-shaped double-gate FinFET and gains benefits of the superior gate control in GAA MOSFETs and feasible manufacturability.
Ya-Chi Huang +2 more
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CMOS-compatible gate-all-around silicon nanowire detector
2011 IEEE SENSORS Proceedings, 2011In this paper, we demonstrate gate-all-around (GAA) single crystalline nanowires (SiNWs) that are fabricated using top-down standard CMOS front-end processes. The GAA silicon nanowires are fabricated in well-defined locations with high-quality electrical contacts, and controlled geometry and alignment.
Maryam Ziaei-Moayyed, Murat Okandan
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Vertical GeSn/Ge Heterostructure Gate-All-Around Nanowire p-MOSFETs
ECS Transactions, 2022A process for the fabrication of vertical gate-all-around (GAA) nanowire p-FETs with diameters of down to 20 nm based on Ge and GeSn/Ge-heterostructures is presented. The resulting Ge-based devices exhibit a low subthreshold slope (SS) of 66 mV/dec, a low drain-induced barrier lowering of 35 mV/V and an I on/I off ...
Junk, Yannik +6 more
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From Gate-all-Around to Nanowire MOSFETs
2007 International Semiconductor Conference, 2007The classical MOSFET is reaching its scaling limits and "end-of-roadmap" alternative devices are being investigated. Amongst the different types of SOI devices proposed, one clearly stands out: the multigate field-effect transistor (multigate FET). This device has a general "wire-like" shape.
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Device Simulation on Gate-All-Around Cylindrical Transistor
2010 International Conference on System Science, Engineering Design and Manufacturing Informatization, 2010In this paper, we reported TCAD study on gate-all-around cylindrical (GAAC) transistor for sub-10 nm scaling. The GAAC transistor device physics, TCAD simulation have been discussed. Among all other novel FinFET devices, the gate-all-around cylindrical device can be particularly applied for reducing the problems of the conventional multi-gate FinFET ...
Deyuan Xiao +5 more
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AFM characterization for Gate-All-Around (GAA) devices
Metrology, Inspection, and Process Control for Microlithography XXXIV, 2020As development of stacked Nanosheet Gate All-Around (GAA) transistor continues as the candidate technology for future nodes, several key process points remain difficult to characterize effectively. With the GAA device strategy, it is critical to have an inline solution that can provide a readout of physical dimensions that have an impact on the ...
Mary A. Breton +8 more
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Buckling characterization of gate all around silicon nanowires
SPIE Proceedings, 2013Imaging of suspended silicon nanonwires (SiNW) by SEM reveals that some of the SiNW are buckled. Buckling can impact device performance and it is therefore important to characterize this phenomenon. Measuring the buckling of suspended silicon nanowires (SiNW) poses significant challenges: (1) Small dimensions - SiNW are made with diameters ranging from
Shimon Levi +7 more
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Characteristics of GaN-Based Nanowire Gate-All-Around (GAA) Transistors
Journal of Nanoscience and Nanotechnology, 2020We investigate the DC, C–V, and pulse performances in GaN-based nanowire gate-all-around (GAA) transistors with two kinds of geometry: one is AlGaN/GaN heterostructure with two dimensional electron gas (2DEG) channel and the other is only GaN layer without 2DEG channel.
Ki-Sik, Im +6 more
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Gate-all-around silicon nanowire MOSFETs and circuits
68th Device Research Conference, 2010We demonstrate undoped-body, gate-all-around (GAA) Si nanowire (NW) MOSFETs with excellent electrostatic scaling. These NW devices, with a TaN/Hf-based gate stack, have high drive-current performance with NFET/PFET I DSAT = 825/950 µA/µm (circumference-normalized) or 2592/2985 µA/µm (diameter-normalized) at supply voltage V DD = 1 V and off-current I
J. W. Sleight +12 more
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Gate-all-around Twin Silicon nanowire SONOS Memory
2007 IEEE Symposium on VLSI Technology, 2007We have developed gate-all-around (GAA) SONOS with ultra thin twin silicon nanowires for the first time. By using channel hot electron injection (CHEI) and hot hole injection (HHI) mechanisms, program speed of 1 mus at Vd = 2 V, Vg = 6 V and erase speed of 1 ms at Vd = 4.5 V, Vg = -6 V are achieved with 2~3 nm nanowire and 30 nm gate.
Sung Dae Suk +12 more
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