Results 51 to 60 of about 36,186 (209)

Reducing switching losses through MOSFET-IGBT combination [PDF]

open access: yes, 2008
This paper introduces a configuration aimed at switching losses reduction trough a power leg constructed by combining a MOSFET and an IGBT. The combined use of these different switches leads to the turn-on losses reduction trough the use of the faster ...
Marinov, Angel   +2 more
core  

Multiterminal High‐Voltage Direct Current Projects: A Comprehensive Assessment and Future Prospects

open access: yesHigh Voltage, EarlyView.
ABSTRACT Multiterminal high‐voltage direct current (MT‐HVDC) systems are an important part of modern power systems, addressing the need for bulk power delivery and efficient renewable energy integration. This paper provides a comprehensive overview of recent advances in MT‐HVDC technology, including launched projects and ongoing initiatives.
Mohammad Hossein Mousavi   +3 more
wiley   +1 more source

Comparative Study on Application of Hybrid SiC IGBT Device and Si IGBT Device in Rail Transit

open access: yes机车电传动, 2020
Hybrid SiC IGBT uses SiC Schottky diode to replace the anti-parallel diode in traditional IGBT devices, which can reduce the diode reverse recovery loss and IGBT turn-on loss.
Wei TIAN   +6 more
doaj  

A New SiC Planar-Gate IGBT for Injection Enhancement Effect and Low Oxide Field

open access: yesEnergies, 2020
A new silicon carbide (SiC) planar-gate insulated-gate bipolar transistor (IGBT) is proposed and comprehensively investigated in this paper. Compared to the traditional SiC planar-gate IGBT, the new IGBT boasts a much stronger injection enhancement ...
Meng Zhang   +4 more
doaj   +1 more source

Optimal edge termination for high oxide reliability aiming 10kV SiC n-IGBTs [PDF]

open access: yes, 2019
The edge termination design strongly affects the ability of a power device to support the desired voltage and its reliable operation. In this paper we present three appropriate termination designs for 10kV n-IGBTs which achieve the desired blocking ...
,   +9 more
core   +1 more source

The Diverse Behaviours of Discharged Degradation at Varied Interfaces of Silicone Gel/Ceramic Substrates Under High‐Frequency Square Wave Voltage

open access: yesHigh Voltage, EarlyView.
ABSTRACT Because of the harsh serving conditions of insulated gate bipolar transistor (IGBT) packaged by silicone gel with high voltage and high frequency, it is crucial to reveal the developing characteristics and inhibiting method of discharged degradation at the interface of silicone gel/ceramic substrates.
Chuang Zhang   +7 more
wiley   +1 more source

Electric vehicle battery performance investigation based on real world current harmonics [PDF]

open access: yes, 2020
Electric vehicle (EV) powertrains consist of power electronic components as well as electric machines to manage the energy flow between different powertrain subsystems and to deliver the necessary torque and power requirements at the wheels.
Amamra, Sid-Ali   +4 more
core   +1 more source

Lifetime Evaluation of Traction Converter IGBT Based on Operating Conditions and Component Aging

open access: yesKongzhi Yu Xinxi Jishu, 2022
IGBT's lifetime is greatly influenced by the operation conditions of train and the current aging degree of IGBT. However, the influences of train operation conditions and current life of an IGBT on the life assessment are normally not considered.
LI Dong   +5 more
doaj   +1 more source

Vibration control of resonant vibratory feeders with electromagnetic excitation [PDF]

open access: yesFME Transactions, 2014
The vibratory feeders with electromagnetic excitation called electromagnetic vibratory feeders (EMVF) are commonly used for performing gravimetric flow of granular and particulate materials in processing industry.
Despotović Željko V.   +3 more
doaj  

Probabilistic approaches and reliability design of power modules [PDF]

open access: yesInternational Journal for Simulation and Multidisciplinary Design Optimization, 2008
The weak point for the standard power IGBT modules in terms of reliability is thermal fatigue in solder joints due to the thermal stress induced by constitutive materials with different coefficients of thermal expansion (CTE). So far, many researches are
Micol A.   +4 more
doaj   +1 more source

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