Results 91 to 100 of about 11,875 (232)

New Power Module Integrating Output Current Measurement Function [PDF]

, 2017
This paper proposes a new power module concept that integrates output current measurement function to make inverters compact. The current measurement function is realized by tiny printed-circuit-board (PCB) Rogowski coils.
Hasegawa K., Omura I., Tabata S., Tsukuda M.   +3 more
core   +2 more sources

Development of 6 500 V/200 A High-voltage and High-power Localization IGBT

机车电传动, 2017
It designed and packed localization IGBT and FRD chip of CRRC. Structural optimization of IGBT was designed through ANSYS simulations of electromagnetic field, heat, stress and so on.
CHEN Hong, YANG Chunyu, LIU Geli, WU Caisheng, CAO Lin, SUN Jun   +5 more
doaj  

Power-cycling degradation monitoring of an IGBT module with VCE(sat) measurement in continuous operation of a chopper circuit

Power Electronic Devices and Components
This paper presents a power-cycling degradation monitoring method of an IGBT module with a VCE(sat) sensing circuit and junction temperature prediction by a three-dimensional structure model.
Kazunori Hasegawa, Kanta Hara, Nobuyuki Shishido, Satoshi Nakano, Wataru Saito, Tamotsu Ninomiya   +5 more
doaj   +1 more source

A Novel 3D Thermal Impedance Model for High Power Modules Considering Multi-layer Thermal Coupling and Different Heating/Cooling Conditions [PDF]

, 2015
Thermal management of power electronic devices is essential for reliable performance especially at high power levels. One of the most important activities in the thermal management and reliability improvement is acquiring the temperature information in ...
Bahman, Amir Sajjad, Blaabjerg, Frede, Ma, Ke   +2 more
core   +2 more sources

Measurement Method of IGBT Thermal Resistance Based on Structure Function

Kongzhi Yu Xinxi Jishu, 2015
Based on the structure function theory, it studied the thermal characteristics between the same IGBT case and the different baseplate interfaces, and found separation point of structure functions, by which thermal resistance between the internal PN ...
FENG Qin, LI Shiping, CHEN Yan, WAN Chaoqun, LI Yi   +4 more
doaj  

Real‐time reliability evaluation method for IGBT module in MMC based on junction temperature and bond wire failure online monitoring

IET Power Electronics
The lack of an MMC reliability evaluation approach that incorporates data on essential components' health monitoring in the already related research prevents reliability from being further improved.
Zhonghao Dongye, Wuyu Zhang, Lei Qi, Bowen Gu, Hong Shen, Xiangyu Zhang, Xiang Cui   +6 more
doaj   +1 more source

Bonding Wire Current Measurementwith Tiny Film Current Sensors [PDF]

, 2012
Bonding wire current measurement technique has been highly desired to analyze failure phenomena, such as short circuit and avalanche destruction of IGBT and power diode. This paper challenged to measure bonding wire current distribution in an IGBT module
Hirai Hidetoshi, Kasho Yuya, Omura Ichiro, Tsukuda Masanori   +3 more
core   +2 more sources

IGBT module failure analysis in railway applications

Microelectronics Reliability, 2008
Peer ...
Perpiñà, X., Serviere, J. F., Jordà, Xavier, Fauquet, A., Hidalgo, Salvador, Urresti, J., Rebollo, J., Mermet-Guyennet, M.   +7 more
openaire   +2 more sources

Grid Tie Inverter in Photovoltaic System for Residential Application [PDF]

, 2010
This paper presents a grid tie inverter (GTI) in photovoltaic, PV system for residential application. The proposed GTI will be switched with a combination switching strategy of square wave and the sinusoidal pulse width modulation, SPWM.
Tan, kheng kwang
core  

A study on dynamic avalanche test of IGBT module

机车电传动, 2023
During the turn-off of IGBT modules, dynamic avalanche will occur when a large electric field is generated inside the chip. In this paper, an experimental scheme was designed and verified to analyze the effect of different factors on dynamic avalanche ...
YU Wei, ZHENG Yu, YUAN Tao, REN Yadong
doaj