Results 211 to 220 of about 6,013,042 (268)

Research trends in lead-free soldering in the US: NCMS Lead-Free Solder Project

Proceedings First International Symposium on Environmentally Conscious Design and Inverse Manufacturing, 1999
In 1997, the National Center for Manufacturing Sciences Lead-Free Solder Project carried out by a consortium of 11 industrial corporations, academic institutions, and national laboratories completed its four year program to identify, and evaluate alternatives to eutectic tin-lead solder.
I. Artaki, D. Noctor, J. Mather, S. Schroeder, D. Napp, C. Desantis, W. Desaulnier, null Tsung-Yu Pan, L. Felton, M. Palmer, J. Rosser, J. Felty, P. Vianco, J. Greaves, G. Whitten, null Yun Zhu, C. Handwerker   +16 more
openaire   +1 more source

Developments in lead-free solders and soldering technology

JOM, 2002
Accelerated R&D efforts in industry, universities, national laboratories, and government agencies have recently identified several promising lead-free solders to replace lead-containing solders in microelectronic applications. The leading candidates are Sn-3.5Ag, Sn3.5Ag-0.7Cu, Sn-3.5Ag-4.8Bi, and Sn-0.7Cu (in weight percent).
openaire   +1 more source

Nitrogen in Reflow Soldering of Lead-Free Solders

2007 8th Siberian Russian Workshop and Tutorial on Electron Devices and Materials, 2007
Due to environmental and health demands for lead contamination, there is increasing pressure in legislation and a growing market demand to eliminate toxic materials. Lead-free soldering for the electronic industry is becoming a global trend, and several alloy systems alternatives have been recommended.
openaire   +1 more source

Lead-free Solders

2011
Description Eleven peer-reviewed papers address the environmental and health concerns related to the exposure to lead during soldering and the success and failures of lead-free solders. Topics cover STP 1530 is a valuable resource for students, researchers, and material scientists in the electronic industry.
openaire   +1 more source

Lead-free Solders in Microelectronics

Materials Science and Engineering: R: Reports, 2000
Abstract Practically all microelectronic assemblies in use today utilize Pb–Sn solders for interconnection. With the advent of chip scale packaging technologies, the usage of solder connections has increased. The most widely used Pb–Sn solder has the eutectic composition. Emerging environmental regulations worldwide, most notably in Europe and Japan,
Mulugeta Abtew, Guna Selvaduray
openaire   +1 more source

Interfaces in lead-free soldering

Journal of Electronic Materials, 2003
Structural integrity of circuits is greatly dependent on interfacial microstructure. In this paper, the status of the current understanding of various interfaces appearing in lead-free soldering is reviewed, and recent data on interfaces in electronic interconnections, primarily analyzed by transmission electron microscopy (TEM), is presented.
Chi-Won Hwang, Keun-Soo Kim, Katsuaki Suganuma   +2 more
openaire   +1 more source

Lead-free Solder

2010
T.R. Bieler, T.K. Lee
openaire   +1 more source

Development of lead free solder for electronic components based on thermal analysis

Materials Today: Proceedings, 2022
Ambrish Maurya
exaly  

A systematic literature review: The effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints

Journal of Manufacturing Processes, 2022
A Atiqah, A Jalar
exaly  

Lead-Free Soldering

2016
A. Kroupa, A. Watson, S. Mucklejohn, H. Ipser, A. Dinsdale, D. Andersson   +5 more
openaire   +1 more source