Results 61 to 70 of about 419,468 (275)

Thermal softening-suppressed inter-granular embrittlement of polycrystalline 3C-SiC under diamond cutting

Materials & Design, 2022
While the deformation behavior of grain boundaries has a strong impact on the mechanical response of polycrystalline materials, investigating the coupled thermal–mechanical properties of grain boundaries in their real formats is crucial for enhancing the
Liang Zhao, Jianguo Zhang, Yufan Fu, Junjie Zhang, Alexander Hartmaier, Tao Sun   +5 more
doaj   +1 more source

What limits supercurrents in high temperature superconductors? A microscopic model of cuprate grain boundaries

, 2009
The interface properties of high-temperature cuprate superconductors have been of interest for many years, and play an essential role in Josephson junctions, superconducting cables, and microwave electronics.
A Gurevich, B. M. Andersen, BM Andersen, BM Andersen, C-R Hu, D Dimos, FC Zhang, G Hammerl, H Hilgenkamp, ID Brown, J. Mannhart, JC Slater, JK Freericks, M Sigrist, M Sigrist, O Chmaissem, P Chaudhari, P Liu, P. J. Hirschfeld, R. Gutser, RC Baetzold, S Lee, S. Graser, SJ Pennycook, SR Phillpot, SV Stolbov, T Löfwander, T Yokoyama, T. Kopp, WA Harrison, X Zhang, Y Tanaka, Y Tanaka, Y Tanaka, YuS Barash   +34 more
core   +1 more source

Harnessing Fungal Biowelding for Constructing Mycelium‐Engineered Materials

Advanced Engineering Materials, EarlyView.
Mycelium‐bound composites (MBCs) offer low‐carbon alternatives for construction, yet interfacial bonding remains a critical challenge. This review examines fungal biowelding as a biocompatible adhesive, elucidating mycelium‐mediated interfacial mechanisms and their role in material assembly. Strategies to optimize biowelding are discussed, highlighting
Xue Brenda Bai, Xinrui Sarah Niu, Zhao Qin   +2 more
wiley   +1 more source

Unveiling electron scattering mechanism at Al-doped grain boundaries in Cu interconnects

Materials & Design
Doping by capping layers followed by thermal diffusion is an effective way to improve electromigration reliability in Cu interconnects and extend the lifetime of electronic devices.
Xinyu Jin, Xiangyu Ren, Guoxiang Cui, Shenghong Ju, Tao Hang, Ming Li, Yunwen Wu   +6 more
doaj   +1 more source

A Grain Boundary Regulates the Friction Behaviors between Graphene and a Gold Substrate

Crystals, 2019
The nanofriction of graphene is critical for its broad applications as a lubricant and in flexible electronics. Herein, using a Au substrate as an example, we have investigated the effect of the grain boundary on the nanofriction of graphene by means of ...
Pinxuan He, Qiang Cao, Pengjie Wang, Huaipeng Wang, Shaolong Zheng, Shuting Lei, Sheng Liu, Qing Peng   +7 more
doaj   +1 more source

Special Grain Boundaries in Ultrafine-Grained Tungsten

Nanoscale Research Letters, 2016
Field ion microscopy and computer simulation were used for the study of an atomic structure high-angle grain boundary in hard-drawn ultrafine-grained tungsten wire. These boundaries with special misorientations are beyond the scope of the coincident site lattice model.
Dudka, O. V., Ksenofontov, V. A., Sadanov, E. V., Starchenko, I. V., Mazilova, T. I., Mikhailovskij, I. M.   +5 more
openaire   +2 more sources

Direct observation of nanometer-scale amorphous layers and oxide crystallites at grain boundaries in polycrystalline Sr1-xKxFe2As2 superconductors

, 2011
We report here an atomic resolution study of the structure and composition of the grain boundaries in polycrystalline Sr0.6K0.4Fe2As2 superconductor. A large fraction of grain boundaries contain amorphous layers larger than the coherence length, while ...
Gao, Zhaoshun, Li, Kun, Ma, Yanwei, Qi, Yanpeng, Wang, Chunlei, Wang, Dongliang, Wang, Lei, Wang, Qingxiao, Yao, Chao, Zhang, Xianping, Zhang, Xixiang   +10 more
core   +1 more source

On the boundary-layer structure of patterns of convection in rectangular-planform containers [PDF]

, 1999
This paper considers the structure of steady-state solutions of the Swift–Hohenberg equation describing convection in shallow rectangular-planform containers heated from below.
Daniels, P.G., Lee, A. T.
core   +1 more source

Recent Progress in Oxide‐Based Na‐Ion Conductors

Advanced Engineering Materials, EarlyView.
Recent advances in oxide‐based sodium‐ion conductors are reviewed, focusing on β/β″‐alumina, NASICON‐type compounds, and Na5YSi4O12‐type (N5) silicates, together with emerging perovskite and layered oxides. Improvements in ionic conductivity, compositional tuning, and processing are highlighted.
Bowei Xun, Jian Wang, Hubertus Rainaldo Arindra, Katsuro Hayashi   +3 more
wiley   +1 more source

Dislocation interactions mediated by grain boundaries

, 2008
The dynamics of dislocation assemblies in deforming crystals indicate the emergence of collective phenomena, intermittent fluctuations and strain avalanches.
Fetter A L, Hall E O, Hirth J P, Landau L D, Lasse Laurson, Leoni F, Mikko J Alava, Paolo Moretti, Petch N J, Weiss J, Zaiser M   +10 more
core   +1 more source