Results 201 to 210 of about 6,013,042 (268)

Multiscale Modeling of Thermo-Electro-Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis. [PDF]

Micromachines (Basel)
Li P, Huang J, Zhang J, Gong H, Wang J, Zuo D, Su M, Shi J.   +7 more
europepmc   +1 more source

Low thermal stress and high-strength interface in brazing welding Nd:YAG-based advanced laser components. [PDF]

RSC Adv
Zhang B, Xu X, Sun G, Yang C, Zhang G, Cui H, Wang M, Xin G, Hou X, Chen W.   +9 more
europepmc   +1 more source

Lead Free Solder

, 2012
Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry.
Pang, John Hock Lye, John Hock Lye Pang
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Solderability of Lead-Free Finishes Using Lead-Free Solders

SMTA International, 2001
ABSTRACT The requirement of using lead-free materials has generated tremendous pressure in the electronics industry. In semiconductor leadframe packaging, the tin-lead post plating will be soon replaced by environment-friendly finishing processes.
C. Fan, Y. Zhang, J. A. Abys
openaire   +1 more source

Solderability of Coloured Lead Free Solder Composite

Solid State Phenomena, 2020
Coloured solders offer wide range of possible application on top of conventional usage related to solder and soldering. Coloured solder can be produced by adding colour pigment into solder formulation to form coloured solder composite. The performance of coloured solder joint typically determined by good solderability, which influenced by wetting ...
Maria Abu Bakar, Azman Jalar, Norliza Ismail, Ahmad Ghadafi Ismail, Najib Saedi Ibrahim   +4 more
openaire   +1 more source

Robotic soldering of lead free alloys

2018 Pan Pacific Microelectronics Symposium (Pan Pacific), 2018
ABSTRACT The wave soldering process of Electronic Assemblies with lead- free materials has become one of the most expensive factory process to maintain. Cost detractors include: High dross formation of Lead Free materials in the molten wave ...
Kar Lin Chia, Ban Leong Choo, Sooi Jin Lee, Cynthia Tan Sok Luang, Ming Siew Tan, Thomas Truman   +5 more
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Constitutive modeling of lead-free solders

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005., 2005
Solders are used extensively as electrical interconnects in microelectronics packaging. Because of environmental concerns, lead-based solders are being replaced by Sn/Ag and Sn/Ag/Cu based solder materials. Since the thermomechanical reliability of modern electronic devices depends on, to a large extent, the fatigue and creep behavior of the solder ...
M. Pei, J. Qu
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Solder Void Formation in Lead Free Solder

ECS Meeting Abstracts, 2012
Abstract not Available.
Charles L. Arvin, Eric Perfecto, Robert Davis, Bruce St. Lawrence, Keith Miller, Arthur Keigler   +5 more
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Solder balling of lead-free solder pastes

Journal of Electronic Materials, 2002
Solder balling in Sn/Ag/Cu solder pastes was studied in this work. Three different solder pastes, several different reflow profiles and conditions, and two stencil thicknesses were used in the investigation. During the first phase, called the verification phase, the solder pastes were checked to ensure they met the minimum requirements.
Minna Arra, Dongkai Shangguan, Erro Ristolainen, Toivo Lepistö   +3 more
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Laser soldering using lead free solder

PICALO 2004: 1st Pacific International Conference on Laser Materials Processing, Micro, Nano and Ultrafast Fabrication, 2004
In recent years the drive to adopt environmentally friendly solders and fluxes has been at the forefront of the electronics industry concerns. In parallel, the demands on soldering technology have increased rapidly, with footprint sizes reducing and boards becoming more heavily populated, in the drive towards miniaturisation. With these changes some of
Simon Doe, Alan Mundy
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