Results 171 to 180 of about 6,013,042 (268)

An Interconnection Strategy for Thermally Sensitive Solar Cells Employing Electrically Conductive Tape

Solar RRL, Volume 10, Issue 17, 15 September 2026.
Commercially available electrically conductive tapes are evaluated as low‐temperature interconnection materials for next‐generation photovoltaic devices. The tapes provide stable electrical contacts, strong adhesion, and module reliability comparable to advanced solder‐free technologies while eliminating thermal curing.
Yanxin Liu, Andreas Lambertz, Ian Marius Peters, Unisa Adikalie Kargbo, Bart Pieters, Benedikt Fischer, Henrike Gattermann, Xuanlei Du, Volker Lauterbach, Karsten Bittkau, Uwe Rau, Kaining Ding   +11 more
wiley   +1 more source

Undercooled liquid metal particles as gateway to low-temperature processing and non-equilibrium dynamics. [PDF]

iScience
Martin A, Peralta J, Thuo M.
europepmc   +1 more source

Ultrasonic Soldering of AlN/Cu Using SiC-Modified Zn5Al3Ti Active Solder. [PDF]

Materials (Basel)
Melus T, Kolenak R, Sloboda M, Gogola P, Pasak M.   +4 more
europepmc   +1 more source

Fabrication and Bonding Strength of Sn-Decorated MWCNT-Reinforced Sn-3.0Ag-0.5Cu Composite Solder Joints: Reflow vs. IPL Soldering. [PDF]

Materials (Basel)
Kang D, Seong H, Yoon J, Sung M, Joo J, Yoon J, Jung S.   +6 more
europepmc   +1 more source

Multi-Target Radar Speed Meter Failure Mechanism Research. [PDF]

Sensors (Basel)
Luo L, Jiang X, Shao J, Chen C, Zhao C, Zhang X, Shen X.   +6 more
europepmc   +1 more source

Study on warpage stress in SiP packages during reflow soldering. [PDF]

Sci Rep
Qu RN, Li DS, Pan L, Xin J, Qi W, Qin QH.   +5 more
europepmc   +1 more source

Thermal Management and Reliability Engineering of Advanced HBM Packages: Materials, Interfaces, and Integrated Design Strategies. [PDF]

Micromachines (Basel)
Do HR, Wee JH, Lee HR, Lee YC, Song Y, Pyo SG.   +5 more
europepmc   +1 more source

Enthalpy Effect of Adding Cobalt to Liquid Sn-3.8Ag-0.7Cu Lead-Free Solder Alloy: Difference between Bulk and Nanosized Cobalt. [PDF]

J Phys Chem C Nanomater Interfaces, 2016
Yakymovych A, Kaptay G, Roshanghias A, Flandorfer H, Ipser H.   +4 more
europepmc   +1 more source

Improving thermal shock resistance of segmented thermoelectric devices via metal foam integration. [PDF]

Nat Commun
Yu K, Du J, Tong H, Sun Y, Yang X, Wu H, Zhang X, Liu Z, Li C, Guo F, Sui J.   +10 more
europepmc   +1 more source

Effects of Al Element on the Microstructure and Properties of Sn-9Zn Solder Alloy. [PDF]

Materials (Basel)
Yang J, You Y, Jiang G, Li C.
europepmc   +1 more source