Results 121 to 130 of about 2,429 (186)

Development of a Cystic Fibrosis Weight Management Programme:  protocol for a co-design study. [PDF]

open access: yesNIHR Open Res
Barrett J   +5 more
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ASM-HEMT: Compact model for GaN HEMTs

2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC), 2015
In this paper, we aim to present the Advances Spice Model for High Electron Mobility Transistors (ASM-HEMT). The model is currently being considered in the second phase of industry standardization by the Compact Model Coalition (CMC). The presented physical model is surface potential based and is computationally efficient by virtue of being completely ...
Avirup Dasgupta   +3 more
openaire   +1 more source

Compare noise characteristic of DC-HEMT and HEMT

2013 21st Iranian Conference on Electrical Engineering (ICEE), 2013
We compare noise characteristics of Al0.3Ga0.7N /GaN/ Al0.06Ga0.94N/GaN DC-HEMT and Al0.3Ga0.7N /GaN HEMT. The DC-HEMT exhibits high gain and high current and low noise. The noise characteristics are calculated as a function of gate voltage as well as drain voltage. The noise curve versus gate voltage also shows three regions.
Sonia Sadeghi   +2 more
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GaN HEMT reliability

Microelectronics Reliability, 2009
This paper reviews the experimental evidence behind a new failure mechanism recently identified in GaN high-electron mobility transistors subject to electrical stress. Under high voltage, it has been found that electrically active defects are generated in the AlGaN barrier or at its surface in the vicinity of the gate edge.
Jesús A. del Alamo, Jungwoo Joh
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Comparison of electrical characteristics of metamorphic HEMTs with InP HEMTs and PHEMTs

Extended Abstracts of the 2002 International Conference on Solid State Devices and Materials, 2002
Metamorphic In0.52Al0.48As/In0.53Ga0.47As high electron mobility transistors (MHEMTs) were fabricated on GaAs substrates. A step-graded InAlAs buffer layer was used to relax the lattice mismatch between the active layers and the substrates. The electrical characteristics of the MHEMTs were compared with those of HEMTs on InP substrates (InP HEMTs) and ...
Kenji Kawada   +6 more
openaire   +1 more source

High-Temperature HEMT Model

IEEE Transactions on Electron Devices, 2022
Taking into account the impact of self-heating and temperature rise effects, this work presents a physics-based analytical model for HEMTs, operating continuously from room temperature to high temperatures in linear and saturation regimes. Relying on the core Ecole Polytechnique Federale de Lausanne (EPFL) HEMT model, the temperature dependence of ...
Nika Sahebghalam   +3 more
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High-speed MSM/HEMT and p-i-n/HEMT monolithic photoreceivers

IEEE Transactions on Microwave Theory and Techniques, 2002
The design, fabrication, and performance of monolithically integrated MSM-HEMT and PIN-HEMT photoreceivers are described. PIN-HEMT photoreceivers with 701 /spl Omega/ of transimpedance over an 8.3 GHz bandwidth have been fabricated, and the sensitivity was measured and found to be -17.7 dBm at 10 Gb/s and -15.8 dBm at 12 Gb/s for a 2/sup 31/-1 pattern ...
P. Fay, C. Caneau, I. Adesida
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Enhancement‐mode AlGaN/GaN HEMT and MIS‐HEMT technology

physica status solidi (a), 2010
AbstractAlGaN/GaN heterostructure devices are capable of delivering high‐frequency power amplifiers and power switches with performances far superior than those offered by the mainstream silicon technology and other advanced semiconductor technologies.
Chen, Kevin J., Zhou, Chunhua
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p-HEMT with tailored field

Microelectronics Journal, 2003
The high electron mobility in heterostructure devices stems from fact that electrons are injected into intrinsic layer of a semiconductor material and are confined into two-dimensional space of a heterostructure potential. However, non-linear distribution of the voltage along a transistor channel results in variation of depth and width of ...
Samson Mil'shtein   +3 more
openaire   +1 more source

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