Results 171 to 180 of about 8,512 (299)
Progress in Photovoltaics: Research and Applications, Volume 34, Issue 7, Page 887-905, July 2026.We present an optimized fabrication strategy incorporating a solution‐processed SnO2 buffer layer that prevents sputter‐induced damage during TCO deposition, enabling semitransparent perovskite solar cells with 21.87% efficiency, 27.15% in tandem, and exceptional long‐term stability under continuous illumination and outdoor conditions.
Satish Bykkam +12 more
wiley +1 more source
Lead Free BGAs Soldered with SnPb36Ag2 Solder
MATERIALS TRANSACTIONS, 2015 Grossmann, Günter +1 more
openaire +2 more sources
The Influence of Reflowing Process on Electrodeposited Sn-Cu-Ni Lead-Free Solder Alloy. [PDF]
Materials (Basel)State Rosoiu SP +4 more
europepmc +1 more source
Marine Mammal Science, Volume 42, Issue 3, July 2026.ABSTRACT Microplastics have been identified in hundreds of species, with evidence of trophic transfer via contaminated prey. Sarasota Bay common bottlenose dolphins (Tursiops truncatus) serve as sentinels of coastal pollution, including plastics and chemical plasticizers. Previous research confirmed microplastic ingestion in these dolphins (100.0%, n =
Estella Martin +12 more
wiley +1 more source
Effect of Laser Deoxidation on Adhesive‐Bonded Aluminum in an Oxygen‐Free Atmosphere
Advanced Engineering Materials, Volume 28, Issue 12, 17 June 2026.This study investigates laser ablation of aluminum under oxygen‐free conditions. The goal is to produce oxide‐free substrates that enable improved adhesive bonding with epoxy. Optimized laser parameters (90% overlap, 300 µJ) combined with oxide‐free substrates result in the highest tensile strength of the adhesive bond.
Sandra Gerland +5 more
wiley +1 more source
Physical and mechanical properties of lead-free solder joints
, 2016 Title: Physical and mechanical properties of lead-free solder joints Author: Petr Harcuba Department: Department of Physics of Materials Supervisor: prof. RNDr.
Harcuba, Petr
core
Advanced Engineering Materials, Volume 28, Issue 12, 17 June 2026.This study investigates laser‐based oxide removal of Cu inserts in oxygen‐free conditions and examines long‐term oxidation kinetics and surface chemistry under different atmospheres via X‐ray photoelectron spectroscopy. Al–Cu compound casting with differently oxidized surfaces is performed, and intermetallic phase formation, morphology, and thermal ...
Timon Steinhoff +9 more
wiley +1 more source
Direct Printing of 1-D and 2-D Electronically Conductive Structures by Molten Lead-Free Solder. [PDF]
Materials (Basel), 2016 Wang CH, Tsai HL, Hwang WS.
europepmc +1 more source
Advanced Engineering Materials, Volume 28, Issue 12, 17 June 2026.This work explores the reduction of nickel oxide layers using dielectric barrier discharge plasma in an argon–hydrogen atmosphere. The results reveal a strong temperature dependence, enabling complete reduction of thick oxide layers at 200°C within seconds.
Maria Argirusi +5 more
wiley +1 more source
Advanced Engineering Materials, Volume 28, Issue 12, 17 June 2026.The wettability of aluminum droplets (Al) on different copper substrates (Cu), where liquid Al spreads on solid Cu surfaces to form a liquid–solid interface, is studied numerically and experimentally. The experimental and numerical results show good agreement in the fast‐spreading regime.
Shan Lyu +8 more
wiley +1 more source