Results 1 to 10 of about 11,836 (193)
Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling [PDF]
Micromachines, 2022 With the increase of power level and integration in electric vehicle controllers, the heat flux of the key silicon-based IGBT (Insulated Gate Bipolar Transistor) device has reached its physical limit.
Lipeng Tan +5 more
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Thermal Performance Analysis of IGBT Module Packaging
机车电传动, 2013 Afinite element model of IGBT module packaging was constructed by utilizing FEAsoftware of ANSYS. Effect of different grease thickness, equivalent heat transfer coefficient, base plate thickness and material, solder thickness and material, substrate ...
DING Jie +4 more
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Research on Residual Life of IGBT Module on EMU in Advanced Repair Based on Power Cycles
Kongzhi Yu Xinxi Jishu, 2023 The insulated gate bipolar transistor (IGBT) module is one of the weakest links in the traction converter system. Accurate life and reliability assessment of the IGBT module is particularly important for safe operation of the traction converter system ...
JIANG Jie, LI Nan
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Effect of Solder Layer Void Damage on the Temperature of IGBT Modules
Micromachines, 2023 Solder layer void is one of the main failure causes of power semiconductor devices, which will seriously affect the reliability of the devices. In this study, a 3D model of IGBT (Insulated Gate Bipolar Transistor) packaging was built by DesignModeler ...
Pengpeng Xu +3 more
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A Review of Thermal Design for IGBT Module
Zhongguo dianli, 2020 In this paper, the thermal characteristics and thermal design of IGBT module are reviewed. Firstly, the thermal network model and its dependence on the packaging material’s thermal performance and dimensions are addressed.
Guoyou LIU +5 more
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Shanghai Jiaotong Daxue xuebao, 2023 In order to improve the accuracy of remaining useful life (RUL) prediction of insulated gate bipolar transistor(IGBT) modules across working conditions to enhance their reliability, an RUL prediction method based on the ProbSparse self-attention ...
ZHONG Zhiwei, WANG Yuxiang, HUANG Yixiang, XIAO Dengyu, XIA Pengcheng, LIU Chengliang
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Thermal Impedance Model of High Power IGBT Modules Considering Heat Coupling Effects [PDF]
, 2014 Thermal loading of Insulated Gate Bipolar Transistor (IGBT) modules is important for the reliability performance of power electronic systems, thus the thermal information of critical points inside module like junction temperature must be accurately ...
Bahman, Amir Sajjad +2 more
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Thermal Resistance Distribution Experiment of Parallel Sub-Module in Press-Pack IGBT Device
Zhongguo dianli, 2020 In the rigid Press-Pack IGBT module, the pressure distribution of parallel chips determines the contact thermal resistance and contact electrical resistance directly.
Lubin HAN, Lin LIANG, Yong KANG
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Stress warpage analysis of IGBT module package reflow soldering
Xi'an Gongcheng Daxue xuebao, 2021 In order to explore the impact of reflow soldering process on power device packaging, a 3D package model based on insulated gate bipolar transistor (IGBT) module was established using DesignModeler, and then ANSYS software was used to perform thermal ...
Lipeng TAN +4 more
doaj +1 more source
Active power losses distribution methods for the modular multilevel converter [PDF]
, 2016 Modular Converters such as the MMC have become the new standard in VSC-HVDC applications. Their modularity has brought many industrial advantages but also increased the complexity of their operation.
Merlin, MMC, Mitcheson, PD
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