Results 211 to 220 of about 8,512 (299)
Traditional single‐cell analysis lacks the capacity for real‐time monitoring. This study presents Microfluidic dielectrophoretic Arresting System (MiDAS), a microelectrofluidic platform using dielectrophoresis for single‐cell and droplet trapping. MiDAS immobilizes diverse samples (cells, beads, droplets) for optical imaging and Raman spectroscopy. Its
Bum‐Joon Jung +9 more
wiley +1 more source
Ink‐printing technique is promising in fabricating thermoelectric materials and devices for advanced wearable electronics applications. Thermoelectric (TE) materials, which enable the direct conversion between thermal and electrical energy, represent a promising solution for sustainable energy technologies.
Juxiang Shao +8 more
wiley +1 more source
Non-destructive orientation tracking of individual β-Sn grains in die-attach solder joints. [PDF]
Kim J +4 more
europepmc +1 more source
The graphic provides an overview of the emerging field of high‐surface area vertically aligned nanopillar electrodes for electrophysiological measurements. It depicts various types of electrodes; materials, and the methods used for fabrication of vertically aligned nanopillar electrodes.
Mohammad Alzahrani +4 more
wiley +1 more source
Granular Activated Carbon Filtration as a Lead Control Strategy. [PDF]
Hood KM +5 more
europepmc +1 more source
New High Precision Measurements of Apollo Samples: 0.3–5 GHz Complex Refractive Indices
Abstract Active and passive radar techniques provide information on the subsurface structure and history of planetary bodies. However, interpretations of radar data are limited by our understanding of the complex dielectric permittivity and magnetic permeability of the surface material.
P. Linton +15 more
wiley +1 more source
Cross Comparison Between Thermal Cycling and High Temperature Stress on I/O Connection Elements. [PDF]
Dhyani M +3 more
europepmc +1 more source
ABSTRACT This paper presents a comprehensive study on the machining simulation of recrystallized silicon carbide (R‐SiC), with a focus on material failure mechanisms, numerical influences, tool kinematics, and frictional behavior. A representative volume of interest was derived from CT data, and a meshing algorithm for CT‐based structures was ...
Simon Unseld +4 more
wiley +1 more source
Electrochemical migration behavior of SnAgCuNi solder alloy in a simulated dew condensation environment. [PDF]
Wang L +10 more
europepmc +1 more source

