Lead-Free Solder Cyclic Plasticity Characterization for Drop Test Simulations
Gudmundson, Peter,, Bonnaud, Etienne
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In vitro analysis of a glass solder matrix on ATZ-ceramic-samples using human dental pulp cells and L929 mouse fibroblasts. [PDF]
Fuest S +11 more
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Thermodynamics of Bi-Sn lead-free solder alloys with Ni
Puzo E, Borzone G, Delsante S, Amore S
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Thermal/Mechanical Characteristics Simulation Analysis of Solder Layer Damage in IGBT Modules. [PDF]
Zhou J, Chen J, He L, Tang H, Wu X.
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Cerium as corrosion inhibitor for Sn-3Ag-0.5Cu solder alloy in 3.5% NaCl solution. [PDF]
Vani R, Kumar G, Sharma S, Hegde A.
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Protocol for simultaneous non-invasive electrocardiogram and respiratory plethysmography recordings in mice. [PDF]
Iwakoshi NY +4 more
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Progress and Challenges in Joining for Precision Endoscope Fabrication. [PDF]
Xu P, Zheng X, Li L, Wang Z.
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Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints. [PDF]
Hsieh CL, Coyle RJ, Xian JW, Gourlay CM.
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Microstructural Change Due to Aging and Its Effect on Fatigue Properties in Sn-Sb-Ag-Ni-Ge Alloy. [PDF]
Mitsui K +3 more
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Lead-free solder alloys: Thermodynamic properties of the (Au + Sb + Sn) and the (Au + Sb) system.
Hindler M, Guo Z, Mikula A.
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