Results 81 to 90 of about 11,950 (180)
The Mechanism, Calculation and Simulation of Power Loss for IGBT Modules
In this paper, the mechanism of IGBT power loss was analyzed, the definition and calculation of the power loss were discussed based on the characteristics of conduction and switching.
WANG Yangang +4 more
doaj
Thermal Performance Analysis of IGBT Module Packaging
Afinite element model of IGBT module packaging was constructed by utilizing FEAsoftware of ANSYS. Effect of different grease thickness, equivalent heat transfer coefficient, base plate thickness and material, solder thickness and material, substrate ...
DING Jie +4 more
doaj
Application of Silver Sintering Technology in Press-pack IGBTs
Silver sintering technology which has the characteristics of low temperature connection, low thermal resistance, low stress and high melting point, has gradually become the application trend of interface reliability-connection in insulated gate bipolar ...
Tingchang SHI +5 more
doaj
Switching-Cell Arrays - An Alternative Design Approach in Power Conversion [PDF]
© 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting /republishing this material for advertising or promotional purposes, creating new ...
Busquets Monge, Sergio +1 more
core +2 more sources
It briefly introduced the package principle of pressure-contact IGBT devices. In order to achieve high-integration of IGBT module, the effect of pressure-contact technology on its impendence characteristic, parallel application and thermal performance ...
YUAN Yong +4 more
doaj
Partial discharge measurement and analysis in high voltage IGBT modules under DC voltage
Insulation performance of high voltage IGBT modules is one of the key attributes in power system applications. However, the existing standards of IGBT devices and research on the evaluation of insulation performance of high voltage IGBT modules are ...
Pengyu Fu +6 more
doaj +1 more source
Macro-Mesoscale Modeling of the Evolution of the Surface Roughness of the Al Metallization Layer of an IGBT Module during Power Cycling. [PDF]
An T +5 more
europepmc +1 more source
Optimization Tool for Direct Water Cooling System of High Power IGBT Modules [PDF]
Thermal management of power electronic devices is essential for reliable system performance especially at high power levels. Since even the most efficient electronic circuit becomes hot because of ohmic losses, it is clear that cooling is needed in ...
Bahman, Amir Sajjad, Blaabjerg, Frede
core +2 more sources
Development of 6 500 V/200 A High-voltage and High-power Localization IGBT
It designed and packed localization IGBT and FRD chip of CRRC. Structural optimization of IGBT was designed through ANSYS simulations of electromagnetic field, heat, stress and so on.
CHEN Hong +5 more
doaj
This paper presents a power-cycling degradation monitoring method of an IGBT module with a VCE(sat) sensing circuit and junction temperature prediction by a three-dimensional structure model.
Kazunori Hasegawa +5 more
doaj +1 more source

