Results 1 to 10 of about 742 (161)

Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling [PDF]

open access: yesMicromachines, 2022
With the increase of power level and integration in electric vehicle controllers, the heat flux of the key silicon-based IGBT (Insulated Gate Bipolar Transistor) device has reached its physical limit.
Lipeng Tan   +5 more
doaj   +4 more sources

A Review of Thermal Design for IGBT Module

open access: yesZhongguo dianli, 2020
In this paper, the thermal characteristics and thermal design of IGBT module are reviewed. Firstly, the thermal network model and its dependence on the packaging material’s thermal performance and dimensions are addressed.
Guoyou LIU   +5 more
doaj   +2 more sources

Estimation Technique for IGBT Module Junction Temperature in a High-Power Density Inverter

open access: yesMachines, 2023
During the last few decades, insulated-gate bipolar transistor (IGBT) power modules have evolved as reliable and useful electronic parts due to the increasing relevance of power inverters in power infrastructure, reliability enhancement, and long-life ...
Ahmed H. Okilly   +6 more
doaj   +3 more sources

Thermal/Mechanical Characteristics Simulation Analysis of Solder Layer Damage in IGBT Modules [PDF]

open access: yesMicromachines
The insulated gate bipolar transistor (IGBT) is widely applied in industrial fields such as rail transit, wind power generation, smart grids, and renewable energy. The temperature distribution, stress variation patterns, thermal performance, and modeling
Jianbo Zhou   +4 more
doaj   +2 more sources

A Review on IGBT Module Failure Modes and Lifetime Testing

open access: yesIEEE Access, 2021
This article focuses on failure modes and lifetime testing of IGBT modules being one of the most vulnerable components in power electronic converters. IGBT modules have already located themselves in the heart of many critical applications, such as automotive, aerospace, transportation, and energy.
Amir Sajjad Bahman   +2 more
exaly   +4 more sources

Research on Residual Life of IGBT Module on EMU in Advanced Repair Based on Power Cycles

open access: yesKongzhi Yu Xinxi Jishu, 2023
The insulated gate bipolar transistor (IGBT) module is one of the weakest links in the traction converter system. Accurate life and reliability assessment of the IGBT module is particularly important for safe operation of the traction converter system ...
JIANG Jie, LI Nan
doaj   +3 more sources

Effect of Solder Layer Void Damage on the Temperature of IGBT Modules

open access: yesMicromachines, 2023
Solder layer void is one of the main failure causes of power semiconductor devices, which will seriously affect the reliability of the devices. In this study, a 3D model of IGBT (Insulated Gate Bipolar Transistor) packaging was built by DesignModeler ...
Pengpeng Xu   +3 more
doaj   +1 more source

Remaining Useful Life Prediction of IGBT Modules Across Working Conditions Based on ProbSparse Self-Attention

open access: yesShanghai Jiaotong Daxue xuebao, 2023
In order to improve the accuracy of remaining useful life (RUL) prediction of insulated gate bipolar transistor(IGBT) modules across working conditions to enhance their reliability, an RUL prediction method based on the ProbSparse self-attention ...
ZHONG Zhiwei, WANG Yuxiang, HUANG Yixiang, XIAO Dengyu, XIA Pengcheng, LIU Chengliang
doaj   +1 more source

A Numerical Procedure for the Optimization of IGBT Module Packaging [PDF]

open access: yes2018 19th International Conference on Electronic Packaging Technology (ICEPT), 2018
A numerical solution procedure for optimizing the thermal-mechanical reliability of an IGBT module has been described in this paper. The procedure is robust and it can handle both discrete and continuous decision variables in the design of IGBT packaging. An example has been given to demonstrate its application.
Hua, Lu   +2 more
openaire   +1 more source

Stress warpage analysis of IGBT module package reflow soldering

open access: yesXi'an Gongcheng Daxue xuebao, 2021
In order to explore the impact of reflow soldering process on power device packaging, a 3D package model based on insulated gate bipolar transistor (IGBT) module was established using DesignModeler, and then ANSYS software was used to perform thermal ...
Lipeng TAN   +4 more
doaj   +1 more source

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