Thermo-mechanical stress of bonded wires used in high power modules with alternating and direct current modes [PDF]
, 2012 Today, power electronic reliability is a main subject of interest for many companies and laboratories. The main process leading to the IGBT failure is the cycling thermal stress.
Medjahed, Hassen +2 more
core +4 more sources
Estimation Technique for IGBT Module Junction Temperature in a High-Power Density Inverter
Machines, 2023 During the last few decades, insulated-gate bipolar transistor (IGBT) power modules have evolved as reliable and useful electronic parts due to the increasing relevance of power inverters in power infrastructure, reliability enhancement, and long-life ...
Ahmed H. Okilly +6 more
doaj +1 more source
Design and implementation of 30kW 200/900V LCL modular multilevel based DC/DC converter for high power applications [PDF]
, 2016 This paper presents the design, development and testing of a 30kW, 200V/900V modular multilevel converter (MMC) based DC/DC converter prototype. An internal LCL circuit is used to provide voltage stepping and fault tolerance property.
Aboushady, A. +3 more
core +2 more sources
Effect of solder layer crack on the thermal reliability of Insulated Gate Bipolar Transistors
Case Studies in Thermal Engineering, 2019 In order to study the thermal reliability of solder layer fatigue damage in Insulated Gate Bipolar Transistors (IGBT), the Finite Element Analysis (FEA) of the crack damage of the solder layer is described.
Mingxing Du +4 more
doaj +1 more source
Power loss investigation in HVDC for cascaded H-bridge multilevel inverters (CHB-MLI) [PDF]
, 2015 In the last decade, the use of voltage-source multilevel inverters in industrial and utility power applications has been increased significantly mainly due to the many advantages of multilevel inverters, compared to conventional two level inverters ...
Alamri, B, Darwish, M
core +1 more source
Enhancement of reliability in condition monitoring techniques in wind turbines [PDF]
, 2019 The majority of electrical failures in wind turbines occur in the semiconductor components (IGBTs) of converters. To increase reliability and decrease the maintenance costs associated with this component, several health-monitoring methods have been ...
Dinh, Truong Quang +5 more
core +1 more source
Analysis and design of a modular multilevel converter with trapezoidal modulation for medium and high voltage DC-DC transformers [PDF]
, 2015 Conventional dual active bridge topologies provide galvanic isolation and soft-switching over a reasonable operating range without dedicated resonant circuits.
Adam, Grain P. +4 more
core +2 more sources
Development of a Low Noise IGBT Module
IEEJ Transactions on Industry Applications, 2008 AbstractHigh‐frequency leakage current that may cause serious conducted EMI problems flows through an inverter system. The paths of the leakage current are stray capacitances that are formed inside of motors, cables, and IGBT modules. This paper proposes a new IGBT module that realizes low conducted emission noise by flipping the IGBT chip of the lower‐
Michio Tamate +5 more
openaire +2 more sources
An Icepak-PSpice Co-Simulation Method to Study the Impact of Bond Wires Fatigue on the Current and Temperature Distribution of IGBT Modules under Short-Circuit [PDF]
, 2014 Bond wires fatigue is one of the dominant failure mechanisms of IGBT modules. Prior-art research mainly focuses on its impact on the end-of-life failure, while its effect on the short-circuit capability of IGBT modules is still an open issue.
Blaabjerg, Frede +3 more
core +1 more source
A Fault-Tolerant T-Type Multilevel Inverter Topology With Increased Overload Capability and Soft-Switching Characteristics [PDF]
, 2017 he performance of a novel three-phase four-leg fault-tolerant T-type inverter topology is introduced in this paper. This inverter topology provides a fault-tolerant solution to any open-circuit and certain short-circuit switching faults in the power ...
Demerdash, Nabeel +4 more
core +2 more sources