Results 271 to 280 of about 8,512 (299)

Effect of graphene nanosheets reinforcement on the performance of SnAgCu lead-free solder

Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing, 2013
Xiangdong Liu, Yongdian Han, J Wei
exaly  

Microstructures and properties of new Sn–Ag–Cu lead-free solder reinforced with Ni-coated graphene nanosheets

Journal of Alloys and Compounds, 2016
Changqing Liu, Vadim V Silberschmidt, Y C Chan   +2 more
exaly  

Thermosonic bonding of lead-free solder with metal bump for flip-chip bonding

Journal of Electronic Materials, 2005
Jihye Lee, Lee Jihye, Kim Jung H
exaly  

The Wiedemann–Franz–Lorenz relation for lead-free solder and intermetallic materials

Acta Materialia, 2013
Yao Yao, Morris E Fine, Leon M Keer
exaly  

Lead-Free Soldering

2007
openaire   +1 more source

Lead-Free Solder Paste and Reflow Soldering

2003
openaire   +2 more sources

Processing treatment of a lead-free Sn–Ag–Cu–Bi solder by rapid laser-beam reflowing and the creep property of its soldered connection

Journal of Materials Processing Technology, 2007
Xin-Ping Zhang
exaly  

Property alterations of Sn-0.6Cu-0.05Ni-Ge lead-free solder by Ag, Bi, In and Sb addition

Transactions of Nonferrous Metals Society of China, 2018
Kannachai Kanlayasiri
exaly  

Realistic solderability testing with lead-free solders

Microelectronics International, 2004
openaire   +1 more source

The effect of temperature and strain rate on the tensile properties of a Sn99.3Cu0.7(Ni) lead-free solder alloy

Microelectronic Engineering, 2007
Fulong Zhu, Rongfeng Guan
exaly