Results 121 to 130 of about 8,512 (299)
Lead-free Solder Joint Reliability – State of the Art and Perspectives
, 2004 There is an increasing demand in replacing tin-lead (Sn/Pb) solders with lead-free solders in the electronics industry due to health and environmental concern. The European Union recently passed a law to ban the use of lead in electronic products.
Wang, Jyhwen +5 more
core +1 more source
Ag/Ag2S Nanoparticle‐Based In‐Materio Lightweight Cryptographic System for IoT Edge Security
Advanced Intelligent Systems, EarlyView.This work presents a nanomaterial‐based in materio encryption method that directly transforms analog signals through nonlinear Ag/Ag2S nanoparticle networks. By exploiting the inherently nonuniform characteristics that arise from random arrangement of nanoparticles as a unique security key, the approach produces highly complex encrypted waveforms ...
Hiroki Tabata +7 more
wiley +1 more source
Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components. [PDF]
Materials (Basel), 2021 Makrygianni M +7 more
europepmc +1 more source
The influences of dopants on lead free solder alloy
, 2017 Doping of solder alloys give interest because it’s favorably to modify the characteristics of solder in the molten and solid states. Many researchers have studied on the dopant additions on lead free solder alloys and results an enhancement in ...
Mhd Noor, Ervina Efzan +5 more
core +1 more source
Deep Underground Science and Engineering, EarlyView.This study demonstrates the feasibility of an underground closed‐loop thermal storage facility at a post‐mining site, intended for seasonal heat energy storage. Its principal design shows water flow directions in winter and summer (1, 2), heat pumps (3), an upper water reservoir (4), and connecting pipes (5).
Dmytro Rudakov, Oleksandr Inkin
wiley +1 more source
Epilepsia Open, EarlyView.Abstract Infantile epilepsy spasms syndrome (IESS), formerly known as infantile spasms or West Syndrome, is a severe epilepsy syndrome affecting about 3 in 10,000 newborns in the United States. Characterized by clusters of epileptic spasms, interictal hypsarrhythmia, and developmental delays, IESS has diverse causes, including structural‐metabolic ...
Kayla Vieira +5 more
wiley +1 more source
Non-destructive orientation mapping of die-attach lead-free solder
Applied Physics ExpressThermo-mechanical fatigue poses a serious challenge to the electrical operation of power semiconductor modules, manifested by the degradation of die-attach lead-free solder.
Yujiro Hayashi, Hidehiko Kimura
doaj +1 more source
Ultrasound‐Assisted Epoxy Resin Curing Monitored by Impedance Spectroscopy
Polymer Engineering &Science, EarlyView.Ultrasound enhances epoxy cure rates via localized heating without altering cure kinetics. Impedance spectroscopy provides a direct, non‐destructive measure of cure progression, enabling accurate mapping of degree of cure in real time. ABSTRACT Epoxy resins are widely used in aerospace and automotive manufacturing as structural adhesives and matrices ...
Daniel Csehngeri +2 more
wiley +1 more source
Variable Frequency Microwave Reflow of Lead-Free Solder Paste
, 2004 As the world moves towards eliminating lead from consumer products, the microelectronics industry has put effort into developing lead-free solder paste.
Reid, Pamela Patrice
core
Influence of bismuth on the solidification of tin copper lead-free solder alloy
, 2018 Lead-based solder alloy has been used for a long time as solder material in electronic industry. However, its usage in electronic industry has been restricted due to its toxicity to human health and negative impact on the environmental.
Ezaham, N. A. +5 more
core +1 more source