High-throughput and Full Automatic DBC-Module Screening Tester for High Power IGBT [PDF]
, 2015 We developed a high-throughput screening tester for DBC-module of IGBT. The tester realizes a new screening test with current distribution in addition to a conventional switching test. It consists of a power circuit, a replaceable test head, sensor array
Noda R. +5 more
core +2 more sources
IET Power ElectronicsThe lack of an MMC reliability evaluation approach that incorporates data on essential components' health monitoring in the already related research prevents reliability from being further improved.
Zhonghao Dongye +6 more
doaj +1 more source
Investigations on electromagnetic noises and interactions in electronic architectures : a tutorial case on a mobile system [PDF]
, 2012 Electromagnetic interactions become critic in embedded and smart electronic structures. The increase of electronic performances confined in a finite volume or support for mobile applications defines new electromagnetic environment and compatibility ...
Diénot, Jean-Marc
core +1 more source
Measurement Method of IGBT Thermal Resistance Based on Structure Function
Kongzhi Yu Xinxi Jishu, 2015 Based on the structure function theory, it studied the thermal characteristics between the same IGBT case and the different baseplate interfaces, and found separation point of structure functions, by which thermal resistance between the internal PN ...
FENG Qin +4 more
doaj
Real-cases of electromagnetic immunity and reliability in embedded electronics architectures [PDF]
, 2012 This papers concerns works about electromagnetic immunity and reliability investigations on electronics devices, combined with different physical impacts as ...
Batista, Emmanuel, Diénot, Jean-Marc
core
A study on dynamic avalanche test of IGBT module
机车电传动, 2023 During the turn-off of IGBT modules, dynamic avalanche will occur when a large electric field is generated inside the chip. In this paper, an experimental scheme was designed and verified to analyze the effect of different factors on dynamic avalanche ...
YU Wei, ZHENG Yu, YUAN Tao, REN Yadong
doaj
Switching Characteristic of HiPak 6.5 kV IGBT and the Influence of Gate Unit
Kongzhi Yu Xinxi Jishu, 2015 It presented the investigation on the reverse recovery of ABB HiPak 6 500 V/750 A IGBT module. For the first time, the forward recovery and the reverse recovery of diode and its anti-parallel connected IGBT were researched as a function of di/dt, and the
Makan Chen, Raffael Schnell
doaj
Mono Amplifier Class D Menggunakan Semikron SKHI 22B dan IGBT Module Semikron SKM75GB128DN [PDF]
, 2013 Dalam perkembangan power amplifier, MOSFET banyak digunakan dalam komposisi pembuatannya. Seperti diketahui, MOSFET memiliki kerugian waktu on-off yang lebih lama dibandingkan dengan IGBT.
Christanto, I. (Ivan)
core
Power loss and thermal characterization of IGBT modules in the Alternate Arm converter
, 2013 Power losses in high power HVDC converters are dominated by those that occur within the power electronic devices. This power loss is dissipated as heat at the junction of semiconductor devices.
Green, TC +3 more
core +1 more source
Thermal Design and Simulation of High Power Press-pack IGBT Module
Kongzhi Yu Xinxi Jishu, 2016 With the improvement of packaging power level of IGBT module, power density and operating temperature on chip will rise, which may lead to an increasing affect of thermal stress on long-term reliability of the device.
XIAO Hongxiu, DOU Zechun, PENG Yongdian
doaj