Results 151 to 160 of about 6,013,042 (268)
The Influence of Reflowing Process on Electrodeposited Sn-Cu-Ni Lead-Free Solder Alloy. [PDF]
Materials (Basel)State Rosoiu SP +4 more
europepmc +1 more source
Peri‐implantitis—Is it mainly a clinician‐initiated complication of implant therapy?
Periodontology 2000, EarlyView.Abstract Aim The high prevalence of peri‐implantitis is concerning, with a growing consensus that the majority of cases are complications initiated by clinician‐related errors rather than classic pathology. A primary predisposing factor for peri‐implantitis is exposure of the micro‐rough implant surfaces to the peri‐implant sulcus after treatment ...
Stephen T. Chen +9 more
wiley +1 more source
Lead Free Solder Joint - Models for Reliability Prediction
, 2012 This bachelor's thesis deals with reliability prediction of lead-free solder joint. Background research of fatigue models for lead free solder joint.is described in theoretic part Basic terminology and lead free soldering technology operations are ...
Nestrojil, Michal
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Direct Printing of 1-D and 2-D Electronically Conductive Structures by Molten Lead-Free Solder. [PDF]
Materials (Basel), 2016 Wang CH, Tsai HL, Hwang WS.
europepmc +1 more source
Solar RRL, Volume 10, Issue 19, 15 October 2026.Bifacial ACIGS mini‐module prototypes with In2O3:Ti back contacts are fabricated and analyzed. Efficiencies of 13.5% and 10.3% are achieved under front and rear illumination, respectively. High bifaciality factors of up to 76% are enabled by the excellent transparency and conductivity of the thermally stable In2O3:Ti film.
Jan Keller +10 more
wiley +1 more source
Advanced Engineering Materials, Volume 28, Issue 19, 7 October 2026.Low‐temperature imidization of PEG‐modified polyimide enables fully screen‐printed, roll‐to‐roll fabrication of flexible electrodes on PET substrates, delivering robust mechanical durability and reliable ECG/EMG signal performance for wearable electronics.
Akib Abdullah Khan, Jong‐Hoon Kim
wiley +1 more source
Results of comparative reliability tests on lead-free solder alloys
, 2002 The use of lead-free solder brings up concerns regarding the reliability of the new alloys to be used. In a European project (LEADFREE) SnAg, SnAgCu, SnAgCuSb, SnZn and SnPbAg have been tested in order to evaluate comparative data of the growth of cracks
Grossmann, Günter (author) +2 more
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Architecture‐Driven Sensor Stability in Weft‐Knitted Engineering Textiles
Advanced Engineering Materials, Volume 28, Issue 19, 7 October 2026.Textile‐integrated sensor architectures are systematically compared to evaluate their electromechanical behavior under combined mechanical and environmental loading. Pocket‐based integration exhibits stable and reproducible signals, whereas tunnel‐based routing shows higher sensitivity accompanied by increased variability.
Adnan Maroof Khan +5 more
wiley +1 more source
Lead-free soldering alloys: microstructure optimization for electronic applications
, 2009 As a result of environmental issues, manufacturing of lead-free electronics has become a global trend since July 1, 2006. Due to the considerable toxicity of lead leading to health and environmental concerns, new legislations have been imposed in its use.
Sergey Belyakov (1984501)
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