Results 231 to 240 of about 8,512 (299)

Enhancing Electromigration Lifetime Through Controlled Reduction of Bismuth Content in Sn-Bi-Ag Solder Interconnects. [PDF]

Materials (Basel)
Wang S, Meng S, Liu H, Huang M.
europepmc   +1 more source

Skin-conformal PMN-PT ultrasonic sensor for cuffless blood pressure sensing via eutectic solder integration. [PDF]

Microsyst Nanoeng
Zaidi STH, Kim DH, Shah MA, Lee YJ, Lee BC, Hur S.   +5 more
europepmc   +1 more source

Effects of bismuth on the microstructure and crack propagation in Sn-Ag-Cu-Bi solder joints during thermal cycling. [PDF]

J Mater Sci Mater Electron
Hsieh CL, Coyle RJ, Belyakov SA, Xian JW, Gourlay CM.   +4 more
europepmc   +1 more source

Fabrication of a low-cost, small-footprint modular lab-scale wet spinning system. [PDF]

HardwareX
Houghton JA, Blackburn RS.
europepmc   +1 more source

Underfill: A Review of Reliability Improvement Methods in Electronics Production. [PDF]

Polymers (Basel)
Plachý Z, Pražanová A, Dušek K, Géczy A.   +3 more
europepmc   +1 more source

Protocol for the precise activation of intradental neurons in mice via electrical stimulation. [PDF]

STAR Protoc
Wan S, Ronan EA, Jha A, Gandhi AR, Constantinescu BSC, Pipe KP, Emrick JJ.   +6 more
europepmc   +1 more source

Heterogeneous integration of micro-LEDs via multiple simultaneous transfer and bonding. [PDF]

Microsyst Nanoeng
Joo J, Choi GM, Lee C, Jang KS, Oh JH, Eom YS, Choi KS, Um BJ, Bae BS, Shin J.   +9 more
europepmc   +1 more source

Lead Free Solder

, 2012
Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry.
Pang, John Hock Lye, John Hock Lye Pang
openaire   +2 more sources

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Solderability of Lead-Free Finishes Using Lead-Free Solders

SMTA International, 2001
ABSTRACT The requirement of using lead-free materials has generated tremendous pressure in the electronics industry. In semiconductor leadframe packaging, the tin-lead post plating will be soon replaced by environment-friendly finishing processes.
C. Fan, Y. Zhang, J. A. Abys
openaire   +1 more source