Results 131 to 140 of about 8,512 (299)
Progress in Photovoltaics: Research and Applications, EarlyView.This study examines the reuse readiness of photovoltaic modules through the Swiss PV Circle project. Results confirm technical feasibility with cost savings from targeted preselection, whereas economic viability depends on module age, testing, and market conditions.
Roger Nyffenegger +6 more
wiley +1 more source
Shingle Interconnection Reliability of PERC and Thin HJT Cells for Low Earth Orbit Applications
Progress in Photovoltaics: Research and Applications, EarlyView.Evolution of maximum power output (Pmax$$ {}_m ax $$) of PERC and thin HJT shingled cells with the Electrically Conductive Adhesives (ECA) “S” and “A” exposed to +120°C/−$$ - $$120°C thermal cycles up to 5×103$$ 5\times 1{0}^3 $$ times. Losses are induced by an increased series resistance with all cell technologies and ECA. Imaging (electroluminescence
Jean‐Baptiste Charpentier +5 more
wiley +1 more source
Research on Baseplate Soldering Process of High-voltage IGBT Module
Kongzhi Yu Xinxi Jishu, 2011 The solder layer between AlN substrate and AlSiC baseplate is a main way of heat dissipation for high-voltage IGBT module. Therefore, the void rate of the solder layer has a direct impact on the performance and reliability of high-voltage IGBT module. In
doaj
Review of microstructure and properties of low temperature lead-free solder in electronic packaging. [PDF]
Sci Technol Adv Mater, 2020 Xu KK +5 more
europepmc +1 more source
Exploding Bridgewire (EBW) Detonators: An Example of Synergistic Multiphysics
Propellants, Explosives, Pyrotechnics, EarlyView.ABSTRACT Exploding bridgewire (EBW) detonators are highly temporally reproducible explosive devices that require the rapid discharge of a high‐voltage capacitance to operate and so are immune to most of the accidental hazards associated with traditional electric detonators.
P. J. Rae +3 more
wiley +1 more source
Bismuth-antimony as an alternative material for high temperature lead-free solder [PDF]
, 2012 The development works on high temperature lead free solder are mostly discussed nowadays. To replace the current high temperature lead free solders it would be the great problem.
Muhamad Zam, Shahrul Fadzli
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Adaptive CUSUM Chart for Simultaneous Monitoring of Mean and Variance
Quality and Reliability Engineering International, EarlyView.ABSTRACT Simultaneously monitoring changes in both the mean and variance is a fundamental problem in statistical process control, and numerous methods have been developed to address it. However, many existing approaches face notable limitations: Some rely on tuning parameters that can significantly affect performance; others are biased toward detecting
Gokul Parakulum, Jun Li
wiley +1 more source
The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder. [PDF]
Materials (Basel), 2020 Li C, Li C, Yan Y, Gao T, Xu G.
europepmc +1 more source
Lead Free Solder Joint - Models for Reliability Prediction
, 2012 This bachelor's thesis deals with reliability prediction of lead-free solder joint. Background research of fatigue models for lead free solder joint.is described in theoretic part Basic terminology and lead free soldering technology operations are ...
Nestrojil, Michal
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Properties of Cerium Containing Lead Free Solder [PDF]
, 2012 : With increasing concerns of the intrinsic toxicity of lead (Pb) in electronics, a series of tin (Sn) based alloys involving silver (Ag) and copper (Cu) have been proposed as replacements for Pb-Sn solder and widely accepted by industry.
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