Results 201 to 210 of about 8,512 (299)

Cerium as corrosion inhibitor for Sn-3Ag-0.5Cu solder alloy in 3.5% NaCl solution. [PDF]

Sci Rep
Vani R, Kumar G, Sharma S, Hegde A.
europepmc   +1 more source

In Vivo Imaging With a Low‐Cost MRI Scanner and Cloud Data Processing in Low‐Resource Settings

NMR in Biomedicine, Volume 39, Issue 6, June 2026.
This study presented the system evolution at MUST: (a) Scanner after the initial assembly in 2023. (b) First reconstructed image (bell pepper). Front (c), rear (d), and global (e) views of the MUST scanner in the 2025 configuration, highlighting the improved electronics setup, RF coils, and mechanical integration.
Teresa Guallart‐Naval, Robert Asiimwe, Patricia Tusiime, Mary A. Nassejje, Leo Kinyera, Lemi Robin, Maureen Nayebare, Luiz G. C. Santos, Marina Fernández‐García, Lucas Swistunow, José M. Algarín, John Stairs, Michael Hansen, Ronald Amodoi, Andrew Webb, Joshua Harper, Steven J. Schiff, Johnes Obungoloch, Joseba Alonso   +18 more
wiley   +1 more source

Progress and Challenges in Joining for Precision Endoscope Fabrication. [PDF]

Sensors (Basel)
Xu P, Zheng X, Li L, Wang Z.
europepmc   +1 more source

Process Window Optimization for Roll‐to‐Roll Slot‐Die Coating of High‐Resolution Dry Film Solder Resists for HDI PCB Applications

Polymer Engineering &Science, Volume 66, Issue 6, Page 4095-4106, June 2026.
A hydrodynamic process window for roll‐to‐roll slot‐die coating of photosensitive solder resist (PSR) was established by systematically varying the slot‐die gap and pump flow rate. Under the optimized conditions, a highly uniform 26 μm dry‐film solder resist (DFSR) layer with a thickness variation of ±3.74% was obtained without coating defects.
Geonu Kim, Woo Cheol Choi, Min Kwak, Jin Ho Shin, Jin Yong Seok, Ki‐Seok Jeon, Mincheol Chang, Chaehwan Jeong   +7 more
wiley   +1 more source

Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints. [PDF]

J Mater Sci
Hsieh CL, Coyle RJ, Xian JW, Gourlay CM.
europepmc   +1 more source

Enthalpy Effect of Adding Cobalt to Liquid Sn-3.8Ag-0.7Cu Lead-Free Solder Alloy: Difference between Bulk and Nanosized Cobalt. [PDF]

J Phys Chem C Nanomater Interfaces, 2016
Yakymovych A, Kaptay G, Roshanghias A, Flandorfer H, Ipser H.   +4 more
europepmc   +1 more source

Liquid PV Module Encapsulation to Enable Circular Design

Progress in Photovoltaics: Research and Applications, Volume 34, Issue 6, Page 667-678, June 2026.
This study demonstrates a novel liquid encapsulation technology to enable circularity in c‐Si photovoltaic modules. The optical properties and power conversion efficiency of liquid encapsulation is similar to EVA encapsulation and better than air encapsulation.
Urvashi Bothra, Sebastian Weemaes, Thomas Rijsman, Alberto Poli, Siemen Brinksma, Olindo Isabella, Malte Ruben Vogt   +6 more
wiley   +1 more source

Strengthening Copper Nano-Solder Pastes with Group IV 2D Materials: A Molecular Dynamics Insight. [PDF]

Materials (Basel)
Zhang X, Gao J, Zhang L.
europepmc   +1 more source

An Evaluation of A15 Nb3Al Superconducting Thin Films For Application in Quantum Circuits

Advanced Quantum Technologies, Volume 9, Issue 6, June 2026.
ABSTRACT A15 superconductors are distinguished by their high critical temperatures, magnetic fields, and current‐carrying capabilities. Among them, Nb3Al is of particular interest for superconducting quantum circuits as a means to extend device operating temperatures, provided that its electrodynamic properties are well understood.
Joseph Falvo, Brooke Henry, Bernardo Langa Jr., Rohit Pant, Ashish Alexander, Jason Dong, Kasra Sardashti   +6 more
wiley   +1 more source

Ga-Based Liquid Metals: Advances in Interface Thermal and Electrical Regulations for Power Electronics Integration. [PDF]

Materials (Basel)
Liu C, Liu T, Huang Z, Li X, Zheng J, Li G, Wang G, Liu W, Liu C.   +8 more
europepmc   +1 more source