Results 31 to 40 of about 587,530 (285)

Microstructure devices for water evaporation [PDF]

open access: yes, 2009
This paper was presented at the 2nd Micro and Nano Flows Conference (MNF2009), which was held at Brunel University, West London, UK. The conference was organised by Brunel University and supported by the Institution of Mechanical Engineers, IPEM, the ...
2nd Micro and Nano Flows Conference (MNF2009)   +5 more
core   +6 more sources

Preparation, interfacial regulation and strengthening of Mg/Al bimetal fabricated by compound casting: A review

open access: yesJournal of Magnesium and Alloys, 2023
Mg/Al bimetal combines the advantages of both aluminum and magnesium and has broad application prospects in automotive, aerospace, weapons, digital products and so on.
Guangyu Li   +6 more
doaj   +1 more source

Microstructure and mechanical properties of SiO2-BN ceramic and Invar alloy joints brazed with Ag–Cu–Ti+TiH2+BN composite filler

open access: yesJournal of Materiomics, 2016
Ag–Cu–Ti + TiH2+BN composite filler was prepared to braze SiO2-BN ceramic and Invar alloy. The interfacial microstructure, mechanical properties, and residual stress distribution of the brazed joints were investigated.
Y. Wang   +4 more
doaj   +1 more source

Effect of electropulsing on the solidification of mould flux

open access: yesJournal of Materials Research and Technology, 2022
The effect of electropulsing on the microstructure formation in solidification of mould flux has been investigated. Experimental characterization and image analysis reveals that the electropulsing treatment reduces 46% porosity and increases the ...
Ashutosh G. Bhagurkar, Rongshan Qin
doaj   +1 more source

Transposition from a batch to a continuous process for microencapsulation by interfacial polycondensation [PDF]

open access: yes, 2012
A novel continuous process is proposed and investigated to produce microcapsules by interfacial polycondensation. Polymeric microcapsules are obtained via a two-step process including an initial emulsification of two immiscible fluids in static mixers ...
Cabassud, Michel   +3 more
core   +1 more source

Improving interfacial adhesion in pla/wood biocomposites [PDF]

open access: yes, 2013
Two reactive coupling agents, N,N-(1,3-phenylene dimaleiimide) (BMI) and 1,1-(methylenedi-4,1-phenylene)bismaleimide (DBMI) were used to improve interfacial adhesion in PLA/wood composites.
Renner, Károly   +4 more
core   +1 more source

Characterisation of the mechanial and interfacial adhesion performance of natural fibres in polyolefin compounds for lightweight automotive applications [PDF]

open access: yes, 2014
This paper presents a study on the measurements of the interfacial adhesion of coir fibre with various polypropylene (PP) matrices along with the mechanical properties of their related injection moulded composites.
Rudeiros Fernandez, Jose Luis   +3 more
core   +3 more sources

Study of corrosion mechanism of cast iron in molten aluminum

open access: yesMaterials Research Express, 2020
The corrosion mechanism of three aluminum ingot mold materials used by Chinese aluminum electrolytic enterprises in molten aluminum was studied: The three materials are pearlite cast iron(PCI) contains vermicular graphite, lamellar graphite, and ...
Qiyu Wang   +3 more
doaj   +1 more source

Application Progress of PALS in the Correlation of Structure and Properties for Graphene/Polymer Nanocomposites

open access: yesNanomaterials, 2022
Giving a deep insight into the microstructure, and realizing the correlation between microstructure and properties is very important to the precise construction of high-performance graphene/polymer nanocomposites (GPN).
Xiaobing Han   +5 more
doaj   +1 more source

Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates

open access: yesResults in Physics, 2018
In this study, SAC305 and SAC305-0.3Ni solder balls were soldered onto Cu, high temperature treated Cu (H-Cu) and graphene coated Cu (G-Cu) substrates, respectively. The microstructure, the interfacial reaction, and the hardness of the solder joints were
Shengli Li   +5 more
doaj   +1 more source

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