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2011
Description Eleven peer-reviewed papers address the environmental and health concerns related to the exposure to lead during soldering and the success and failures of lead-free solders. Topics cover STP 1530 is a valuable resource for students, researchers, and material scientists in the electronic industry.
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Description Eleven peer-reviewed papers address the environmental and health concerns related to the exposure to lead during soldering and the success and failures of lead-free solders. Topics cover STP 1530 is a valuable resource for students, researchers, and material scientists in the electronic industry.
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Lead-free Solders in Microelectronics
Materials Science and Engineering: R: Reports, 2000Abstract Practically all microelectronic assemblies in use today utilize Pb–Sn solders for interconnection. With the advent of chip scale packaging technologies, the usage of solder connections has increased. The most widely used Pb–Sn solder has the eutectic composition. Emerging environmental regulations worldwide, most notably in Europe and Japan,
Mulugeta Abtew, Guna Selvaduray
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Interfaces in lead-free soldering
Journal of Electronic Materials, 2003Structural integrity of circuits is greatly dependent on interfacial microstructure. In this paper, the status of the current understanding of various interfaces appearing in lead-free soldering is reviewed, and recent data on interfaces in electronic interconnections, primarily analyzed by transmission electron microscopy (TEM), is presented.
Chi-Won Hwang +2 more
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Journal of Electronic Materials, 1994
Two specific examples of the new lead-free alloys are described. In the Sn-3.5%Ag-l%Zn alloy (m.p.~217°C), the eutectic precipitate morphology is refined by the relatively small amount of zinc addition and as a result, a high-strength, high-ductility solder with significantly improved creep resistance is obtained.
M. McCormack, S. Jin
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Two specific examples of the new lead-free alloys are described. In the Sn-3.5%Ag-l%Zn alloy (m.p.~217°C), the eutectic precipitate morphology is refined by the relatively small amount of zinc addition and as a result, a high-strength, high-ductility solder with significantly improved creep resistance is obtained.
M. McCormack, S. Jin
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A review of lead-free solders for electronics applications
Microelectronics Reliability, 2017Abstract Ever since RoHS was implemented in 2006, Sn3.0Ag0.5Cu (SAC305) has been the primary lead-free solder for attaching electronic devices to printed circuit boards (PCBs). However, due to the 3.0 wt% Silver (Ag) in SAC305, companies have been looking at less expensive solder alternatives, especially for use in inexpensive products that have ...
Shunfeng Cheng +2 more
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The Search for Lead‐free Solders
Soldering & Surface Mount Technology, 1993The growing concern over the possibility of lead elimination from electronics solders has prompted the initiation of several studies by various groups. The same basic approach is a feature of most of these efforts — a programme of alloy development aimed at finding a new alloy which may substitute for most, if not all, applications for tin‐lead.
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Roadmap of Lead-free Soldering
2007 30th International Spring Seminar on Electronics Technology (ISSE), 2007In this presentation is profiled in short form roadmap of Lead-free soldering process, which has a general character and sums the most important parameters and factors that concern achievements of good solder joint quality. This course is involved in the 5th semester of the Bachelor study program as well in extended form in Master Study program at Brno
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