Results 1 to 10 of about 745 (181)
Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling [PDF]
Micromachines, 2022 With the increase of power level and integration in electric vehicle controllers, the heat flux of the key silicon-based IGBT (Insulated Gate Bipolar Transistor) device has reached its physical limit.
Lipeng Tan +5 more
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A Review of Thermal Design for IGBT Module
Zhongguo dianli, 2020 In this paper, the thermal characteristics and thermal design of IGBT module are reviewed. Firstly, the thermal network model and its dependence on the packaging material’s thermal performance and dimensions are addressed.
Guoyou LIU +5 more
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Estimation Technique for IGBT Module Junction Temperature in a High-Power Density Inverter
Machines, 2023 During the last few decades, insulated-gate bipolar transistor (IGBT) power modules have evolved as reliable and useful electronic parts due to the increasing relevance of power inverters in power infrastructure, reliability enhancement, and long-life ...
Ahmed H. Okilly +6 more
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Health Condition Assessment of Base-Plate Solder for Multi-Chip IGBT Module in Wind Power Converter
IEEE Access, 2019 The base-plate solder fatigue of the IGBT module is one of the failures of the wind power converter; however, the existing health condition monitoring method based on infrared thermography is difficult to be applied to the actual applications.
Yaogang Hu +3 more
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Research on Residual Life of IGBT Module on EMU in Advanced Repair Based on Power Cycles
Kongzhi Yu Xinxi Jishu, 2023 The insulated gate bipolar transistor (IGBT) module is one of the weakest links in the traction converter system. Accurate life and reliability assessment of the IGBT module is particularly important for safe operation of the traction converter system ...
JIANG Jie, LI Nan
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Effect of Solder Layer Void Damage on the Temperature of IGBT Modules
Micromachines, 2023 Solder layer void is one of the main failure causes of power semiconductor devices, which will seriously affect the reliability of the devices. In this study, a 3D model of IGBT (Insulated Gate Bipolar Transistor) packaging was built by DesignModeler ...
Pengpeng Xu +3 more
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A Numerical Procedure for the Optimization of IGBT Module Packaging [PDF]
2018 19th International Conference on Electronic Packaging Technology (ICEPT), 2018 A numerical solution procedure for optimizing the thermal-mechanical reliability of an IGBT module has been described in this paper. The procedure is robust and it can handle both discrete and continuous decision variables in the design of IGBT packaging. An example has been given to demonstrate its application.
Hua, Lu +2 more
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Shanghai Jiaotong Daxue xuebao, 2023 In order to improve the accuracy of remaining useful life (RUL) prediction of insulated gate bipolar transistor(IGBT) modules across working conditions to enhance their reliability, an RUL prediction method based on the ProbSparse self-attention ...
ZHONG Zhiwei, WANG Yuxiang, HUANG Yixiang, XIAO Dengyu, XIA Pengcheng, LIU Chengliang
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Thermal Resistance Distribution Experiment of Parallel Sub-Module in Press-Pack IGBT Device
Zhongguo dianli, 2020 In the rigid Press-Pack IGBT module, the pressure distribution of parallel chips determines the contact thermal resistance and contact electrical resistance directly.
Lubin HAN, Lin LIANG, Yong KANG
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Stress warpage analysis of IGBT module package reflow soldering
Xi'an Gongcheng Daxue xuebao, 2021 In order to explore the impact of reflow soldering process on power device packaging, a 3D package model based on insulated gate bipolar transistor (IGBT) module was established using DesignModeler, and then ANSYS software was used to perform thermal ...
Lipeng TAN +4 more
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