Results 241 to 250 of about 8,512 (299)

Solderability of Coloured Lead Free Solder Composite

Solid State Phenomena, 2020
Coloured solders offer wide range of possible application on top of conventional usage related to solder and soldering. Coloured solder can be produced by adding colour pigment into solder formulation to form coloured solder composite. The performance of coloured solder joint typically determined by good solderability, which influenced by wetting ...
Maria Abu Bakar, Azman Jalar, Norliza Ismail, Ahmad Ghadafi Ismail, Najib Saedi Ibrahim   +4 more
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Robotic soldering of lead free alloys

2018 Pan Pacific Microelectronics Symposium (Pan Pacific), 2018
ABSTRACT The wave soldering process of Electronic Assemblies with lead- free materials has become one of the most expensive factory process to maintain. Cost detractors include: High dross formation of Lead Free materials in the molten wave ...
Kar Lin Chia, Ban Leong Choo, Sooi Jin Lee, Cynthia Tan Sok Luang, Ming Siew Tan, Thomas Truman   +5 more
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Constitutive modeling of lead-free solders

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005., 2005
Solders are used extensively as electrical interconnects in microelectronics packaging. Because of environmental concerns, lead-based solders are being replaced by Sn/Ag and Sn/Ag/Cu based solder materials. Since the thermomechanical reliability of modern electronic devices depends on, to a large extent, the fatigue and creep behavior of the solder ...
M. Pei, J. Qu
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Laser soldering using lead free solder

PICALO 2004: 1st Pacific International Conference on Laser Materials Processing, Micro, Nano and Ultrafast Fabrication, 2004
In recent years the drive to adopt environmentally friendly solders and fluxes has been at the forefront of the electronics industry concerns. In parallel, the demands on soldering technology have increased rapidly, with footprint sizes reducing and boards becoming more heavily populated, in the drive towards miniaturisation. With these changes some of
Simon Doe, Alan Mundy
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Solder Void Formation in Lead Free Solder

ECS Meeting Abstracts, 2012
Abstract not Available.
Charles L. Arvin, Eric Perfecto, Robert Davis, Bruce St. Lawrence, Keith Miller, Arthur Keigler   +5 more
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Solder balling of lead-free solder pastes

Journal of Electronic Materials, 2002
Solder balling in Sn/Ag/Cu solder pastes was studied in this work. Three different solder pastes, several different reflow profiles and conditions, and two stencil thicknesses were used in the investigation. During the first phase, called the verification phase, the solder pastes were checked to ensure they met the minimum requirements.
Minna Arra, Dongkai Shangguan, Erro Ristolainen, Toivo Lepistö   +3 more
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Research trends in lead-free soldering in the US: NCMS Lead-Free Solder Project

Proceedings First International Symposium on Environmentally Conscious Design and Inverse Manufacturing, 1999
In 1997, the National Center for Manufacturing Sciences Lead-Free Solder Project carried out by a consortium of 11 industrial corporations, academic institutions, and national laboratories completed its four year program to identify, and evaluate alternatives to eutectic tin-lead solder.
I. Artaki, D. Noctor, J. Mather, S. Schroeder, D. Napp, C. Desantis, W. Desaulnier, null Tsung-Yu Pan, L. Felton, M. Palmer, J. Rosser, J. Felty, P. Vianco, J. Greaves, G. Whitten, null Yun Zhu, C. Handwerker   +16 more
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Developments in lead-free solders and soldering technology

JOM, 2002
Accelerated R&D efforts in industry, universities, national laboratories, and government agencies have recently identified several promising lead-free solders to replace lead-containing solders in microelectronic applications. The leading candidates are Sn-3.5Ag, Sn3.5Ag-0.7Cu, Sn-3.5Ag-4.8Bi, and Sn-0.7Cu (in weight percent).
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Nitrogen in Reflow Soldering of Lead-Free Solders

2007 8th Siberian Russian Workshop and Tutorial on Electron Devices and Materials, 2007
Due to environmental and health demands for lead contamination, there is increasing pressure in legislation and a growing market demand to eliminate toxic materials. Lead-free soldering for the electronic industry is becoming a global trend, and several alloy systems alternatives have been recommended.
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Database on lead-free solders

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220), 2002
The worldwide movement in the electronics industry to replace lead-tin eutectic solders with lead-free solders creates a need for critical data on the industry's new lead-free solder compositions for these design and reliability models. Our team is working with the NEMI Lead-free Alloy Task Group to develop a comprehensive database.
T.A. Siewert, D.R. Smith, S. Liu, J.C. Madeni   +3 more
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