Results 141 to 150 of about 8,512 (299)
, 2006 The mechanical properties of thermally-aged and electric current-stressed eutectic lead (Sn-37Pb) and lead-free (Sn-3.5Ag) solder joints with electroless Ni-P metallization were investigated using tensile testing.
Zhong Chen +4 more
core +1 more source
Actuation Strategies for Underwater Jet‐Propelled Soft Robots
Journal of Field Robotics, EarlyView.ABSTRACT This review article examines jet‐propulsion mechanisms in underwater soft robotic systems, focusing exclusively on physically fabricated and experimentally validated robots. Covering research published from 2013 to 2025, this study classifies and evaluates jet‐propulsion robots based on their actuation mechanisms.
Angel Kitone +3 more
wiley +1 more source
Research of the reliability of lead-free solder joints
, 2011 This work deals research of the reliability of leed-free solder joints. It summarizes the basic knowledge of lead-free solder alloys, soldering and testing process, the soldered joints.
Pelc, Miroslav
core +1 more source
T‐800: An 800 Hz Data Glove for Precise Hand Gesture Tracking
SmartBot, EarlyView.Hand motion capture provides critical insights into human dexterity and facilitates advancements in robotic manipulation, yet existing systems are limited by a trade‐off between temporal resolution and visual occlusion. Here, the authors present T‐800, a high‐bandwidth data glove achieving synchronized full‐hand motion capturing at 800 Hz.
Haoyang Luo +7 more
wiley +1 more source
Lead-free soldering alloys: microstructure optimization for electronic applications
, 2009 As a result of environmental issues, manufacturing of lead-free electronics has become a global trend since July 1, 2006. Due to the considerable toxicity of lead leading to health and environmental concerns, new legislations have been imposed in its use.
Sergey Belyakov (1984501)
core
PBGA Reliability of Lead Free Solder Balls Assembled with Tin Lead Solder Paste for Harsh Environment Electronics [PDF]
, 2006 The demand for high-temperature electronics is growing rapidly in the automotive industry. This stems directly from the fact that these electronics are being transferred from their passive environments to under-the-hood locations, specifically on the ...
Mitchell, Charles
core
Small, EarlyView.This review examines four factors that drive interfacial instability in sulfide‐based anode‐free all‐solid‐state batteries and thoroughly reviews corresponding performance‐enhancing strategies. The strategies are organized as follows: (1) interlayer engineering, (2) pressure‐regulating buffer layers, (3) other methods, including sacrificial cathodes ...
Sion Kim, Jaechan Lee, Jihyun Jang
wiley +1 more source
Tin-based lead-free solder bumps for flip-chip application
, 2008 This paper reviews the processing of tin-based lead-free solder bump for flip-chip application. Some of the processes, electroplated, stencil printed, evaporated, injection moulded and solder spheres shall be highlighted, while the technology on ...
Husna Zayadi
core
steel research international, EarlyView.This study validates a recycling pathway for converting interconnect assemblies from end‐of‐life SOC stacks into commercial‐grade AISI 304 steels. Using scrap‐based steelmaking operations, austenitic cast steels with <4.0% δ‐ferrite are successfully produced.
Jeraldine Lastam +7 more
wiley +1 more source
steel research international, EarlyView.This work uses high‐temperature dilatometry to examine how the tramp elements Cu, Ni, and Sn affect the deformability of non‐metallic inclusions and matrix in quench‐and‐temper steel. Mg‐bearing inclusions deform less than Mg‐free ones. Copper lowers formability. Nickel increases deformability.
Julian Cejka +3 more
wiley +1 more source