Results 11 to 20 of about 11,950 (180)

Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling [PDF]

open access: yesMicromachines, 2022
With the increase of power level and integration in electric vehicle controllers, the heat flux of the key silicon-based IGBT (Insulated Gate Bipolar Transistor) device has reached its physical limit.
Lipeng Tan   +5 more
doaj   +4 more sources

Estimation Technique for IGBT Module Junction Temperature in a High-Power Density Inverter

open access: yesMachines, 2023
During the last few decades, insulated-gate bipolar transistor (IGBT) power modules have evolved as reliable and useful electronic parts due to the increasing relevance of power inverters in power infrastructure, reliability enhancement, and long-life ...
Ahmed H. Okilly   +6 more
doaj   +3 more sources

Health Condition Assessment of Base-Plate Solder for Multi-Chip IGBT Module in Wind Power Converter

open access: yesIEEE Access, 2019
The base-plate solder fatigue of the IGBT module is one of the failures of the wind power converter; however, the existing health condition monitoring method based on infrared thermography is difficult to be applied to the actual applications.
Yaogang Hu   +3 more
doaj   +3 more sources

Research on Residual Life of IGBT Module on EMU in Advanced Repair Based on Power Cycles

open access: yesKongzhi Yu Xinxi Jishu, 2023
The insulated gate bipolar transistor (IGBT) module is one of the weakest links in the traction converter system. Accurate life and reliability assessment of the IGBT module is particularly important for safe operation of the traction converter system ...
JIANG Jie, LI Nan
doaj   +3 more sources

Effect of Solder Layer Void Damage on the Temperature of IGBT Modules

open access: yesMicromachines, 2023
Solder layer void is one of the main failure causes of power semiconductor devices, which will seriously affect the reliability of the devices. In this study, a 3D model of IGBT (Insulated Gate Bipolar Transistor) packaging was built by DesignModeler ...
Pengpeng Xu   +3 more
doaj   +1 more source

A Review of Thermal Design for IGBT Module

open access: yesZhongguo dianli, 2020
In this paper, the thermal characteristics and thermal design of IGBT module are reviewed. Firstly, the thermal network model and its dependence on the packaging material’s thermal performance and dimensions are addressed.
Guoyou LIU   +5 more
doaj   +1 more source

Deep learning‐based auto‐contouring for organs at risk in three‐dimensional image‐guided brachytherapy for cervical cancer and endometrial cancer [PDF]

open access: yesJ Appl Clin Med Phys
Abstract Background Automatic contouring can reduce the time required for delineating organs at risk (OARs) in brachytherapy planning and minimize interobserver variability. Purpose This study aimed to develop and evaluate a deep learning‐based automatic contouring model for OARs in three‐dimensional image‐guided brachytherapy (3D‐IGBT) for cervical ...
Takahashi K   +11 more
europepmc   +2 more sources

Remaining Useful Life Prediction of IGBT Modules Across Working Conditions Based on ProbSparse Self-Attention

open access: yesShanghai Jiaotong Daxue xuebao, 2023
In order to improve the accuracy of remaining useful life (RUL) prediction of insulated gate bipolar transistor(IGBT) modules across working conditions to enhance their reliability, an RUL prediction method based on the ProbSparse self-attention ...
ZHONG Zhiwei, WANG Yuxiang, HUANG Yixiang, XIAO Dengyu, XIA Pengcheng, LIU Chengliang
doaj   +1 more source

Thermal Resistance Distribution Experiment of Parallel Sub-Module in Press-Pack IGBT Device

open access: yesZhongguo dianli, 2020
In the rigid Press-Pack IGBT module, the pressure distribution of parallel chips determines the contact thermal resistance and contact electrical resistance directly.
Lubin HAN, Lin LIANG, Yong KANG
doaj   +1 more source

Stress warpage analysis of IGBT module package reflow soldering

open access: yesXi'an Gongcheng Daxue xuebao, 2021
In order to explore the impact of reflow soldering process on power device packaging, a 3D package model based on insulated gate bipolar transistor (IGBT) module was established using DesignModeler, and then ANSYS software was used to perform thermal ...
Lipeng TAN   +4 more
doaj   +1 more source

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